公开(公告)号：US20030097750A1

公开(公告)日：2003-05-29

申请号：US10078448

申请日：2002-02-21

Applicant: Hitachi, Ltd.

Inventor： Hiroshi Okabe ,  Hirozi Yamada ,  Eriko Takeda ,  Kazunori Yamamoto ,  Hiroyuki Kuriya ,  Masanori Yamaguchi ,  Kazuhisa Otsuka ,  Yoshitaka Hirata ,  Yasushi Shimada

IPC: H05K003/20

CPC classification number: H01L21/4857 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/162 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/0338 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a manufacturing method of an electronic circuit device including a multi-layer circuit board incorporated with a thin film capacitor small in size and of high performance capable of attaining higher capacitance value with a thin dielectric film of high dielectric constant and with favorable film quality. A first electrode layer and a thin film dielectric layer are laminated continuously in this order in one identical to laminate each of the layers on a leveled substrate in one identical chamber and then the first electrode layer is fabricated a conductor pattern.

Abstract translation: 本发明提供一种电子电路器件的制造方法，该电子电路器件包括多层电路板，该多层电路板结合有小型和高性能的薄膜电容器，能够用高介电常数的薄电介质膜获得较高的电容值 电影质量。 将第一电极层和薄膜电介质层依次层叠在一个相同的层中，在一个相同的室中的层叠基板上层叠，然后将第一电极层制成导体图案。