METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
    4.
    发明申请
    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
    用于处理基板的方法和装置

    公开(公告)号:US20090017731A1

    公开(公告)日:2009-01-15

    申请号:US12239730

    申请日:2008-09-26

    IPC分类号: B24B1/00

    摘要: Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

    摘要翻译: 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器,其适于将衬底旋转抵靠所述抛光膜的抛光侧,其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间,使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

    Methods and apparatus for cleaning an edge of a substrate
    7.
    发明申请
    Methods and apparatus for cleaning an edge of a substrate 审中-公开
    用于清洁衬底边缘的方法和设备

    公开(公告)号:US20080216867A1

    公开(公告)日:2008-09-11

    申请号:US11411215

    申请日:2006-04-24

    IPC分类号: B08B7/00

    摘要: In one aspect, an apparatus for cleaning an edge of a substrate is provided. The apparatus includes (1) one or more rollers of a first diameter adapted to contact an edge of a substrate and rotate the substrate; and (2) one or more rollers of a second diameter that is larger than the first diameter adapted to contact an edge of the substrate and to clean the edge of the substrate. The one or more rollers of the first diameter and the one or more rollers of the second diameter may be adapted to rotate at substantially the same speed. Numerous other aspects are provided.

    摘要翻译: 一方面,提供了一种用于清洁基板的边缘的装置。 该设备包括(1)一个或多个第一直径的辊,其适于接触衬底的边缘并旋转衬底; 和(2)一个或多个第二直径的辊,其大于适于接触所述衬底的边缘并且清洁所述衬底的所述边缘的所述第一直径。 第一直径的一个或多个辊和第二直径的一个或多个辊可以适于以基本上相同的速度旋转。 提供了许多其他方面。

    METHODS AND APPARATUS FOR CLEANING AN EDGE OF A SUBSTRATE
    10.
    发明申请
    METHODS AND APPARATUS FOR CLEANING AN EDGE OF A SUBSTRATE 审中-公开
    清洗衬底边缘的方法和装置

    公开(公告)号:US20090038642A1

    公开(公告)日:2009-02-12

    申请号:US12249922

    申请日:2008-10-11

    IPC分类号: B08B1/04

    摘要: In one aspect, a method for cleaning an edge of a substrate is provided. The method comprises employing one or more rollers of a first diameter to rotate a substrate; contacting an edge of the substrate with one or more rollers of a second diameter that is larger than the first diameter; and cleaning the edge of the substrate using the one or more rollers of the second diameter. Numerous other aspects are provided.

    摘要翻译: 一方面,提供一种清洗基板的边缘的方法。 该方法包括采用一个或多个第一直径的辊来旋转衬底; 使所述基板的边缘与大于所述第一直径的第二直径的一个或多个辊接触; 以及使用所述第二直径的所述一个或多个辊清洁所述基板的边缘。 提供了许多其他方面。