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60 条记录 (耗时 0.033 秒)

    Backlight apparatus reduced in thickness
    1.
    发明授权
    Backlight apparatus reduced in thickness 失效
    背光装置的厚度减小

    公开(公告)号：US07195364B2

    公开(公告)日：2007-03-27

    申请号：US11059406

    申请日：2005-02-17

    申请人： Hun Joo Hahm ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Anh ,  Young Sam Park ,  Bum Jin Kim ,  Young June Jeong

    发明人： Hun Joo Hahm ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Anh ,  Young Sam Park ,  Bum Jin Kim ,  Young June Jeong

    IPC分类号： G01D11/28

    CPC分类号： G02B6/0068 ,  G02B6/0016 ,  G02B6/0043 ,  G02F1/133603

    摘要： In a backlight apparatus for an LCD, a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.

    摘要翻译： 在用于LCD的背光装置中，多个条形的第一LED光源被布置在反射板上以横向发光。 多个浅色调布置在第一光源的上方。 透明板放置在浅色调之上。 散射图案形成在透明板底部的对应于浅色调的位置上。 在透明板的一侧设置条状的第二LED光源，以将光发射到透明板中。 布置在透明板一侧的光源防止了现有技术中的黑色区域的形成，从而增强了光的整体均匀性。 然后，即使应用于大型LCD也能够使背光装置保持薄型化。

    Side-emission type LED package
    4.
    发明授权
    Side-emission type LED package 有权
    侧面发射型LED封装

    公开(公告)号：US07473937B2

    公开(公告)日：2009-01-06

    申请号：US11318837

    申请日：2005-12-28

    申请人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    发明人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    IPC分类号： H01L29/22

    CPC分类号： H01L33/60 ,  F21K9/68 ,  H01L33/54

    摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

    摘要翻译： 提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。 如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

    LED package and backlight assembly for LCD comprising the same
    10.
    发明授权
    LED package and backlight assembly for LCD comprising the same 失效
    用于LCD的LED封装和背光组件包括相同的

    公开(公告)号：US07560745B2

    公开(公告)日：2009-07-14

    申请号：US11674493

    申请日：2007-02-13

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： H01L33/00 ,  F21V7/04 ,  G02F1/13357

    CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The LED package includes a substrate, one LED or more separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, provided with an upper surface including two curved surfaces having circular circumferential shapes, wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the LEDs. The LED package assures a sufficient optical traveling route therein without requiring a separate light guide plate, thereby emitting a white ray having uniform luminance.

    摘要翻译： LED封装包括基板，一个LED或更多的隔离指定间隔的LED或更多的布置在基板上的一行中的模制部分，以及用于密封包括LED的基板的上表面的模制部分，该模制部分设置有包括 两个具有圆周形状的曲面，其中每个曲面具有用于全反射从LED发射的光的曲率。 LED封装确保了其中的足够的光学行进路线，而不需要单独的导光板，从而发出具有均匀亮度的白光。