摘要:
The present invention discloses an optical displacement detection apparatus and an optical displacement detection method. The optical displacement detection apparatus comprises: at least two light sources for projecting light of different spectrums to a surface under detection, respectively; an image capturing unit for receiving light reflected from the surface under detection and converting it into electronic signals; and a processor and control circuit for calculating displacement according to the electronic signals from the image capturing unit, wherein the processor and control circuit is capable of switching between the light sources.
摘要:
The present invention discloses an optical displacement detection apparatus and an optical displacement detection method. The optical displacement detection apparatus comprises: at least two light sources for projecting light of different spectrums to a surface under detection, respectively; an image capturing device for receiving light reflected from the surface under detection and converting it into electronic signals; and a processing control circuit for calculating displacement according to the electronic signals from the image capturing device, wherein the processing control circuit is capable of switching between the light sources.
摘要:
The present invention discloses an optical displacement detection apparatus and an optical displacement detection method. The optical displacement detection apparatus comprises: at least two light sources for projecting light of different spectrums to a surface under detection, respectively; an image capturing device for receiving light reflected from the surface under detection and converting it into electronic signals; and a processing control circuit for calculating displacement according to the electronic signals from the image capturing device, wherein the processing control circuit is capable of switching between the light sources.
摘要:
A calibration method for a driving current of a light source adapted to sequentially calibrate at least an optical navigation device, each including a light sensing device, a memory unit and a driving unit. The driving unit is electrically connected to the memory unit and a light source configured to receive a reflection light. The calibration method includes steps of: driving the light source to provide a beam through configuring the driving unit to supply a first driving current to the light source; configuring the light sensing device to generate a sensed light value; obtaining a second driving current through modulating the value of the first driving current according to the sensed light value; and recording the value of the second driving current in the memory unit and driving the light source to provide the beam according to the second driving current. A light sensing module is also provided.
摘要:
The present invention provides an ultra-violet light sensing device. The ultra-violet light sensing device includes a first conductivity type substrate, a second conductivity type region, and a first conductivity type high density region. The first conductivity type substrate includes a light incident surface. The second conductivity type region is disposed in the first conductivity type substrate and adjacent to the light incident surface. The first conductivity type high density region is disposed under the second conductivity type region. The present invention also provides another ultra-violet light sensing device, which further includes a first conductivity type high density shallow region which is sandwiched between the light incident surface and the second conductivity type region. Manufacturing methods for these ultra-violet light sensing devices are also disclosed in the present invention.
摘要:
A backside illuminated image sensor is provided which includes a substrate having a front side and a backside, a sensor formed in the substrate at the front side, the sensor including at least a photodiode, and a depletion region formed in the substrate at the backside, a depth of the depletion region is less than 20% of a thickness of the substrate.
摘要:
A method to fabricate an image sensor includes providing a semiconductor substrate having a pixel area and a logic area, forming a light sensing element in the pixel area, and forming a first transistor in the pixel area and a second transistor in the logic area. The step of forming the first transistor in the pixel area and the second transistor in the logic area includes performing a first implant process in the pixel area and the logic area, performing a second implant process in the pixel area and the logic area, and performing a third implant process only in the logic area.
摘要:
A distance-measuring device includes a light-emitting/sensing controlling circuit, a light-emitting component, a light-sensing group, a background-calculating circuit, a frequency-adjusting circuit, and a distance-calculating circuit. The light-emitting component emits a detecting light to a measured object. The light-emitting/sensing controlling circuit controls the light-sensing group receiving and accumulating the energy of a reflective light generated by the measured object reflecting the detecting light, so that the distance-calculating circuit can calculate a measured distance between the measured object and the distance-measuring device according the accumulated energy of the light-sensing group. In addition, the distance-measuring device calculates the energy accumulated by the light-sensing group sensing the background light per unit time, by means of the background-calculating circuit. In this way, the effect of the background light is reduced so that the distance-measuring device can more correctly calculate the measured distance.
摘要:
A method to fabricate an image sensor includes providing a semiconductor substrate having a pixel area and a logic area, forming a light sensing element in the pixel area, and forming a first transistor in the pixel area and a second transistor in the logic area. The step of forming the first transistor in the pixel area and the second transistor in the logic area includes performing a first implant process in the pixel area and the logic area, performing a second implant process in the pixel area and the logic area, and performing a third implant process only in the logic area.
摘要:
Provided is an image sensor device. The image sensor device includes a device substrate having a front side and a back side. The device substrate has a radiation-sensing region that can sense radiation that has a corresponding wavelength. The image sensor also includes a first layer formed over the front side of the device substrate. The first layer has a first refractive index and a first thickness that is a function of the first refractive index. The image sensor also has a second layer formed over the first layer. The second layer is different from the first layer and has a second refractive index and a second thickness that is a function of the second refractive index.