公开(公告)号：US07850056B2

公开(公告)日：2010-12-14

申请号：US12532741

申请日：2008-02-28

申请人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

发明人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

摘要翻译： 在与超声波振动器1的超声波振动的方向5平行的方向上，工具3的中心部3a的形状和工具3的端部3b的形状变化，使得横截面积 不同之处在于，与超声波振动方向5垂直的方向上的超声波幅度9基本相等。 通过这种方式，可以消除或减少在工具3的中心部分3a和工具3的端部3b之间的超声波振动的差异。

公开(公告)号：US20100065613A1

公开(公告)日：2010-03-18

申请号：US12532741

申请日：2008-02-28

申请人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

发明人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06 ,  B23K3/00

CPC分类号： H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

摘要翻译： 在与超声波振动器1的超声波振动的方向5平行的方向上，工具3的中心部3a的形状和工具3的端部3b的形状变化，使得横截面积 不同之处在于，与超声波振动方向5垂直的方向上的超声波幅度9基本相等。 通过这种方式，可以消除或减少在工具3的中心部分3a和工具3的端部3b之间的超声波振动的差异。

公开(公告)号：US07789284B2

公开(公告)日：2010-09-07

申请号：US12432930

申请日：2009-04-30

申请人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

发明人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： B23K20/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75355 ,  H01L2224/75702 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A1 and a surface A2 at the other end and the holding tool has a surface B1 in intimate contact with the surface A1 and a surface B2 in intimate contact with the surface A2.

摘要翻译： 提供了一种电子部件安装装置，包括：保持电子部件的部件保持器; 按压单元，其通过部件保持器对所保持的电子部件施加压力; 以及超声波换能器，其通过部件保持器对保持的电子部件施加超声波振动。 部件保持器包括一个喇叭，其一端安装有超声波换能器，一个保持工具通过使用螺栓固定在喇叭的另一端并保持电子部件。 喇叭的另一端具有表面A1和表面A2，并且保持工具具有与表面A1紧密接触的表面B1和与表面A2紧密接触的表面B2。

公开(公告)号：US07980444B2

公开(公告)日：2011-07-19

申请号：US11887740

申请日：2007-05-08

申请人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

发明人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H05K13/046 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/53174

摘要： An electronic component mounting apparatus includes an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, and the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even when the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.

摘要翻译： 一种电子部件安装装置，包括用于保持电子部件的电子部件安装头和用于将电子部件压靠电路板的上下装置，并且电子部件被压靠在电路板上，同时从超声波施加超声波振动 电子部件安装头的传感器经由部件保持单元到电子部件，使得电子部件安装到电路板上。 在电子部件安装装置中，电子部件通过来自固定到部件保持单元的加热器的非接触状态的辐射热经由部件保持部被加热，使得即使电热加热器可替换地安装，超声波振动的特性 施加到电子部件可以保持恒定。

公开(公告)号：US20090277951A1

公开(公告)日：2009-11-12

申请号：US12432930

申请日：2009-04-30

申请人： Hiroshi EBIHARA ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

发明人： Hiroshi EBIHARA ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

IPC分类号： B23K20/10

CPC分类号： B23K20/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75355 ,  H01L2224/75702 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A1 and a surface A2 at the other end and the holding tool has a surface B1 in intimate contact with the surface A1 and a surface B2 in intimate contact with the surface A2.

摘要翻译： 提供了一种电子部件安装装置，包括：保持电子部件的部件保持器; 按压单元，其通过部件保持器对所保持的电子部件施加压力; 以及超声波换能器，其通过部件保持器对保持的电子部件施加超声波振动。 部件保持器包括一个喇叭，其一端安装有超声波换能器，一个保持工具通过使用螺栓固定在喇叭的另一端并保持电子部件。 喇叭的另一端具有表面A1和表面A2，并且保持工具具有与表面A1紧密接触的表面B1和与表面A2紧密接触的表面B2。

公开(公告)号：US20090265924A1

公开(公告)日：2009-10-29

申请号：US11887740

申请日：2007-05-08

申请人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

发明人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

IPC分类号： B23P19/00

CPC分类号： H05K13/046 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/53174

摘要： In an electronic component mounting apparatus including an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even under the condition that the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.

摘要翻译： 在包括用于保持电子部件的电子部件安装头和用于将电子部件压靠在电路板上的上下装置的电子部件安装装置中，将电子部件压在电路板上，同时从超声波施加超声波振动 电子部件安装头的传感器经由部件保持单元到电子部件，使得电子部件安装到电路板上。 在电子部件安装装置中，电子部件通过来自固定到部件保持单元的加热器的辐射热通过部件保持单元以非接触状态被加热，使得即使在电热加热器可替换地安装的条件下， 施加到电子部件的超声波振动可以保持恒定。

公开(公告)号：US20050268457A1

公开(公告)日：2005-12-08

申请号：US11111935

申请日：2005-04-22

申请人： Hiroshi Ebihara ,  Ken Kobayashi ,  Hiroshi Nasu ,  Daido Komyoji

发明人： Hiroshi Ebihara ,  Ken Kobayashi ,  Hiroshi Nasu ,  Daido Komyoji

IPC分类号： H05K13/04 ,  B23P19/00 ,  H01L21/60 ,  H05K13/08

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/0409 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53196 ,  H01L2924/00

摘要： The electronic component mounting apparatus has a board holding part for holding a circuit board, a mounting mechanism for mounting an electronic component on the circuit board, and a grinding part for grinding a suction surface of a suction nozzle of the mounting mechanism. After mounting of the electronic components on the circuit board are repeated a predetermined number of times, the suction surface is ground. In the electronic component mounting apparatus, by continuously moving the suction nozzle in the Y-direction relative to the grinding part and moving the suction nozzle up and down, and bringing the suction surface of the suction nozzle in intermittent contact with the grinding surface of the grinding member with ultrasonic vibrations applied, the suction surface can be ground while preventing the occurrence of a large deformation of the suction nozzle.

摘要翻译： 电子部件安装装置具有用于保持电路板的板保持部，用于将电子部件安装在电路基板上的安装机构和用于研磨安装机构的吸嘴的吸引面的研磨部。 将电子部件安装在电路板上重复预定次数之后，将吸入面研磨。 在电子部件安装装置中，通过使吸嘴相对于研磨部在Y方向上连续移动，并且使吸嘴上下移动，使吸嘴的吸引表面与 通过施加超声波振动的研磨部件，能够吸引吸入面，同时防止吸嘴发生大的变形。

公开(公告)号：US07246430B2

公开(公告)日：2007-07-24

申请号：US10857940

申请日：2004-06-02

申请人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

发明人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

IPC分类号： B23P19/00

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/082 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  H01L2924/00

摘要： In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.

摘要翻译： 在电子部件安装装置中，通过负载传感器检测施加到电子部件的垂直负载和水平负载，所述负载传感器具有沿电子部件的安装方向设置在堆叠中的压电元件。 因此，可以减小负载传感器的水平方向的尺寸，并且能够在电子部件的安装位置附近检测施加于电子部件的负荷。 此外，通过将二维空间中的水平载荷的X方向和Y方向的负荷值作为坐标值的二维空间与二维空间中的公差范围进行比较，可以将安装失败 从水平载荷的偏差中检测。

公开(公告)号：US20050071991A1

公开(公告)日：2005-04-07

申请号：US10857940

申请日：2004-06-02

申请人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

发明人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

IPC分类号： B23Q15/00 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H05K13/04

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/082 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  H01L2924/00

摘要： In the electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that have piezoelectric elements provided in a stack in the mounting direction of the electronic component. Therefore, the size in the horizontal direction of the load sensor can be reduced, and the load applied to the electronic component can be detected at the neighborhood of the mounting position of the electronic component. Moreover, by comparing a position in a two-dimensional space in which the load values in the X-direction and the Y-direction of the horizontal load are served as coordinate values with a tolerance range in the two-dimensional space, mounting failure can be detected from a deviation in the horizontal loads.

摘要翻译： 在电子部件安装装置中，通过在电子部件的安装方向上设置有堆叠体的压电元件的负载传感器来检测施加到电子部件的垂直载荷和水平载荷。 因此，可以减小负载传感器的水平方向的尺寸，并且可以在电子部件的安装位置附近检测施加到电子部件的负荷。 此外，通过将二维空间中的X方向上的负载值和水平负载的Y方向之间的位置作为具有二维空间中的公差范围的坐标值进行比较，安装失败可以 从水平载荷的偏差中检测。

公开(公告)号：US20130219138A1

公开(公告)日：2013-08-22

申请号：US13496036

申请日：2012-02-16

申请人： Hiroshi Nasu ,  Toru Tanaka

发明人： Hiroshi Nasu ,  Toru Tanaka

IPC分类号： G06F12/16

CPC分类号： G06F3/0608 ,  G06F3/061 ,  G06F3/0646 ,  G06F3/0662 ,  G06F3/067 ,  G06F11/1451 ,  G06F2201/84

摘要： A snapshot volume is migrated by using a primary volume of a migration destination storage apparatus.The management server comprises a controller for generational management, by means of the snapshot volumes, of differential data for the logical volume which is the parent volume of the snapshot volume, and, if an instruction to copy a snapshot volume of a designated generation is received and a snapshot volume prior to the designated generation of the copy instruction-target snapshot volume exists, the controller copies the differential data between the designated-generation snapshot volume and the existing snapshot volume, and associates the copied differential data with the existing snapshot volume.

摘要翻译： 使用迁移目的地存储设备的主卷迁移快照卷。 管理服务器包括用于通过快照卷对作为快照卷的父卷的逻辑卷的差异数据进行代数管理的控制器，以及如果接收到复制指定代的快照卷的指令 并且存在指定生成复制指令目标快照卷之前的快照卷，控制器将复制指定代快照卷与现有快照卷之间的差异数据，并将复制的差异数据与现有快照卷相关联。