摘要:
Methods, systems and apparatus are provided for polishing an edge of a substrate. The invention includes an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate. The apparatus includes an actuator adapted to apply a preset pressure to the polishing film; and a controller coupled to the actuator and adapted to receive a signal indicative of a condition of the edge of the substrate, and to adjust a pressure applied by the actuator to the polishing film so as to maintain the preset pressure based on the received signal. Numerous other aspects are provided.
摘要:
Methods of and systems for polishing an edge of a substrate are provided. The invention includes a substrate rotation driver adapted to rotate the edge of a substrate against a polishing film; and a first sensor coupled to the rotation driver adapted to detect one of an energy and torque exerted by the substrate rotation driver as it rotates the substrate against the polishing film. Numerous other aspects are provided.
摘要:
In one aspect, an apparatus for cleaning an edge of a substrate is provided. The apparatus includes (1) one or more rollers of a first diameter adapted to contact an edge of a substrate and rotate the substrate; and (2) one or more rollers of a second diameter that is larger than the first diameter adapted to contact an edge of the substrate and to clean the edge of the substrate. The one or more rollers of the first diameter and the one or more rollers of the second diameter may be adapted to rotate at substantially the same speed. Numerous other aspects are provided.
摘要:
A method and apparatus for the delivery of slurry solution comprising an ultrasonic flow meter positioned between a fluid preparation manifold and a slurry delivery arm, and a shutoff valve positioned between a proportional valve and the slurry delivery arm. Also, a method and apparatus for the delivery of slurry solution including an ultrasonic flow meter positioned to receive fluid from a fluid preparation manifold, a proportional valve and stepper motor in communication with the flow meter, and a reverse flow restrictor in communication with the proportional valve and a slurry delivery arm.
摘要:
Embodiments of the invention generally relate to apparatus and methods for cleaning chamber components using a cleaning plate. The cleaning plate is adapted to be positioned on a substrate support during a cleaning process, and includes a plurality of turbulence-inducing structures. The turbulence-inducing structures induce a turbulent flow of cleaning gas while the cleaning plate is rotated during a cleaning process. The cleaning plate increases the retention time of the cleaning gas near the showerhead during cleaning. Additionally, the cleaning plate reduces concentration gradients within the cleaning plate to provide a more effective clean. The method includes positioning a cleaning plate adjacent to a showerhead, and introducing cleaning gas to the space between the showerhead and the cleaning plate. A material deposited on the surface of the showerhead is then heated and vaporized in the presence of the cleaning gas, and then exhausted from the processing chamber.
摘要:
A method and apparatus for forming an electrochemical layer of a thin film battery is provided. A precursor mixture comprising precursor particles dispersed in a carrying medium is activated in an activation chamber by application of an electric field to ionize at least a portion of the precursor mixture. The activated precursor mixture is then mixed with a combustible gas mixture to add thermal energy to the precursor particles, converting them to nanocrystals, which deposit on a substrate. A second precursor may be blended with the nanocrystals as they deposit on the surface to enhance adhesion and conductivity.
摘要:
A stable platform supports a cell, the stable platform comprises a lower mainframe, an upper mainframe, and a dampener system. The upper mainframe includes a plurality of recesses. Each recess is configured to receive a cell. The dampener system connects the lower mainframe to the upper mainframe. In one embodiment, the dampener system comprises a dampener element, such as sand, to dampen vibrations between the lower mainframe and the lower mainframe.
摘要:
A method of planarizing a metal conductive layer on a substrate is provided. In one embodiment, a substrate having a metal conductive layer disposed on a top surface of the substrate is provided on a substrate support. The substrate support is rotated and the top surface of the substrate is contacted with a liquid etching composition. The metal conductive layer is then exposed to an etchant gas in order to planarize the top surface of the metal conductive layer. Also provided is an apparatus for etching a metal conductive layer on a substrate. The apparatus comprises a container, a substrate support disposed in the container, a rotation actuator attached to the substrate support, and a fluid delivery assembly disposed in the container.
摘要:
A guide apparatus comprising a plurality of guide linkages. Each one of the plurality of guide linkages comprises a pair of linkage members, each pair of the linkage members are rotatably connected about a guide pivot axis. The guide pivot axis of each guide linkage is arranged in a direction opposed to the direction of the guide pivot axis of the remainder of the guide linkages. In one aspect, each guide linkage is arranged between a robot platform or a cassette and a base such that extending each of the plurality of guide linkages acts to linearly displace the robot platform relative to the base while limiting tilting of the robot platform or the cassette. In another aspect a robot can extend its end effectors while limiting tilting of the end effectors.