公开(公告)号：US20230377185A1

公开(公告)日：2023-11-23

申请号：US17641256

申请日：2021-02-10

Applicant: Hitachi High-Tech Corporation

Inventor： Hyakka Nakada ,  Takeshi Ohmori ,  Naoto Takano

IPC: G06T7/60 ,  G06T7/13 ,  G06T17/00 ,  G06T7/00

CPC classification number: G06T7/60 ,  G06T7/13 ,  G06T17/00 ,  G06T7/001 ,  G06T2207/30148 ,  G06T2207/20081

Abstract: High-accuracy dimension extraction for a complicated shape possibly appearing through semiconductor processing. A starting point and an endpoint are placed on the periphery of a graphic shape including a combination of multiple ellipses, and a curve unicursally drawn on the periphery between the two points is used as a shape mode, thereby describing a contour of an intended structure.

公开(公告)号：US20230114432A1

公开(公告)日：2023-04-13

申请号：US17432062

申请日：2020-06-22

Applicant: Hitachi High-Tech Corporation

Inventor： Pushe Zhao ,  Takeshi Ohmori ,  Yutaka Okuyama

IPC: G01B11/24 ,  G01B11/02 ,  G06T7/00 ,  G06T7/507 ,  H01L21/66

Abstract: A dimension measurement apparatus that automatically corrects a deviation of a contour without operator determination. The dimension measurement apparatus includes: a model learning unit that obtains a learning cross-sectional image and learning labels attached to different regions of the learning cross-sectional image and generates a deep learning model for image region division using the learning cross-sectional image and the learning labels; a model estimation unit that applies the model to a newly input target image and labels each independent region; a contour correction unit that detects a contour of each region using the target image and the labels, sets a representative point on the contour of the region, moves each representative point according to a movement rule, and repeats movement of the representative point until contour correction is that measures a dimension of a device complete; and a dimension measurement unit cross-sectional structure using the corrected contour.

公开(公告)号：US11189470B2

公开(公告)日：2021-11-30

申请号：US16287679

申请日：2019-02-27

Applicant: HITACHI HIGH-TECH CORPORATION

Inventor： Takeshi Ohmori ,  Hyakka Nakada ,  Naoyuki Kofuji ,  Masayoshi Ishikawa ,  Masaru Kurihara

IPC: G05B19/4155 ,  H01J37/32 ,  G06N5/02 ,  H01L21/67

Abstract: The efficiency of operation in a semiconductor processing apparatus is improved. In order to search an input parameter value to be set in a semiconductor processing apparatus for processing into a target processed shape, a predictive model indicating a relationship between an input parameter value and an output parameter value is generated based on the input parameter value and the output parameter value which is a measured value of a processing result processed by setting the input parameter value in the semiconductor processing apparatus. In this case, when the measured value of the processing result processed by the semiconductor processing apparatus is the defective data, the predictive model is generated based on the input parameter value causing defective data and defective substitute data obtained by substituting the measured value which is the defective data.

公开(公告)号：US12222690B2

公开(公告)日：2025-02-11

申请号：US17370131

申请日：2021-07-08

Applicant: Hitachi High-Tech Corporation

Inventor： Takashi Dobashi ,  Hiroyuki Kobayashi ,  Takeshi Ohmori

IPC: G05B13/04 ,  G06N20/00 ,  G06T7/00 ,  H01L21/3065 ,  H01L21/66 ,  H01L21/67

Abstract: To facilitate evaluation of a predicted process shape in process recipe development using machine learning, a process recipe search apparatus that searches for an etching recipe that is a parameter of a plasma processing apparatus set so as to etch a sample into a desired shape displays, on a display device, the predicted process shape of the sample by a candidate etching recipe predicted by using a machine leaning model, by highlighting a difference between the predicted process shape and a target shape.

公开(公告)号：US20240054385A1

公开(公告)日：2024-02-15

申请号：US17641214

申请日：2021-03-01

Applicant: Hitachi High-Tech Corporation

Inventor： Yuyao Wang ,  Yasuhide Mori ,  Masashi Egi ,  Takeshi Ohmori ,  Satoshi Sakai ,  Kohei Matsuda

IPC: G06N20/00

CPC classification number: G06N20/00

Abstract: For a machine learning model that receives control parameters of a semiconductor processing device and outputs shape parameters that express a processed shape of a semiconductor sample processed by the semiconductor processing device, an experiment point obtaining learning data is recommended. A contribution of each control parameter to the prediction of the machine learning model is evaluated from feature quantity data that is a value of a control parameter of the learning data used for learning of the machine learning model, and the experiment point is recommended based on a stability evaluation and an uncertainty evaluation of the prediction by the machine learning model in a space defined by the control parameters selected based on the contribution as axes.

公开(公告)号：US11907235B2

公开(公告)日：2024-02-20

申请号：US17241826

申请日：2021-04-27

Applicant: Hitachi High-Tech Corporation

Inventor： Yutaka Okuyama ,  Takeshi Ohmori ,  Masaru Kurihara ,  Hyakka Nakada

IPC: H01L21/67 ,  G06N5/04 ,  G06N20/00 ,  G05B13/04 ,  G05B13/02 ,  G06F16/2458 ,  H01J37/32 ,  G06N3/08

CPC classification number: G06F16/2462 ,  G05B13/04 ,  G05B13/042 ,  G05B13/048 ,  G06N5/04 ,  G06N20/00 ,  H01J37/3211 ,  H01L21/67276 ,  G05B13/02 ,  G06N3/08 ,  H01J2237/327 ,  H01J2237/334

Abstract: A model learning unit learns a prediction model on the basis of learning data, a target setting unit sets a target output parameter value by interpolating between a goal output parameter value and an output parameter value which is the closest to the goal output parameter value in output parameter values in the learning data, a processing condition search unit estimates input parameter values which corresponds to the goal output parameter value and the target output parameter value, a model learning unit updates the prediction model by using a set of the estimated input parameter value and an output parameter value which is a result of processing that a processing device performs as additional learning data.

公开(公告)号：US20220291646A1

公开(公告)日：2022-09-15

申请号：US17272479

申请日：2019-12-03

Applicant: Hitachi High-Tech Corporation

Inventor： Yutaka Okuyama ,  Takeshi Ohmori

IPC: G05B13/04 ,  H05H1/24

Abstract: A parameter compression unit compresses first input parameter values so that a parameter restoration unit can restore the first input parameter values, and generates first compressed input parameter values in which the number of control parameters is reduced, a model learning unit learns a prediction model from learning data that is a set of the first compressed input parameter values and first output parameter values that processing results obtained by giving the first input parameter values, as a plurality of control parameters, to a processing device, and a processing condition search unit estimates a second compressed input parameter values corresponding to target output parameter values by using the prediction model.

公开(公告)号：US11747774B2

公开(公告)日：2023-09-05

申请号：US17272479

申请日：2019-12-03

Applicant: Hitachi High-Tech Corporation

Inventor： Yutaka Okuyama ,  Takeshi Ohmori

IPC: G05B13/04 ,  H05H1/24

CPC classification number: G05B13/048 ,  G05B13/042 ,  H05H1/24

Abstract: A parameter compression unit compresses first input parameter values so that a parameter restoration unit can restore the first input parameter values, and generates first compressed input parameter values in which the number of control parameters is reduced, a model learning unit learns a prediction model from learning data that is a set of the first compressed input parameter values and first output parameter values that are processing results obtained by giving the first input parameter values, as a plurality of control parameters, to a processing device, and a processing condition search unit estimates a second compressed input parameter values corresponding to target output parameter values by using the prediction model.

公开(公告)号：US20230012173A1

公开(公告)日：2023-01-12

申请号：US17370131

申请日：2021-07-08

Applicant: Hitachi High-Tech Corporation

Inventor： Takashi Dobashi ,  Hiroyuki Kobayashi ,  Takeshi Ohmori

IPC: G05B13/04 ,  H01L21/66 ,  H01L21/67 ,  H01L21/3065 ,  G06N20/00 ,  G06T7/00

Abstract: To facilitate evaluation of a predicted process shape in process recipe development using machine learning, a process recipe search apparatus that searches for an etching recipe that is a parameter of a plasma processing apparatus set so as to etch a sample into a desired shape displays, on a display device, the predicted process shape of the sample by a candidate etching recipe predicted by using a machine leaning model, by highlighting a difference between the predicted process shape and a target shape.

公开(公告)号：US20220139788A1

公开(公告)日：2022-05-05

申请号：US16957480

申请日：2019-07-04

Applicant: Hitachi High-Tech Corporation

Inventor： Yutaka Okuyama ,  Takeshi Ohmori ,  Yasutaka Toyoda

IPC: H01L21/66 ,  H01L21/67 ,  G05B19/048

Abstract: The disclosure relates to a dimension measurement apparatus that reduces time required for dimension measurement and eliminates errors caused by an operator. Therefore, the dimension measurement apparatus uses a first image recognition model that extracts a boundary line between a processed structure and a background over the entire cross-sectional image and/or a boundary line of an interface between different kinds of materials, and a second image recognition that output information for dividing the boundary line extending over the entire cross-sectional image obtained from the first image recognition model for each unit pattern constituting a repetitive pattern, obtains coordinates of a plurality of feature points defined in advance for each unit pattern, and measures a dimension defined as a distance between two predetermined points of the plurality of feature points.