利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.019 秒)

    Coupling device for impedance matching to a guided wave radar probe
    1.
    发明授权
    Coupling device for impedance matching to a guided wave radar probe 有权
    用于阻抗匹配的耦合装置与导波雷达探头

    公开(公告)号：US09574929B2

    公开(公告)日：2017-02-21

    申请号：US14133110

    申请日：2013-12-18

    申请人： HONEYWELL INTERNATIONAL INC.

    发明人： Cornel Cobianu ,  Ion Georgescu ,  Michael Kon Yew Hughes ,  Stuart James Heath ,  Frank Martin Haran

    IPC分类号： G01S13/08 ,  G01F23/284 ,  H01P5/08 ,  G01S7/03 ,  G01S13/88

    CPC分类号： G01F23/284 ,  G01S7/03 ,  G01S13/88 ,  H01P5/085

    摘要： A coupling device for impedance matching a probe of a guided wave radar (GWR) system. A feed-through is for connecting to a coaxial cable or other transmission line connector that includes an inner conductor which connects to an output of a transceiver and an outer conductor that connects to an outer metal sleeve. A subwavelength coaxial transmission line (CTL) having a length from λ/5 to λ/2 is coupled to the feed-through including an inner conductor connected to the inner conductor of the feed-through and an outer conductor connected to the outer metal sleeve. A mode converter (MC) having a plurality of metal fingers (7) of length 2λ± twenty percent is connected to the outer conductor of the subwavelength CTL, where the MC includes a dielectric coating on its inner conductor connected to the inner conductor of the subwavelength CTL.

    摘要翻译： 一种用于阻抗匹配导波雷达（GWR）系统探头的耦合装置。 馈通用于连接到同轴电缆或其它传输线连接器，其包括连接到收发器的输出的内部导体和连接到外部金属套筒的外部导体。 具有从λ/ 5到λ/ 2的长度的亚波长同轴传输线（CTL）耦合到馈通，其包括连接到馈通的内部导体的内部导体和连接到外部金属套筒的外部导体 。 具有长度为2λ±20％的多个金属指（7）的模式转换器（MC）连接到副波长CTL的外导体，其中MC包括在其内导体上的电介质涂层， 亚波长CTL。

    Humidity Sensor
    2.
    发明申请
    Humidity Sensor 审中-公开
    湿度传感器

    公开(公告)号：US20160202201A1

    公开(公告)日：2016-07-14

    申请号：US14991096

    申请日：2016-01-08

    申请人： Honeywell International Inc.

    发明人： Cornel Cobianu ,  Bogdan Serban ,  Cazimir Bostan ,  Stefan Costea ,  Octavian Buiu ,  Alisa Stratulat ,  Mihai Brezeanu

    IPC分类号： G01N27/22

    CPC分类号： G01N27/223 ,  G01N27/414

    摘要： A humidity sensor having a sensing component and a reference component. Each component may indicate humidity by using a transistor that has an upper gate dielectric layer with a dielectric constant which varies according to exposure to a change of moisture. The sensing component may have its upper gate dielectric layer exposed to an ambient environment. The reference component may have its upper gate dielectric layer with an absence of exposure to any environment. Sensing and reference transistor outputs may be processed with differential electronics to provide an output to indicate humidity in the ambient environment. Differential processing may reflect an output having a high common mode rejection ratio. An example of an upper gate dielectric layer deposited over a thin gate dielectric layer may be a hydrophobic polymer material. Other materials may instead be used. The components and processing electronics may be transistor circuits fabricated with integrated circuit technology.

    摘要翻译： 一种具有感测部件和基准部件的湿度传感器。 每个组件可以通过使用具有介电常数的上栅极电介质层的晶体管来指示湿度，所述介电常数随暴露于湿度变化而变化。 感测组件可能具有暴露于周围环境的其上栅极电介质层。 该参考部件可以具有不存在暴露于任何环境的上栅极电介质层。 传感和参考晶体管输出可以用差分电子器件处理，以提供输出以指示环境中的湿度。 差分处理可以反映具有高共模抑制比的输出。 沉积在薄栅介质层上的上栅极电介质层的实例可以是疏水性聚合物材料。 可以替代地使用其他材料。 组件和处理电子器件可以是用集成电路技术制造的晶体管电路。

    FET based humidity sensor with barrier layer protecting gate dielectric
    3.
    发明授权
    FET based humidity sensor with barrier layer protecting gate dielectric 有权

    公开(公告)号：US10585058B2

    公开(公告)日：2020-03-10

    申请号：US15594184

    申请日：2017-05-12

    申请人： Honeywell International Inc.

    发明人： Cornel Cobianu ,  Alisa Stratulat ,  Bogdan Serban ,  Octavian Buiu ,  Cazimir Gabriel Bostan ,  Mihai Brezeanu ,  Stefan Dan Costea ,  Richard Davis

    IPC分类号： G01N27/22 ,  G01N27/414 ,  H01L29/49 ,  H01L29/51

    摘要： An illustrative humidity sensor may include a substrate having a source and a drain, wherein the drain is laterally spaced from the source. A gate stack is provided in the space between the source and the drain to form a transistor. The gate stack may include a gate insulator situated on the substrate to form a gate insulator/substrate interface. The gate stack may further include a barrier layer above the gate insulator. The barrier layer may be configured to act as a barrier to mobile charge, humidity and/or other contaminates, and may help prevent such contaminates from reaching the gate insulator/substrate interface. The gate stack may further include a humidity sensing layer above the barrier layer. The humidity sensing layer, when exposed to humidity, may modulate the conduction channel in the substrate under the gate insulator and between the source and the drain. In some cases, the humidity level may be determined by monitoring the current flowing between the source and drain.

    Threaded coupling device with nozzle for GWR measurements in non-metallic tanks
    7.
    发明授权
    Threaded coupling device with nozzle for GWR measurements in non-metallic tanks 有权
    螺纹连接装置，带有用于非金属罐中GWR测量的喷嘴

    公开(公告)号：US09518856B2

    公开(公告)日：2016-12-13

    申请号：US14229063

    申请日：2014-03-28

    申请人： HONEYWELL INTERNATIONAL INC.

    发明人： Cornel Cobianu ,  Ion Georgescu ,  Stuart James Heath ,  Michael Kon Yew Hughes ,  Frank Martin Haran

    IPC分类号： G01F23/284 ,  G01S13/08 ,  F16L25/00 ,  G01S7/02 ,  G01S7/35 ,  F16L25/02 ,  G01F23/00 ,  G01S13/00

    CPC分类号： G01F23/284 ,  F16L25/021 ,  G01S7/02 ,  G01S7/35

    摘要： A coupling device for coupling a threaded feed-through of a process connection to provide a launcher for a non-metallic storage tank. The storage tank includes a tank aperture in its top surface. The coupling device includes a foil nozzle including an inner upper metal foil surface that includes a threaded aperture for securing the feed-through thereto, and a first and second lower metal foil surface on respective sides of the upper metal foil surface. The foil nozzle also includes a first and a second foil level transition region disposed between the respective sides of the inner upper metal foil surface and the first and second lower metal foil surface. The foil nozzle can be configured in a cylindrical, horn, or a corrugated horn shape.

    摘要翻译： 一种联接装置，用于联接过程连接的螺纹进料，以提供用于非金属储罐的发射器。 储罐在其顶表面上包括罐孔。 联接装置包括箔喷嘴，其包括内上金属箔表面，其包括用于固定其馈通的螺纹孔，以及在上金属箔表面的相应侧上的第一和第二下金属箔表面。 箔喷嘴还包括设置在内上金属箔表面和第一和第二下金属箔表面的相应侧之间的第一和第二箔级过渡区域。 箔喷嘴可以被配置成圆柱形，角形或波纹状的喇叭状。

    SENSOR DEVICE WITH HELICAL ANTENNA AND RELATED SYSTEM AND METHOD
    8.
    发明申请
    SENSOR DEVICE WITH HELICAL ANTENNA AND RELATED SYSTEM AND METHOD 审中-公开
    带有天线的传感器装置及相关系统及方法

    公开(公告)号：US20160336658A1

    公开(公告)日：2016-11-17

    申请号：US15221529

    申请日：2016-07-27

    申请人： Honeywell International Inc.

    发明人： Ion Georgescu ,  Dana E. Guran ,  Ioan Pavelescu ,  Cornel Cobianu

    IPC分类号： H01Q11/08 ,  H01Q1/38 ,  H01Q1/32

    CPC分类号： H01Q11/08 ,  H01Q1/3233 ,  H01Q1/38

    摘要： An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.

    摘要翻译： 一种装置包括传感器，其接收第一电信号并响应于第一电信号提供第二电信号。 第二电信号基于由传感器监测的至少一个参数。 该装置还包括天线，其将第一无线信号转换成第一电信号并将第二电信号转换成第二无线信号。 天线包括基板，导电迹线和导电互连。 导电迹线形成在基板的第一和第二表面上。 导电互连件耦合导电迹线，并且导电互连和导电迹线形成天线的至少一个螺旋臂。 导电迹线可以以各种方式形成，例如通过蚀刻或直接印刷。 导电互连也可以以各种方式形成，例如通过在基板中填充通孔或直接印刷。