Defect inspecting method and defect inspecting apparatus

    公开(公告)号:US10254235B2

    公开(公告)日:2019-04-09

    申请号:US15806937

    申请日:2017-11-08

    摘要: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

    Defect inspection device and defect inspection method
    3.
    发明授权
    Defect inspection device and defect inspection method 有权
    缺陷检查装置和缺陷检查方法

    公开(公告)号:US09568439B2

    公开(公告)日:2017-02-14

    申请号:US15088673

    申请日:2016-04-01

    摘要: To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.

    摘要翻译: 为了检测无限小的缺陷,高度精确地测量检测器的尺寸,检测检查装置被配置为包括:照射单元,其照射样品表面上的线性区域中的光; 检测单元,其检测来自所述线性区域的光; 以及处理通过检测光而获得的信号并检测缺陷的信号处理单元。 检测单元包括:光学组件,其在一个方向上扩散来自样品的光并在与该一个方向正交的方向上形成图像; 以及检测组件,其具有阵列传感器,其中检测像素被二维地定位,其检测沿与所述一个方向正交的方向成像的沿所述一个方向扩散的光,并将每个所述检测像素的输出信号相加 光漫射的方向,并输出。

    Inspection apparatus
    4.
    发明授权
    Inspection apparatus 有权
    检验仪器

    公开(公告)号:US09506872B2

    公开(公告)日:2016-11-29

    申请号:US14204207

    申请日:2014-03-11

    摘要: An inspection method and apparatus for detecting defects or haze of a sample, includes illuminating light to the sample from an oblique direction relative to a surface of the sample with an illuminator, detecting first scattered light at a forward position relative to an illuminating direction from the sample with a first detector, detecting second scattered light at a sideward or backward position relative to the illuminating direction from the sample with a second detection, and processing a first signal of the first scattered light and a second signal of the second scattered light with different weighting for the first signal and for the second signal with a processor.

    摘要翻译: 一种用于检测样品的缺陷或雾度的检查方法和装置,包括使用照明器从相对于样品表面的倾斜方向向样品照射光,从相对于照射方向的前方位置检测第一散射光, 采用第一检测器,利用第二检测从样品检测相对于照明方向的侧向或后退位置处的第二散射光,并且处理第一散射光的第一信号和具有不同的第二散射光的第二信号 用处理器对第一信号和第二信号进行加权。

    Defect inspection device and defect inspection method
    5.
    发明授权
    Defect inspection device and defect inspection method 有权
    缺陷检查装置和缺陷检查方法

    公开(公告)号:US09329136B2

    公开(公告)日:2016-05-03

    申请号:US14396908

    申请日:2013-04-24

    摘要: To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.

    摘要翻译: 为了检测无限小的缺陷,高度精确地测量检测器的尺寸,检测检查装置被配置为包括:照射单元,其照射样品表面上的线性区域中的光; 检测单元,其检测来自所述线性区域的光; 以及处理通过检测光而获得的信号并检测缺陷的信号处理单元。 检测单元包括:光学组件,其在一个方向上扩散来自样品的光并在与该一个方向正交的方向上形成图像; 以及检测组件,其具有阵列传感器,其中检测像素被二维地定位,其检测沿与所述一个方向正交的方向成像的沿所述一个方向漫射的光,并将每个所述检测像素的输出信号相加, 光漫射的方向,并输出。

    DEFECT INSPECTION METHOD AND DEVICE FOR SAME
    6.
    发明申请
    DEFECT INSPECTION METHOD AND DEVICE FOR SAME 审中-公开
    缺陷检查方法及其设备

    公开(公告)号:US20160109382A1

    公开(公告)日:2016-04-21

    申请号:US14978372

    申请日:2015-12-22

    摘要: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.

    摘要翻译: 在制造半导体等的过程中进行的缺陷扫描中,使用包含多个光电传感器的光检测光学系统来检测从样品反射的散射光。 用于检测弱背景散射光量的光传感器包括具有少量像素的光子计数型光电传感器,而用于检测强背景散射光量的光电传感器包括具有许多像素的光子计数型光电传感器或模拟光电传感器。 此外,为了校正缺陷散射光的检测信号,对使用光子计数型光电传感器作为非线性的缺陷散射光的检测强度引起的非线性进行了修正。

    Defect inspecting method and defect inspecting apparatus
    7.
    发明授权
    Defect inspecting method and defect inspecting apparatus 有权
    缺陷检查方法和缺陷检查装置

    公开(公告)号:US09228960B2

    公开(公告)日:2016-01-05

    申请号:US14154612

    申请日:2014-01-14

    摘要: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

    摘要翻译: 一种用于检查包括晶片表面上的缺陷的表面状态的缺陷检查方法和装置,其中照射到晶片表面的激光束的偏振状态连接到指定的偏振状态,具有指定偏振态的转换的激光束 被插入到晶片表面上,并且从照射具有指定的偏振状态的激光束的照射区域发射的散射光被分离为由于晶片上的缺陷而发生的第一散射光和由于正在发生的第二散射光 达到晶片上的表面粗糙度。 用于光路分割的光学元件大致同时分开第一和第二散射光。

    Defect inspection method and apparatus
    8.
    发明授权
    Defect inspection method and apparatus 有权
    缺陷检查方法和装置

    公开(公告)号:US08755041B2

    公开(公告)日:2014-06-17

    申请号:US13846441

    申请日:2013-03-18

    IPC分类号: G01N21/00 G06K9/00

    CPC分类号: G06T7/001 G06T2207/30148

    摘要: A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

    摘要翻译: 提供了一种图案检查装置,用于将形成为相同的图案的彼此对应的区域的图像进行比较,并判断图像中的非重合部分是缺陷。 图案检查装置配备有图像比较部,其在特征空间中绘制检查对象图像的各个像素,并且将特征空间中的过度偏离的点作为缺陷进行检测。 即使图像中的相同图案由于晶片上形成的膜的厚度差而具有亮度差,因此也可以正确地检测缺陷。

    DEFECT INSPECTING METHOD AND DEFECT INSPECTING APPARATUS
    10.
    发明申请
    DEFECT INSPECTING METHOD AND DEFECT INSPECTING APPARATUS 审中-公开
    缺陷检查方法和缺陷检查装置

    公开(公告)号:US20160116421A1

    公开(公告)日:2016-04-28

    申请号:US14986824

    申请日:2016-01-04

    IPC分类号: G01N21/95 G01N21/88

    摘要: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

    摘要翻译: 一种用于检查包括晶片表面上的缺陷的表面状态的缺陷检查方法和装置,其中照射到晶片表面的激光束的偏振状态连接到指定的偏振状态,具有指定偏振态的转换的激光束 被插入到晶片表面上,并且从照射具有指定的偏振状态的激光束的照射区域发射的散射光被分离为由于晶片上的缺陷而发生的第一散射光和由于正在发生的第二散射光 达到晶片上的表面粗糙度。 用于光路分割的光学元件大致同时分开第一和第二散射光。