摘要:
In a memory cell array, data lines are formed into a hierarchical arrangement of sub data lines provided for every block and a main data line common to each block, and a sub data line selected by a column address among sub data lines belonging a block which are simultaneously selected by a row address is connected to a bit line. Accordingly, the sub data line length is reduced, which reduces floating capacitance, reading and writing operations can be conducted at a high speed, and sub data lines can be selectively operated. In addition, power required for charging the sub data lines can be reduced, and entire power consumption by the semiconductor memory device can be reduced as well.
摘要:
A semiconductor memory device includes a plurality of memory blocks, i main row or column select lines extending over the plurality of memory blocks, and a decoder for selecting one of the main row or column select lines in accordance with an applied address signal. The decoder includes i outputs. Each of the memory blocks includes a plurality of memory cells arranged in rows and columns and at least (i+1) sub row or column select lines each for selecting one row or one column of memory cells. A shift redundancy circuit is provided for each of the memory blocks, for connecting the main row or column select line and the sub row or column select line. The shift redundancy circuit includes a switch circuit for connecting one main row or column select line to one of the plurality of adjacent sub row or column select lines, and a circuit for setting a connection path of the switch circuit. The shift redundancy circuit connects successively adjacent sub row or column select lines to main row or column select lines in one to one correspondence except a defective sub row or column select line associated with a defective bit.
摘要:
A semiconductor device having amplifying circuits provided near corresponding bonding pads receiving external signals, and positioned between the bonding pads and internal circuits to which such external signals are to be applied. The device includes a control signal generating circuit for the amplifying circuits which is not provided in conventional semiconductor devices. In response to external control signals, the control signal generating circuit generates internal control signals for controlling electric paths between a power supply and ground in the amplifying circuits. During the standby period of the semiconductor device, the paths between the power supply and ground are cut regardless of the potential of the corresponding bonding pads, preventing flow of a through current.
摘要:
Column repairing circuits 7a, 7b for repairing a DRAM in which there are defective memory cells in two columns are disclosed. The connection state of switching elements or circuits 51-5n, 61-6n, 71-7 (n+1), 81-8 (n+1) is determined as illustrated by appropriately disconnecting fuses in fuse links provided respectively in circuits 7a, 7b. Accordingly, column selecting lines Y2a and Y (n+1) b in memory array blocks 891a, 891b are not activated. The two repairing circuits 7a, 7b are provided spaced apart from each other on a semiconductor substrate, so that excessive concentration of fuse elements and switching elements or circuits is prevented.
摘要:
A plurality of sub chips are formed on a chip. An input/output buffer region is arranged around the plurality of sub chips. Each sub chip includes a sub chip control circuit region and a plurality of memory cell array blocks. Each memory cell array block includes a memory cell array region, a row decoder and control circuit region, a sense amplifier region and an input/output latch region.
摘要:
A semiconductor memory device includes a memory array. The bit line pairs of the odd number order in the memory array belong to a first group, and the bit line pairs of the even number order belong to a second group. A first amplifier is connected to each bit line pair. Corresponding to the first group, write buses read buses and a read/test circuit are provided. Corresponding to the second group, write buses read buses and a read/test circuit are provided. A column decoder selects a plurality of bit line pairs simultaneously at the time of testing. At the time of testing, each of the read/test circuits compares data read out from the plurality of bit line pairs belonging to the corresponding group with a given expected data for providing the comparison result.
摘要:
Read data supplied from one of a plurality of differential amplifier circuits is transmitted to a read data bus driver circuit via one of a plurality of CMOS transfer gates and a data latch circuit. The potential of read data bus pair is forcedly set to a low level in response to a control signal until the read data is transmitted to the read data bus driver circuit. Thereafter, the read data bus driver circuit drives the read data bus pair in accordance with the transmitted read data. Thereby, a speed of the address access operation can be increased without outputting invalid data.
摘要:
In a general read out operation, data read out from a memory cell array is amplified by a preamplifier group. The amplified data is provided to a selector unit. The selector unit responds to a bit organization select signal to select data according to a predetermined bit configuration. The selected data is provided to a data bus. In a test mode, the selector unit responds to a test mode signal to provide a test result to a data bus corresponding to a predetermined bit organization. Therefore, only the required data bus is used according to the bit organization and the test mode.
摘要:
When an external RAS and external CAS are input to a RAS buffer and a CAS buffer, an internal RAS and an internal CAS are generated. The internal RAS is input to a clock generating circuit and a CBR mode determination circuit and the internal CAS is input to the CBR mode determination circuit. The clock generating circuit outputs a pump clock to first and second WL pumps upon input of internal RAS, and the first WL pump supplies charge to a Vpp power supply. If CAS is input prior to RAS during refresh operation, CBR mode determination circuit inputs a CBR mode signal to the second WL pump which supplies charge to Vpp power supply together with the first WL pump when the pump clock and the CBR mode signal is input thereto.
摘要翻译:当外部+ E,ovs RAS + EE和外部+ E,ovs CAS + EE输入到RAS缓冲区,CAS缓冲区,内部+ E,ovs RAS + EE和内部+ E,ovs CAS + EE 生成。 内部+ E,ovs RAS + EE输入到时钟发生电路和CBR模式确定电路,内部+ E,ovs CAS + EE输入到CBR模式确定电路。 时钟发生电路在内部+ E,RAS + EE输入时向第一和第二WL泵输出泵时钟,第一WL泵为Vpp电源供电。 如果+ E,则在+ E之前输入ovs CAS + EE,在刷新操作期间输入ovs RAS + EE,CBR模式确定电路将CBR模式信号输入到与第一WL泵一起向Vpp电源提供电荷的第二WL泵 当泵时钟和CBR模式信号被输入时。
摘要:
When an external RAS and external CAS are input to a RAS buffer and a CAS buffer, an internal RAS and an internal CAS are generated. The internal RAS is input to a clock generating circuit and a CBR mode determination circuit and the internal CAS is input to the CBR mode determination circuit. The clock generating circuit outputs a pump clock to first and second WL pumps upon input of internal RAS, and the first WL pump supplies charge to a Vpp power supply. If CAS is input prior to RAS during refresh operation, CBR mode determination circuit inputs a CBR mode signal to the second WL pump which supplies charge to Vpp power supply together with the first WL pump when the pump clock and the CBR mode signal is input thereto.
摘要翻译:当外部+ E,ovs RAS + EE和外部+ E,ovs CAS + EE输入到RAS缓冲区,CAS缓冲区,内部+ E,ovs RAS + EE和内部+ E,ovs CAS + EE 生成。 内部+ E,ovs RAS + EE输入到时钟发生电路和CBR模式确定电路,内部+ E,ovs CAS + EE输入到CBR模式确定电路。 时钟发生电路在内部+ E,RAS + EE输入时向第一和第二WL泵输出泵时钟,第一WL泵为Vpp电源供电。 如果+ E,则在+ E之前输入ovs CAS + EE,在刷新操作期间输入ovs RAS + EE,CBR模式确定电路将CBR模式信号输入到与第一WL泵一起向Vpp电源提供电荷的第二WL泵 当泵时钟和CBR模式信号被输入时。