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1.
公开(公告)号:US10886110B2
公开(公告)日:2021-01-05
申请号:US15904917
申请日:2018-02-26
Applicant: HITACHI HIGH-TECH CORPORATION
Inventor: Yoshito Kamaji , Masahiro Sumiya
Abstract: A system that predicts an apparatus state of a plasma processing apparatus including a processing chamber in which a sample is processed is configured to have a data recording unit that records emission data of plasma during processing of the sample and electrical signal data obtained from the apparatus during the plasma processing, an arithmetic unit that includes a first calculation unit for calculating a first soundness index value of the plasma processing apparatus and a first threshold for an abnormality determination using a first algorithm with respect to the recorded emission data and a second calculation unit for calculating a second soundness index value of the plasma processing apparatus and a second threshold for the abnormality determination using a second algorithm with respect to the electrical signal data recorded in the data recording unit, and a determination unit that determines soundness of the plasma processing apparatus using the calculated first soundness index value and the first threshold and the calculated second soundness index value and the second threshold.
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公开(公告)号:US20220399182A1
公开(公告)日:2022-12-15
申请号:US17431516
申请日:2020-06-15
Applicant: Hitachi High-Tech Corporation
Inventor: Shota Umeda , Masahiro Sumiya , Yoshito Kamaji , Kenji Tamaki
IPC: H01J37/32
Abstract: In a plasma processing apparatus, occurrence of unplanned maintenance is predicted in advance so that a time when the work should be incorporated into planned maintenance can be determined. An apparatus diagnostic apparatus including a degradation score estimation unit that receives an output of a sensor mounted on a plasma processing apparatus and estimates a degradation score of the plasma processing device; a maintenance work occurrence probability estimation unit that calculates a probability of occurrence of an unplanned maintenance work that is not included in an original maintenance plan based on the degradation score; an actual maintenance cost calculation unit that calculates an actual maintenance cost; and a plan incorporated maintenance cost calculation unit that outputs a correction plan of maintenance plan in which the original maintenance plan is corrected by incorporating the unplanned maintenance work based on the probability of occurrence of the unplanned maintenance work.
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3.
公开(公告)号:US12080529B2
公开(公告)日:2024-09-03
申请号:US17108383
申请日:2020-12-01
Applicant: Hitachi High-Tech Corporation
Inventor: Yoshito Kamaji , Masahiro Sumiya
IPC: H01J37/32 , G06F17/18 , G06N3/048 , G06N7/00 , G06N20/10 , H01J37/24 , G05B13/00 , G05B13/04 , H05H13/00
CPC classification number: H01J37/32926 , G06F17/18 , G06N3/048 , G06N7/00 , G06N20/10 , H01J37/24 , H01J37/32 , H01J37/32082 , H01J37/32192 , H01J37/32449 , H01J37/32972 , H01J37/3299 , G05B13/00 , G05B13/04 , H01J2237/1825 , H01J2237/334 , H01J2237/335 , H05H13/005
Abstract: A system that predicts an apparatus state of a plasma processing apparatus including a processing chamber in which a sample is processed is configured to have a data recording unit that records emission data of plasma during processing of the sample and electrical signal data obtained from the apparatus during the plasma processing, an arithmetic unit that includes a first calculation unit for calculating a first soundness index value of the plasma processing apparatus and a first threshold for an abnormality determination using a first algorithm with respect to the recorded emission data and a second calculation unit for calculating a second soundness index value of the plasma processing apparatus and a second threshold for the abnormality determination using a second algorithm with respect to the electrical signal data recorded in the data recording unit, and a determination unit that determines soundness of the plasma processing apparatus using the calculated first soundness index value and the first threshold and the calculated second soundness index value and the second threshold.
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4.
公开(公告)号:US11107664B2
公开(公告)日:2021-08-31
申请号:US16123176
申请日:2018-09-06
Applicant: HITACHI HIGH-TECH CORPORATION
Inventor: Yoshito Kamaji , Masahiro Sumiya
Abstract: A plasma processing apparatus including a state prediction apparatus that predicts an apparatus state of the plasma processing apparatus configured to include an apparatus data recording unit that records apparatus data output from the plasma processing apparatus during the processing of the sample, a physical environment measurement data recording unit that measures physical environment in the processing chamber and records apparatus physical environment data, data correction unit that extracts a temporal change component of the physical environment from a plurality of the apparatus physical environment data recorded in the physical environment measurement data recording unit and extracts the temporal change component of the physical environment from the apparatus data to remove the temporal change components, and an apparatus state prediction calculation unit that predicts the state of the plasma processing apparatus using the apparatus data from which the temporal change component of the physical environment is removed as input data.
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5.
公开(公告)号:US20210082673A1
公开(公告)日:2021-03-18
申请号:US17108383
申请日:2020-12-01
Applicant: Hitachi High-Tech Corporation
Inventor: Yoshito Kamaji , Masahiro Sumiya
Abstract: A system that predicts an apparatus state of a plasma processing apparatus including a processing chamber in which a sample is processed is configured to have a data recording unit that records emission data of plasma during processing of the sample and electrical signal data obtained from the apparatus during the plasma processing, an arithmetic unit that includes a first calculation unit for calculating a first soundness index value of the plasma processing apparatus and a first threshold for an abnormality determination using a first algorithm with respect to the recorded emission data and a second calculation unit for calculating a second soundness index value of the plasma processing apparatus and a second threshold for the abnormality determination using a second algorithm with respect to the electrical signal data recorded in the data recording unit, and a determination unit that determines soundness of the plasma processing apparatus using the calculated first soundness index value and the first threshold and the calculated second soundness index value and the second threshold.
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