公开(公告)号：US20070048172A1

公开(公告)日：2007-03-01

申请号：US11360812

申请日：2006-02-24

申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C11/06 ,  B23K35/262 ,  C22C13/00

摘要： A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

摘要翻译： 公开了一种提高锡铟焊料顺从性的技术。 在一个具体的示例性实施方案中，该技术可以实现为无铅焊料合金，其包含约58.0重量％至约99.998重量％的锡，约0.001重量％至约40.0重量％的铟和约0.001重量％至约2.0重量％ 重量％至少一种稀土元素。

公开(公告)号：US07749336B2

公开(公告)日：2010-07-06

申请号：US11360812

申请日：2006-02-24

申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C11/06 ,  B23K35/262 ,  C22C13/00

摘要： A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

摘要翻译： 公开了一种提高锡铟焊料顺从性的技术。 在一个具体的示例性实施方案中，该技术可以实现为无铅焊料合金，其包含约58.0重量％至约99.998重量％的锡，约0.001重量％至约40.0重量％的铟和约0.001重量％至约2.0重量％ 重量％至少一种稀土元素。

公开(公告)号：US07749340B2

公开(公告)日：2010-07-06

申请号：US11550640

申请日：2006-10-18

申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C13/00 ,  C22C13/02 ,  B23K35/34 ,  C23C22/00

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K35/3006

摘要： A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.

摘要翻译： 公开了一种提高含银无铅焊料柔顺性的技术。 在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。 在另一特定示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物 。 在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物 。 在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

公开(公告)号：US20110273847A1

公开(公告)日：2011-11-10

申请号：US13099135

申请日：2011-05-02

申请人： Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： C22C28/00 ,  B23K35/24 ,  H01L23/3733 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/4275 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29313 ,  H01L2224/32012 ,  H01L2224/32014 ,  H01L2224/81192 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/3651 ,  H01L2924/01048 ,  H01L2924/0108 ,  H01L2924/01083 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2224/29311 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to about 99.999% by weight indium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. In another particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy consisting essentially of from about 90% to about 99.999% by weight gallium and from about 0.001% to about 10% by weight germanium and unavoidable impurities.

摘要翻译： 公开了用于降低金属和合金的IMC厚度和氧化的合金组成和技术。 在一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的铟和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金或混合物。 在另一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的镓和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金。

公开(公告)号：US20070092396A1

公开(公告)日：2007-04-26

申请号：US11550640

申请日：2006-10-18

申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K35/3006

摘要： A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.

摘要翻译： 公开了一种提高含银无铅焊料柔顺性的技术。 在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。 在另一特定示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物 。 在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物 。 在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

公开(公告)号：US20070256761A1

公开(公告)日：2007-11-08

申请号：US11745784

申请日：2007-05-08

申请人： Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C28/00

CPC分类号： C22C28/00 ,  B23K35/24 ,  H01L23/3733 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/4275 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29313 ,  H01L2224/32012 ,  H01L2224/32014 ,  H01L2224/81192 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/3651 ,  H01L2924/01048 ,  H01L2924/0108 ,  H01L2924/01083 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2224/29311 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to about 99.999% by weight indium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. In another particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy consisting essentially of from about 90% to about 99.999% by weight gallium and from about 0.001% to about 10% by weight germanium and unavoidable impurities.

摘要翻译： 公开了用于降低金属和合金的IMC厚度和氧化的合金组成和技术。 在一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的铟和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金或混合物。 在另一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的镓和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金。

公开(公告)号：US20070071634A1

公开(公告)日：2007-03-29

申请号：US11422782

申请日：2006-06-07

申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C13/00 ,  B23K35/262

摘要： Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.

摘要翻译： 披露了低熔点温度的焊料。 在一个具体的示例性实施方案中，低熔点兼容性焊料合金包含约91.5重量％至约97.998重量％的锡，约0.001重量％至约3.5重量％的银，约0.0重量％至约1.0重量％的铜， 和约2.001重量％至约4.0重量％的铟。