公开(公告)号：US20090036039A1

公开(公告)日：2009-02-05

申请号：US12239720

申请日：2008-09-26

申请人： Ho Seon Shin ,  Gary C. Ettinger ,  Donald J. K. Olgado ,  Erik C. Wasinger ,  Sen-Hour Ko ,  Yufei Chen ,  Charles I. Dodds ,  Wei-Yung Hsu

发明人： Ho Seon Shin ,  Gary C. Ettinger ,  Donald J. K. Olgado ,  Erik C. Wasinger ,  Sen-Hour Ko ,  Yufei Chen ,  Charles I. Dodds ,  Wei-Yung Hsu

IPC分类号： B24B7/00

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/067 ,  B24B49/16 ,  B24B57/02

摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes a substrate rotation driver adapted to rotate the edge of a substrate against a polishing film; and a first sensor coupled to the rotation driver adapted to detect one of an energy and torque exerted by the substrate rotation driver as it rotates the substrate against the polishing film. Numerous other aspects are provided.

摘要翻译： 提供了抛光衬底边缘的方法和系统。 本发明包括一个衬底旋转驱动器，其适于使衬底的边缘抵靠抛光膜旋转; 以及耦合到所述旋转驱动器的第一传感器，其适于检测由所述基板旋转驱动器在基板旋转所述抛光膜时施加的能量和扭矩中的一个。 提供了许多其他方面。

公开(公告)号：US20090036042A1

公开(公告)日：2009-02-05

申请号：US12239725

申请日：2008-09-26

申请人： Ho Seon Shin ,  Gary C. Ettinger ,  Donald J. K. Olgado ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Charles I. Dodds ,  Yufei Chen ,  Wei-Yung Hsu

发明人： Ho Seon Shin ,  Gary C. Ettinger ,  Donald J. K. Olgado ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Charles I. Dodds ,  Yufei Chen ,  Wei-Yung Hsu

IPC分类号： B24B5/00

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/067 ,  B24B49/16 ,  B24B57/02

摘要： Methods, systems and apparatus are provided for polishing an edge of a substrate. The invention includes an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate. The apparatus includes an actuator adapted to apply a preset pressure to the polishing film; and a controller coupled to the actuator and adapted to receive a signal indicative of a condition of the edge of the substrate, and to adjust a pressure applied by the actuator to the polishing film so as to maintain the preset pressure based on the received signal. Numerous other aspects are provided.

摘要翻译： 提供了用于抛光衬底边缘的方法，系统和装置。 本发明包括适于将预设压力施加到与衬底的边缘接触的抛光膜的装置。 该装置包括致动器，其适于对抛光膜施加预设压力; 以及控制器，其耦合到所述致动器并且适于接收指示所述基板的边缘的状态的信号，并且调整由所述致动器施加到所述抛光膜的压力，以便基于所接收的信号来保持所述预设压力。 提供了许多其他方面。

公开(公告)号：US20090029629A1

公开(公告)日：2009-01-29

申请号：US12239726

申请日：2008-09-26

申请人： Ho Seon Shin ,  Gary C. Ettinger ,  Donald J.K. Olgado ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Charles I. Dodds ,  Yufei Chen ,  Wei-Yung Hsu

发明人： Ho Seon Shin ,  Gary C. Ettinger ,  Donald J.K. Olgado ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Charles I. Dodds ,  Yufei Chen ,  Wei-Yung Hsu

IPC分类号： B24B49/00

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/067 ,  B24B49/16 ,  B24B57/02

摘要： Methods for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of force exerted in pressing the polishing film against the substrate. Numerous other aspects are provided.

摘要翻译： 提供了抛光衬底边缘的方法。 本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将抛光膜压在基板上时施加的力的量。 提供了许多其他方面。

公开(公告)号：US20090017731A1

公开(公告)日：2009-01-15

申请号：US12239730

申请日：2008-09-26

申请人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

发明人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

IPC分类号： B24B1/00

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/002 ,  H01L21/02021

摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

摘要翻译： 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

公开(公告)号：US20090036033A1

公开(公告)日：2009-02-05

申请号：US12245765

申请日：2008-10-05

申请人： Erik C. Wasinger ,  Gary C. Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

发明人： Erik C. Wasinger ,  Gary C. Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

IPC分类号： B24B1/04 ,  B24B9/00

CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

摘要： A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.

摘要翻译： 提供了清洁基板的边缘的方法。 该方法包括在框架中张紧第一抛光膜; 使所述第一抛光膜与衬底的边缘接触; 使所述第一抛光膜与所述基板的边缘一致，所述边缘包括外边缘和至少一个斜面; 并且在第一研磨膜与基板保持接触的同时旋转基板。 提供了许多其他方面。

公开(公告)号：US07993485B2

公开(公告)日：2011-08-09

申请号：US11299295

申请日：2005-12-09

申请人： Erik C. Wasinger ,  Gary C. Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

发明人： Erik C. Wasinger ,  Gary C. Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

IPC分类号： C03C15/00 ,  H01I21/306

CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

摘要翻译： 适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转 衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和 第一斜面作为基底旋转。 提供了许多其他方面。