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    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
    2.
    发明申请
    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
    用于处理基板的方法和装置

    公开(公告)号：US20090017731A1

    公开(公告)日：2009-01-15

    申请号：US12239730

    申请日：2008-09-26

    申请人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    发明人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    IPC分类号： B24B1/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/002 ,  H01L21/02021

    摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

    摘要翻译： 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

    Methods and apparatus for processing a substrate
    4.
    发明申请
    Methods and apparatus for processing a substrate 有权
    用于处理衬底的方法和设备

    公开(公告)号：US20070131654A1

    公开(公告)日：2007-06-14

    申请号：US11299295

    申请日：2005-12-09

    申请人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    发明人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    IPC分类号： C03C15/00 ,  H01L21/306

    CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

    摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

    摘要翻译： 适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转 衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和 第一斜面作为基底旋转。 提供了许多其他方面。

    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
    6.
    发明申请
    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
    用于抛光衬底边缘的方法和装置

    公开(公告)号：US20070238393A1

    公开(公告)日：2007-10-11

    申请号：US11693695

    申请日：2007-03-29

    申请人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    发明人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    IPC分类号： B24B51/00 ,  B24B49/00 ,  B24B7/30

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/067 ,  B24B49/16 ,  B24B57/02

    摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.

    摘要翻译： 提供了抛光衬底边缘的方法和系统。 本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。 本发明还可以包括基于在将衬底旋转抛光膜时所检测到的能量或扭矩确定从衬底边缘去除的材料量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。 提供了许多其他方面。

    Methods and apparatus for cleaning an edge of a substrate
    8.
    发明申请
    Methods and apparatus for cleaning an edge of a substrate 审中-公开
    用于清洁衬底边缘的方法和设备

    公开(公告)号：US20060243304A1

    公开(公告)日：2006-11-02

    申请号：US11411012

    申请日：2006-04-24

    申请人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    发明人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    IPC分类号： B08B7/00 ,  B08B5/04

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  H01L21/67028

    摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method includes the steps of (a) supporting a substrate on a rotatable substrate support; (b) contacting an edge of the substrate with one or more rollers; (c) rotating the substrate support so as to rotate the substrate; and (d) rotating the one or more rollers so as to clean the edge of the substrate Numerous other aspects are provided.

    摘要翻译： 一方面，提供一种清洗基板的边缘的方法。 该方法包括以下步骤：（a）将基板支撑在可旋转的基板支撑件上; （b）使所述基板的边缘与一个或多个辊接触; （c）旋转衬底支撑件以旋转衬底; 和（d）旋转所述一个或多个辊以便清洁所述基底的边缘。提供许多其它方面。

    Polishing solution retainer
    10.
    发明申请
    Polishing solution retainer 有权
    抛光液固定器

    公开(公告)号：US20060019581A1

    公开(公告)日：2006-01-26

    申请号：US10942600

    申请日：2004-09-16

    申请人： Hanzhong Zhang ,  Feng Liu ,  Stan Tsai ,  Rashid Mavliev ,  Donald Olgado ,  Liang-Yuh Chen

    发明人： Hanzhong Zhang ,  Feng Liu ,  Stan Tsai ,  Rashid Mavliev ,  Donald Olgado ,  Liang-Yuh Chen

    IPC分类号： B24B1/00

    CPC分类号： B24B37/04 ,  B24B57/02

    摘要： A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.

    摘要翻译： 对基板研磨装置和方法进行说明。 基座包括至少一个可移动的压板以接合抛光垫。 在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。 抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。 抛光溶液保持机构附接到基座或承载头组件中的一个。 保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。 一些实施方案可以减少抛光溶液消耗并允许增加的角速度。