利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

26 条记录 (耗时 0.02 秒)

    Dimming structure for image display device
    1.
    发明授权
    Dimming structure for image display device 失效
    图像显示装置的调光结构

    公开(公告)号：US08508462B2

    公开(公告)日：2013-08-13

    申请号：US11647403

    申请日：2006-12-29

    申请人： Chul Hee Yoo ,  Ho Sik Ahn

    发明人： Chul Hee Yoo ,  Ho Sik Ahn

    IPC分类号： G09G3/36

    CPC分类号： G09G3/3406 ,  G09G2300/023 ,  G09G2320/066

    摘要： A dimming structure for an image display device further includes a contrast panel for altering contrast differences in a portion around an outputted image to achieve dimming effects on an image smaller than a light emitting lamp. In the dimming structure, a backlight unit has a plurality of light sources disposed therein. A display panel displays an image while the backlight unit is disposed to light the display panel. A contrast panel is disposed between the backlight unit and the display panel. The contrast panel has a light emitting window formed in a portion thereof corresponding to the image of the display panel to transmit light emitted from the backlight unit therethrough. The dimming structure assures uniform dimming effects on the portion around the image despite use of a light source bigger than the image to be outputted.

    摘要翻译： 用于图像显示装置的调光结构还包括对比度面板，用于改变输出图像周围部分的对比度差异，以实现对小于发光灯的图像的调光效果。 在调光结构中，背光单元具有设置在其中的多个光源。 显示面板在布置背光单元以点亮显示面板的同时显示图像。 对比度面板设置在背光单元和显示面板之间。 对比度面板具有形成在其对应于显示面板的图像的部分中的发光窗口，以透射从背光单元发射的光。 调光结构确保了对图像周围部分的均匀调光效果，尽管使用大于要输出的图像的光源。

    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
    2.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20110031526A1

    公开(公告)日：2011-02-10

    申请号：US12907348

    申请日：2010-10-19

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    Side-emission type LED package
    3.
    发明授权
    Side-emission type LED package 有权
    侧面发射型LED封装

    公开(公告)号：US07473937B2

    公开(公告)日：2009-01-06

    申请号：US11318837

    申请日：2005-12-28

    申请人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    发明人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    IPC分类号： H01L29/22

    CPC分类号： H01L33/60 ,  F21K9/68 ,  H01L33/54

    摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

    摘要翻译： 提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。 如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

    Light emitting diode package and fabrication method thereof
    4.
    发明申请
    Light emitting diode package and fabrication method thereof 审中-公开
    发光二极管封装及其制造方法

    公开(公告)号：US20070241362A1

    公开(公告)日：2007-10-18

    申请号：US11730965

    申请日：2007-04-05

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    Hinge device for camera-equipped mobile phones and mobile phone having such device
    5.
    发明授权
    Hinge device for camera-equipped mobile phones and mobile phone having such device 失效
    用于配备相机的移动电话的铰链装置和具有这种装置的手机

    公开(公告)号：US06785935B2

    公开(公告)日：2004-09-07

    申请号：US10397717

    申请日：2003-03-26

    申请人： Ho-Sik Ahn ,  Hyung-Suk Kim

    发明人： Ho-Sik Ahn ,  Hyung-Suk Kim

    IPC分类号： E05D1528

    CPC分类号： H04M1/0216 ,  E05F15/603 ,  E05F15/614 ,  E05Y2201/72 ,  E05Y2900/606 ,  H04M1/0218 ,  H04M1/0243 ,  H04M1/0264 ,  Y10T16/52 ,  Y10T16/5324 ,  Y10T16/533 ,  Y10T16/541

    摘要： The object of this invention is to provide a hinge device for camera-equipped mobile phones, and a mobile phone having such a hinge device. The hinge device allows the fold of a mobile phone to be automatically opened or closed relative to the main body, and allows automatic rotation of a digital camera of the phone. The hinge device includes a fixed hinge part (130), a rotary hinge part (110), a power generating means provided in the fold to generate a rotating drive force, an internal rotor (106) provided in the rotary hinge part, a camera (104) provided in the internal rotor, a rotation stop means for stopping rotation of the internal rotor and rotating the rotary hinge part using the rotating drive force, and a power transmission means connected to both the power generating means and the fixed hinge part to selectively perform power transmission.

    摘要翻译： 本发明的目的是提供一种用于装备相机的移动电话的铰链装置和具有这种铰链装置的移动电话。 铰链装置允许移动电话的折叠部相对于主体自动打开或关闭，并允许手机的数码相机的自动旋转。 铰链装置包括固定铰链部分（130），旋转铰链部分（110），设置在折叠中以产生旋转驱动力的发电装置，设置在旋转铰链部分中的内部转子（106），相机 （104），设置有用于停止所述内转子的旋转并使用所述旋转驱动力旋转所述旋转铰链部的旋转停止装置，以及连接到所述发电装置和所述固定铰链部的动力传递装置， 有选择地进行电力传输。

    Direct-type backlight unit having surface light source
    7.
    发明申请
    Direct-type backlight unit having surface light source 失效
    具有表面光源的直接型背光单元

    公开(公告)号：US20080007939A1

    公开(公告)日：2008-01-10

    申请号：US11822331

    申请日：2007-07-05

    申请人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

    发明人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

    IPC分类号： G09F13/04

    CPC分类号： G02F1/133603 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2933/005 ,  H01L2224/0401

    摘要： In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

    摘要翻译： 在直接型背光单元中，板具有限定其间厚度的上表面和下表面。 多个单元光源设置在板上。 这里，在各单位光源中，在基板上形成配线图案。 发光器件设置在布线图案上以与其电连接。 非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围，非导电侧壁的高度低于发光器件的高度。 此外，密封剂在侧壁内形成为圆顶形状。 以这种方式，发光器件通过板上芯片技术安装在板上。

    Light emitting diode package and fabrication method thereof
    9.
    发明授权
    Light emitting diode package and fabrication method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号：US08168453B2

    公开(公告)日：2012-05-01

    申请号：US12370802

    申请日：2009-02-13

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L21/56

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。