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    ETCHING APPARATUS FOR EDGES OF SUBSTRATE
    4.
    发明申请
    ETCHING APPARATUS FOR EDGES OF SUBSTRATE 审中-公开
    蚀刻基板边缘的装置

    公开(公告)号：US20080128088A1

    公开(公告)日：2008-06-05

    申请号：US11927182

    申请日：2007-10-29

    申请人： Dae-Sik JUNN ,  Duck-Ho KIM ,  Myung-Gon SONG ,  Jeong-Beom LEE ,  Kyoung-Jin LIM ,  Sung-Ho CHA

    发明人： Dae-Sik JUNN ,  Duck-Ho KIM ,  Myung-Gon SONG ,  Jeong-Beom LEE ,  Kyoung-Jin LIM ,  Sung-Ho CHA

    IPC分类号： C23F1/00

    CPC分类号： H01L21/67069 ,  H01J37/32623 ,  H01J2237/334

    摘要： An etching apparatus comprises a chamber; a substrate supporter in the chamber; a substrate disposed on the substrate and having one of a notch zone and a flat zone, the substrate having a rim of a circular shape except in the one of the notch zone and the flat zone, wherein the rim of the substrate has a dented shape in the notch zone and a chord shape in the flat zone; a substrate-screening unit having a substantially same shape as the substrate and disposed over the substrate, the substrate-screening unit having a portion corresponding to the one of the notch zone and the flat zone, wherein the substrate-screening unit has a first diameter smaller than or equal to a second diameter of the substrate; a gas injection means supplying gases onto a periphery of the substrate; and a power supply unit supplying an RF (radio frequency) power into the chamber.

    摘要翻译： 蚀刻装置包括：腔室; 腔室中的衬底支撑件; 衬底，其设置在所述衬底上并且具有切口区域和平坦区域中的一个，所述衬底具有除所述凹口区域和所述平坦区域之外的圆形边缘，其中所述衬底的边缘具有凹陷形状 在切口区域中，在平坦区域中具有弦形; 衬底筛选单元，其具有与衬底基本相同的形状并且设置在衬底上，衬底筛选单元具有对应于切口区域和平坦区域中的一个的部分，其中衬底筛选单元具有第一直径 小于或等于所述基板的第二直径; 气体喷射装置，其将气体供应到所述基板的周边; 以及向室提供RF（射频）功率的电源单元。

    Device for treating semiconductor substrate
    5.
    发明申请
    Device for treating semiconductor substrate 审中-公开
    半导体衬底处理装置

    公开(公告)号：US20060011300A1

    公开(公告)日：2006-01-19

    申请号：US11177254

    申请日：2005-07-07

    申请人： Jong-Bok Kim ,  Sung-Ho Cha

    发明人： Jong-Bok Kim ,  Sung-Ho Cha

    IPC分类号： H01L21/306

    CPC分类号： H01L21/68728

    摘要： Disclosed is a device for treating a semiconductor substrate. The device comprises a rotational support plate in which at least one mounting recess is formed at the periphery thereof, and support blocks disposed on the periphery of the support plate within said mounting recess for supporting the semiconductor substrate. Each of the support blocks comprises a positioning portion on which the semiconductor substrate is positioned. An insertion portion which has a shape complementary to the shape of the mounting recess is disposed under the positioning portion where it is inserted into the mounting recess.

    摘要翻译： 公开了一种用于处理半导体衬底的器件。 该装置包括旋转支撑板，其中在其周边形成有至少一个安装凹部，以及设置在所述安装凹槽内的支撑板的周边上的用于支撑半导体基板的支撑块。 每个支撑块包括其上定位有半导体衬底的定位部分。 具有与安装凹部的形状互补的形状的插入部设置在其插入安装凹部的定位部的下方。