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1.发明授权Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same 有权真空泵送系统，其驱动方法，具有该真空泵系统的装置，以及使用其的基板的转移方法公开(公告)号：US07866341B2
公开(公告)日：2011-01-11
申请号：US12713136
申请日：2010-02-25
申请人： Hong-Seub Kim , Hyun-Soo Park , Soon-Bin Jung , Sung-Ho Cha , Dong-Jin Kim , Wook-Jung Hwang , Jin-Hyuk Yoo
发明人： Hong-Seub Kim , Hyun-Soo Park , Soon-Bin Jung , Sung-Ho Cha , Dong-Jin Kim , Wook-Jung Hwang , Jin-Hyuk Yoo
IPC分类号： H01L21/205
CPC分类号： H01L21/67161 , H01L21/67017 , H01L21/67167 , H01L21/67173 , Y10T137/86083 , Y10T137/86139
摘要： An apparatus includes a transfer unit under an atmospheric condition and having a robot therein; and at least one process chamber connected to one side of the transfer unit with a slot valve there between, and being alternately under a vacuum condition and under an atmospheric condition.
摘要翻译： 一种装置，包括在大气条件下的转印单元，其中具有机器人; 以及至少一个处理室，其连接到转印单元的一侧，其间具有槽阀，并且交替地在真空条件下和在大气条件下。
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2.发明授权Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same 有权真空泵送系统，其驱动方法，具有该真空泵系统的装置，以及使用其的基板的转移方法公开(公告)号：US07695231B2
公开(公告)日：2010-04-13
申请号：US11076512
申请日：2005-03-08
申请人： Hong-Seub Kim , Hyun-Soo Park , Soon-Bin Jung , Sung-Ho Cha , Dong-Jin Kim , Wook-Jung Hwang , Jin-Hyuk Yoo
发明人： Hong-Seub Kim , Hyun-Soo Park , Soon-Bin Jung , Sung-Ho Cha , Dong-Jin Kim , Wook-Jung Hwang , Jin-Hyuk Yoo
IPC分类号： B65G49/00
CPC分类号： H01L21/67161 , H01L21/67017 , H01L21/67167 , H01L21/67173 , Y10T137/86083 , Y10T137/86139
摘要： An apparatus includes a transfer unit under an atmospheric condition and having a robot therein; and at least one process chamber connected to one side of the transfer unit with a slot valve there between, and being alternately under a vacuum condition and under an atmospheric condition.
摘要翻译： 一种装置，包括在大气条件下的转印单元，其中具有机器人; 以及至少一个处理室，其连接到转印单元的一侧，其间具有槽阀，并且交替地在真空条件下和在大气条件下。
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3.发明申请Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same 有权真空泵送系统，其驱动方法，具有该真空泵系统的装置，以及使用其的基板的转移方法公开(公告)号：US20050196254A1
公开(公告)日：2005-09-08
申请号：US11076512
申请日：2005-03-08
申请人： Hong-Seub Kim , Hyun-Soo Park , Soon-Bin Jung , Sung-Ho Cha , Dong-Jin Kim , Wook-Jung Hwang , Jin-Hyuk Yoo
发明人： Hong-Seub Kim , Hyun-Soo Park , Soon-Bin Jung , Sung-Ho Cha , Dong-Jin Kim , Wook-Jung Hwang , Jin-Hyuk Yoo
CPC分类号： H01L21/67161 , H01L21/67017 , H01L21/67167 , H01L21/67173 , Y10T137/86083 , Y10T137/86139
摘要： An apparatus includes a transfer unit under an atmospheric condition and having a robot therein; and at least one process chamber connected to one side of the transfer unit with a slot valve there between, and being alternately under a vacuum condition and under an atmospheric condition.
摘要翻译： 一种装置，包括在大气条件下的转印单元，其中具有机器人; 以及至少一个处理室，其连接到转印单元的一侧，其间具有槽阀，并且交替地在真空条件下和在大气条件下。
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公开(公告)号：US20060011300A1
公开(公告)日：2006-01-19
申请号：US11177254
申请日：2005-07-07
申请人： Jong-Bok Kim , Sung-Ho Cha
发明人： Jong-Bok Kim , Sung-Ho Cha
IPC分类号： H01L21/306
CPC分类号： H01L21/68728
摘要： Disclosed is a device for treating a semiconductor substrate. The device comprises a rotational support plate in which at least one mounting recess is formed at the periphery thereof, and support blocks disposed on the periphery of the support plate within said mounting recess for supporting the semiconductor substrate. Each of the support blocks comprises a positioning portion on which the semiconductor substrate is positioned. An insertion portion which has a shape complementary to the shape of the mounting recess is disposed under the positioning portion where it is inserted into the mounting recess.
摘要翻译： 公开了一种用于处理半导体衬底的器件。 该装置包括旋转支撑板，其中在其周边形成有至少一个安装凹部，以及设置在所述安装凹槽内的支撑板的周边上的用于支撑半导体基板的支撑块。 每个支撑块包括其上定位有半导体衬底的定位部分。 具有与安装凹部的形状互补的形状的插入部设置在其插入安装凹部的定位部的下方。
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