摘要:
A beverage maker including an extract liquid receptacle for accumulating therein extract liquid which is extracted by a beverage extractor, and a cooling liquid reservoir for accommodating therein cooling liquid that contacts the extract liquid with the wall of the extract liquid receptacle in between; and the beverage maker further including a stirring vane for stirring the extract liquid inside the extract liquid receptacle, and a vane drive unit for driving the stirring vane.
摘要:
A beverage maker including: a scatter 70 and an ice beverage extraction funnel 50 that are selectively held in a main body unit 10 in a rotatable manner; a hot beverage extraction funnel 76 held in the main body unit 10 in the hot beverage extraction mode for receiving hot water dripped by the scatter 70; a cooling liquid reservoir 52B held in the main body unit 10 in the ice beverage extraction mode for cooling an extract liquid collector unit 52A that receives hot extract liquid from the ice beverage extraction funnel 50 and for cooling the extract liquid; and rotatable stirring members 50A and 50B extending into at least one or other of the extract liquid collector unit 52A and cooling liquid reservoir 52B.
摘要:
A beverage maker including an extract liquid receptacle 52A for storing therein extract liquid extracted by beverage extraction means 50, and a cooling reservoir 52B for accommodating therein cooling liquid that contact the extract liquid with the walls of that extract liquid receptacle 52A in between, so that the extract liquid is cooled by the cooling reservoir 52B; wherein the extract liquid receptacle 52A and cooling reservoir 52B are integrated to form a cooling unit 52, a cooling material is sealed in the cooling reservoir 52B, so that the entire cooling unit 52 is cooled.
摘要:
A beverage maker including a scatter 70, which is rotated relative to a beverage extraction funnel 76 about a vertical rotational center axis line above the beverage extraction funnel 76 and thus conduct hot water flowing out from a hot water pour-out port, and a rotational drive unit 22, which is for rotationally driving at least one or other of the scatter 70 and the beverage extraction funnel 76; and the scatter 70 has bottom surfaces 72 and 74 which vary in depth, and drip holes 72A and 74A are formed, in the bottom surfaces 72 and 74, at positions of differing depths and differing distances from the rotational center axis line.
摘要:
According to one embodiment, a supercritical drying method for a semiconductor substrate, comprises introducing the semiconductor substrate into a chamber in a state, a surface of the semiconductor substrate being wet with alcohol, substituting the alcohol on the semiconductor substrate with a supercritical fluid of carbon dioxide by impregnating the semiconductor substrate to the supercritical fluid in the chamber, and discharging the supercritical fluid and the alcohol from the chamber and reducing a pressure inside the chamber. The method further comprises performing a baking treatment by supplying an oxygen gas or an ozone gas to the chamber after the reduction of the pressure inside the chamber.
摘要:
A substrate (W) is processed with the use of a process liquid such as a deionized water. Then, a first fluid which is more volatile than the process liquid is supplied to an upper surface of the substrate (W) from a fluid nozzle (12) to form a liquid film. Next, a second fluid which is more volatile than the process liquid is supplied to the upper surface of the substrate (W) from the fluid nozzle (12), while the wafer (W) is being rotated. During this supply operation, a supply position (Sf) of the second fluid to the substrate (W) is moved radially outward from a rotational center (Po) of the substrate (W). As a result, it is possible to prevent the generation of particles on the substrate (W) after it is dried by using the first and second fluids.
摘要:
In a substrate cleaning method and a substrate cleaning method according to the present invention, a brush 3 is brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brush 3 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzle 5 onto the substrate W, and a cleaning position Sn of the two-fluid nozzle 5 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brush 3 from the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center P0 than the cleaning position Sb of the brush 3. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.
摘要:
A processing apparatus essentially includes a rotatable rotor 21 for carrying semiconductor wafers W, a motor 22 for driving to rotate the rotor 21, a plurality of processing chambers for surrounding the wafers W carried by the rotor 21, for example, an inner chamber 23 and an outer chamber 24, a chemical supplying unit 50, an IPA supplying unit 60, a rinse supplying unit 70 and a drying fluid supplying unit 80. With this constitution of the apparatus, it is possible to prevent the wafers from being contaminated due to the reaction of treatment liquids of different kinds, with the improvement of processing efficiency and miniaturization of the apparatus.
摘要:
The present invention comprises the steps of performing a reforming process on a surface of a low dielectric constant insulation film formed on a substrate which includes one of a porous low dielectric constant insulation film and a non-porous low dielectric constant insulation film and forming an insulation film as at least one of an etching mask and a Chemical Mechanical Polishing stopper (CMP stopper) on the reformed surface of the low dielectric constant insulation film. For example, plasma is radiated as a reforming process mentioned above, the surface roughness of a low dielectric insulation film is increased and, as a result, adhesion between the films and also between the inter-layer insulation film and other neighboring films can be improved with so-called “anchor effect”.
摘要:
A substrate processing apparatus includes a chamber, and a cleaning-liquid supply unit that supplies a cleaning liquid containing hydrofluoro ether onto a substrate to be processed placed in the chamber. In the chamber, there is further disposed a gas supply unit that supplies into the chamber a gas for preventing moisture from being adhered to a substrate to be processed, when a cleaning liquid containing hydrofluoro ether is supplied onto the substrate to be processed.