公开(公告)号：US08367152B2

公开(公告)日：2013-02-05

申请号：US12054954

申请日：2008-03-25

申请人： Kohei Yokoyama ,  Hisao Ikeda ,  Yosuke Sato ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata

发明人： Kohei Yokoyama ,  Hisao Ikeda ,  Yosuke Sato ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata

IPC分类号： B05D5/12

CPC分类号： H01L51/0011 ,  H01L51/0003 ,  H01L51/0013 ,  H01L51/56

摘要： For a full-color flat panel display, demands for high definition, high aperture ratio and high reliability have been increasing. Therefore, increasing in the number of pixels and narrowing a pixel pitch have been major issues. According to the present invention, a layer including an organic compound is selectively formed with a light-exposure apparatus used in a photolithography technique without a resist mask. A material layer including a photopolymerization initiator, a material polymerized with the photopolymerization initiator, and an organic compound are formed on a plate, and then are exposed to light and selectively cured. A film-formation substrate is disposed so as to face the plate. The film-formation substrate or the material layer is heated so that the organic compound included in a region exposed to light or a region not exposed to light is evaporated to be selectively deposited on the surface of the film-formation substrate.

摘要翻译： 对于全彩平板显示器，高清晰度，高开口率和高可靠性的要求越来越高。 因此，增加像素数量和缩小像素间距是主要问题。 根据本发明，使用不具有抗蚀剂掩模的光刻技术中使用的曝光装置选择性地形成包含有机化合物的层。 在板上形成包含光聚合引发剂，与光聚合引发剂聚合的材料和有机化合物的材料层，然后曝光并选择性固化。 成膜基板被设置成面对板。 加热成膜基板或材料层，使得暴露于光的区域中包含的有机化合物或不暴露于光的区域被蒸发以选择性地沉积在成膜基板的表面上。

公开(公告)号：US08734914B2

公开(公告)日：2014-05-27

申请号：US13399122

申请日：2012-02-17

申请人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

发明人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

IPC分类号： C23C14/12 ,  C23C14/00 ,  C23C14/24 ,  C23C14/26 ,  C23C14/04 ,  C23C16/448

CPC分类号： C23C14/12 ,  B05D2401/30 ,  C23C14/00 ,  C23C14/042 ,  C23C14/24 ,  C23C14/26 ,  C23C16/4485 ,  H01L51/001 ,  H01L51/0038 ,  H01L51/0042 ,  H01L51/0059 ,  H01L51/006 ,  H05B33/10

摘要： A binder material layer including an evaporation material is formed over a main surface of an evaporation source substrate, a substrate on which a film is formed is placed so that the binder material layer and a main surface thereof face each other, and heat treatment is performed on a rear surface of the evaporation source substrate so that the evaporation material in the binder material layer is heated to be subjected to sublimation or the like, whereby a layer of the evaporation material is formed on the substrate on which a film is formed. When a low molecular material is used for the evaporation material and a high molecular material is used for the binder material, the viscosity can be easily adjusted, and thus, film formation is possible with higher throughput than conventional film formation.

摘要翻译： 在蒸发源基板的主表面上形成包括蒸发材料的粘合剂材料层，其上形成有膜的基板以使粘合剂材料层及其主表面彼此面对，进行热处理 在蒸发源基板的后表面上，使粘合剂材料层中的蒸发材料被加热以进行升华等，从而在其上形成有膜的基板上形成蒸镀材料层。 当将低分子材料用于蒸发材料并且高分子材料用于粘合剂材料时，可以容易地调节粘度，因此成膜可能比常规成膜更高的生产量。

公开(公告)号：US20120148730A1

公开(公告)日：2012-06-14

申请号：US13399122

申请日：2012-02-17

申请人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

发明人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

IPC分类号： B05D5/12

CPC分类号： C23C14/12 ,  B05D2401/30 ,  C23C14/00 ,  C23C14/042 ,  C23C14/24 ,  C23C14/26 ,  C23C16/4485 ,  H01L51/001 ,  H01L51/0038 ,  H01L51/0042 ,  H01L51/0059 ,  H01L51/006 ,  H05B33/10

摘要： A binder material layer including an evaporation material is formed over a main surface of an evaporation source substrate, a substrate on which a film is formed is placed so that the binder material layer and a main surface thereof face each other, and heat treatment is performed on a rear surface of the evaporation source substrate so that the evaporation material in the binder material layer is heated to be subjected to sublimation or the like, whereby a layer of the evaporation material is formed on the substrate on which a film is formed. When a low molecular material is used for the evaporation material and a high molecular material is used for the binder material, the viscosity can be easily adjusted, and thus, film formation is possible with higher throughput than conventional film formation.

摘要翻译： 在蒸发源基板的主表面上形成包括蒸发材料的粘合剂材料层，其上形成有膜的基板以使粘合剂材料层及其主表面彼此面对，进行热处理 在蒸发源基板的后表面上，使粘合剂材料层中的蒸发材料被加热以进行升华等，从而在其上形成有膜的基板上形成蒸镀材料层。 当将低分子材料用于蒸发材料并且高分子材料用于粘合剂材料时，可以容易地调节粘度，因此成膜可能比常规成膜更高的生产量。

公开(公告)号：US20080268137A1

公开(公告)日：2008-10-30

申请号：US12055970

申请日：2008-03-26

申请人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

发明人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

IPC分类号： B05D5/12 ,  C23C14/34

CPC分类号： C23C14/12 ,  B05D2401/30 ,  C23C14/00 ,  C23C14/042 ,  C23C14/24 ,  C23C14/26 ,  C23C16/4485 ,  H01L51/001 ,  H01L51/0038 ,  H01L51/0042 ,  H01L51/0059 ,  H01L51/006 ,  H05B33/10

摘要： A binder material layer including an evaporation material is formed over a main surface of an evaporation source substrate, a substrate on which a film is formed is placed so that the binder material layer and a main surface thereof face each other, and heat treatment is performed on a rear surface of the evaporation source substrate so that the evaporation material in the binder material layer is heated to be subjected to sublimation or the like, whereby a layer of the evaporation material is formed on the substrate on which a film is formed. When a low molecular material is used for the evaporation material and a high molecular material is used for the binder material, the viscosity can be easily adjusted, and thus, film formation is possible with higher throughput than conventional film formation.

摘要翻译： 在蒸发源基板的主表面上形成包括蒸发材料的粘合剂材料层，其上形成有膜的基板以使粘合剂材料层及其主表面彼此面对，进行热处理 在蒸发源基板的后表面上，使粘合剂材料层中的蒸发材料被加热以进行升华等，从而在其上形成有膜的基板上形成蒸镀材料层。 当将低分子材料用于蒸发材料并且高分子材料用于粘合剂材料时，可以容易地调节粘度，因此成膜可能比常规成膜更高的生产量。

公开(公告)号：US20080260938A1

公开(公告)日：2008-10-23

申请号：US11949217

申请日：2007-12-03

申请人： Hisao Ikeda ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata ,  Shunpei Yamazaki

发明人： Hisao Ikeda ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata ,  Shunpei Yamazaki

IPC分类号： B05D5/06 ,  B05C11/00 ,  B05C13/02

CPC分类号： B05C11/00 ,  C23C14/042 ,  C23C14/12 ,  C23C14/26 ,  C23C14/28 ,  C23C14/568 ,  H01L51/0081 ,  H01L51/56

摘要： An object is to improve use efficiency of an evaporation material, to reduce manufacturing cost of a light-emitting device, and to reduce manufacturing time needed for a light-emitting device including a layer containing an organic compound. The pressure of a film formation chamber is reduced, a plate is rapidly heated by heat conduction or heat radiation by using a heat source, a material layer on a plate is vaporized in a short time to be evaporated to a substrate on which the material layer is to be formed (formation substrate), and then the material layer is formed on the formation substrate. The area of the plate that is heated rapidly is set to have the same size as the formation substrate and film formation on the formation substrate is completed by one application of heat.

摘要翻译： 本发明的目的在于提高蒸发材料的使用效率，降低发光元件的制造成本，减少含有有机化合物的层的发光元件所需的制造时间。 成膜室的压力减小，通过使用热源的热传导或热辐射快速加热板，在短时间内蒸发板上的材料层以蒸发到其上的材料层 （形成衬底），然后在形成衬底上形成材料层。 将快速加热的板的面积设定为与形成基板相同的尺寸，并且通过一次加热完成在形成基板上的成膜。

公开(公告)号：US20080268135A1

公开(公告)日：2008-10-30

申请号：US12054954

申请日：2008-03-25

申请人： Kohei Yokoyama ,  Hisao Ikeda ,  Yosuke Sato ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata

发明人： Kohei Yokoyama ,  Hisao Ikeda ,  Yosuke Sato ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata

IPC分类号： B05D5/12

CPC分类号： H01L51/0011 ,  H01L51/0003 ,  H01L51/0013 ,  H01L51/56

摘要： For a full-color flat panel display, demands for high definition, high aperture ratio and high reliability have been increasing. Therefore, increasing in the number of pixels and narrowing a pixel pitch have been major issues. According to the present invention, a layer including an organic compound is selectively formed with a light-exposure apparatus used in a photolithography technique without a resist mask. A material layer including a photopolymerization initiator, a material polymerized with the photopolymerization initiator, and an organic compound are formed on a plate, and then are exposed to light and selectively cured. A film-formation substrate is disposed so as to face the plate. The film-formation substrate or the material layer is heated so that the organic compound included in a region exposed to light or a region not exposed to light is evaporated to be selectively deposited on the surface of the film-formation substrate.

摘要翻译： 对于全彩平板显示器，高清晰度，高开口率和高可靠性的要求越来越高。 因此，增加像素数量和缩小像素间距是主要问题。 根据本发明，使用不具有抗蚀剂掩模的光刻技术中使用的曝光装置选择性地形成包含有机化合物的层。 在板上形成包含光聚合引发剂，与光聚合引发剂聚合的材料和有机化合物的材料层，然后曝光并选择性固化。 成膜基板被设置成面对板。 加热成膜基板或材料层，使得暴露于光的区域中包含的有机化合物或不暴露于光的区域被蒸发以选择性地沉积在成膜基板的表面上。

公开(公告)号：US08313603B2

公开(公告)日：2012-11-20

申请号：US11949217

申请日：2007-12-03

申请人： Hisao Ikeda ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata ,  Shunpei Yamazaki

发明人： Hisao Ikeda ,  Tomoya Aoyama ,  Takahiro Ibe ,  Yoshiharu Hirakata ,  Shunpei Yamazaki

IPC分类号： C23C14/04 ,  C23C14/08

CPC分类号： B05C11/00 ,  C23C14/042 ,  C23C14/12 ,  C23C14/26 ,  C23C14/28 ,  C23C14/568 ,  H01L51/0081 ,  H01L51/56

摘要： An object is to improve use efficiency of an evaporation material, to reduce manufacturing cost of a light-emitting device, and to reduce manufacturing time needed for a light-emitting device including a layer containing an organic compound. The pressure of a film formation chamber is reduced, a plate is rapidly heated by heat conduction or heat radiation by using a heat source, a material layer on a plate is vaporized in a short time to be evaporated to a substrate on which the material layer is to be formed (formation substrate), and then the material layer is formed on the formation substrate. The area of the plate that is heated rapidly is set to have the same size as the formation substrate and film formation on the formation substrate is completed by one application of heat.

摘要翻译： 本发明的目的在于提高蒸发材料的使用效率，降低发光元件的制造成本，减少含有有机化合物的层的发光元件所需的制造时间。 成膜室的压力减小，通过使用热源的热传导或热辐射快速加热板，在短时间内蒸发板上的材料层以蒸发到其上的材料层 （形成衬底），然后在形成衬底上形成材料层。 将快速加热的板的面积设定为与形成基板相同的尺寸，并且通过一次加热完成在形成基板上的成膜。

公开(公告)号：US08119204B2

公开(公告)日：2012-02-21

申请号：US12055970

申请日：2008-03-26

申请人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

发明人： Hisao Ikeda ,  Takahiro Ibe ,  Tomoya Aoyama

IPC分类号： B05D3/02

CPC分类号： C23C14/12 ,  B05D2401/30 ,  C23C14/00 ,  C23C14/042 ,  C23C14/24 ,  C23C14/26 ,  C23C16/4485 ,  H01L51/001 ,  H01L51/0038 ,  H01L51/0042 ,  H01L51/0059 ,  H01L51/006 ,  H05B33/10

摘要： A binder material layer including an evaporation material is formed over a main surface of an evaporation source substrate, a substrate on which a film is formed is placed so that the binder material layer and a main surface thereof face each other, and heat treatment is performed on a rear surface of the evaporation source substrate so that the evaporation material in the binder material layer is heated to be subjected to sublimation or the like, whereby a layer of the evaporation material is formed on the substrate on which a film is formed. When a low molecular material is used for the evaporation material and a high molecular material is used for the binder material, the viscosity can be easily adjusted, and thus, film formation is possible with higher throughput than conventional film formation.

摘要翻译： 在蒸发源基板的主表面上形成包括蒸发材料的粘合剂材料层，其上形成有膜的基板以使粘合剂材料层及其主表面彼此面对，进行热处理 在蒸发源基板的后表面上，使粘合剂材料层中的蒸发材料被加热以进行升华等，从而在其上形成有膜的基板上形成蒸镀材料层。 当将低分子材料用于蒸发材料并且高分子材料用于粘合剂材料时，可以容易地调节粘度，因此成膜可能比常规成膜更高的生产量。

公开(公告)号：US08900675B2

公开(公告)日：2014-12-02

申请号：US13635227

申请日：2011-02-28

申请人： Takahiro Ibe ,  Tomoya Aoyama ,  Rena Tsuruoka ,  Satoshi Inoue ,  Tohru Sonoda

发明人： Takahiro Ibe ,  Tomoya Aoyama ,  Rena Tsuruoka ,  Satoshi Inoue ,  Tohru Sonoda

IPC分类号： B05D3/06 ,  H01L51/56 ,  C23C14/12 ,  C23C14/28 ,  H05B33/10 ,  H01L51/00 ,  C23C14/56 ,  H01L51/50

CPC分类号： H05B33/10 ,  C23C14/048 ,  C23C14/12 ,  C23C14/28 ,  C23C14/564 ,  H01L51/0027 ,  H01L51/5012 ,  H01L51/56

摘要： One embodiment of the present invention is a deposition method for forming a layer 13a containing a deposition material on a deposition target surface of a second substrate, comprising the steps of forming an absorbing layer 12 over one surface of a first substrate 11; forming a material layer 13 containing the deposition material over the absorbing layer; performing first heat treatment on the material layer from the other surface of the first substrate to a temperature lower than the sublimation temperature of the deposition material so as to remove an impurity 14 in the material layer 13; disposing the one surface of the first substrate and the deposition target surface of the second substrate to face each other; and performing second heat treatment on the material layer from the other surface of the first substrate.

摘要翻译： 本发明的一个实施方案是用于在第二基底的沉积靶表面上形成含有沉积材料的层13a的沉积方法，包括以下步骤：在第一基底11的一个表面上形成吸收层12; 在吸收层上形成含有沉积材料的材料层13; 在所述材料层上从所述第一基板的另一表面进行第一热处理至低于所述沉积材料的升华温度的温度，以除去所述材料层13中的杂质14; 将第一基板的一个表面和第二基板的沉积目标表面布置成彼此面对; 以及从所述第一基板的另一表面对所述材料层进行第二热处理。

公开(公告)号：US20130005121A1

公开(公告)日：2013-01-03

申请号：US13635227

申请日：2011-02-28

申请人： Takahiro Ibe ,  Tomoya Aoyama ,  Rena Sturuoka ,  Satoshi Inoue ,  Tohru Sonoda

发明人： Takahiro Ibe ,  Tomoya Aoyama ,  Rena Sturuoka ,  Satoshi Inoue ,  Tohru Sonoda

IPC分类号： H01L21/20

CPC分类号： H05B33/10 ,  C23C14/048 ,  C23C14/12 ,  C23C14/28 ,  C23C14/564 ,  H01L51/0027 ,  H01L51/5012 ,  H01L51/56

摘要： One embodiment of the present invention is a deposition method for forming a layer 13a containing a deposition material on a deposition target surface of a second substrate, comprising the steps of forming an absorbing layer 12 over one surface of a first substrate 11; forming a material layer 13 containing the deposition material over the absorbing layer; performing first heat treatment on the material layer from the other surface of the first substrate to a temperature lower than the sublimation temperature of the deposition material so as to remove an impurity 14 in the material layer 13; disposing the one surface of the first substrate and the deposition target surface of the second substrate to face each other; and performing second heat treatment on the material layer from the other surface of the first substrate.

摘要翻译： 本发明的一个实施方案是用于在第二基底的沉积靶表面上形成含有沉积材料的层13a的沉积方法，包括以下步骤：在第一基底11的一个表面上形成吸收层12; 在吸收层上形成含有沉积材料的材料层13; 在所述材料层上从所述第一基板的另一表面进行第一热处理至低于所述沉积材料的升华温度的温度，以除去所述材料层13中的杂质14; 将第一基板的一个表面和第二基板的沉积目标表面布置成彼此面对; 以及从所述第一基板的另一表面对所述材料层进行第二热处理。