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公开(公告)号：US20120040592A1
公开(公告)日：2012-02-16
申请号：US12854432
申请日：2010-08-11
CPC分类号： B24B37/30 , B24B37/015
摘要： Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
摘要翻译： 本发明的实施例涉及用于提高抛光工艺的均匀性的装置和方法。 本发明的实施例提供了一种加热机构，其被配置为在抛光期间将热能施加到基板的周边，或者被配置为在抛光期间冷却基板的中心区域的冷却机构，或者构造成产生温度步骤的偏置加热机构 抛光垫的给定半径上的微分。
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公开(公告)号：US20140020829A1
公开(公告)日：2014-01-23
申请号：US13552377
申请日：2012-07-18
IPC分类号： B05C9/08
CPC分类号： B24B37/30 , B24B37/015
摘要： Sensors can be located in a carrier head for a chemical mechanical polishing system. In some implementations the carrier head includes a flexible membrane, and a thermocouple is positioned on the lower surface of the flexible membrane or embedded in the flexible membrane adjacent the lower surface. In some implementations, the carrier head optical sensor is secured to the head and positioned to sense a reflectivity of a spot on a back surface of a substrate held in the carrier head, and a controller is configured to receive a signal from the optical sensor and determine precession of the substrate based on the signal.
摘要翻译： 传感器可以位于用于化学机械抛光系统的载体头中。 在一些实施方案中，载体头包括柔性膜，并且热电偶位于柔性膜的下表面上或嵌入在柔性膜中，邻近下表面。 在一些实施方案中，载体头部光学传感器被固定到头部并被定位成感测保持在载体头部中的基底的背面上的斑点的反射率，并且控制器被配置为从光学传感器接收信号， 基于信号确定基板的进动。
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公开(公告)号：US08591286B2
公开(公告)日：2013-11-26
申请号：US12854432
申请日：2010-08-11
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/015
摘要： Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
摘要翻译： 本发明的实施例涉及用于提高抛光工艺的均匀性的装置和方法。 本发明的实施例提供了一种加热机构，其被配置为在抛光期间将热能施加到基板的周边，或者构造成在抛光期间冷却基板的中心区域的冷却机构，或者构造成产生温度步长的偏置加热机构 抛光垫的给定半径上的微分。
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公开(公告)号：US08460067B2
公开(公告)日：2013-06-11
申请号：US12720893
申请日：2010-03-10
IPC分类号： B24B5/00
摘要： A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.
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5.发明申请SUBSTRATE HOLDER TO REDUCE SUBSTRATE EDGE STRESS DURING CHEMICAL MECHANICAL POLISHING 审中-公开在化学机械抛光期间减少基板边缘应力的基板支架公开(公告)号：US20120021673A1
公开(公告)日：2012-01-26
申请号：US12840195
申请日：2010-07-20
CPC分类号： B24B37/32
摘要： Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include coupling a first substrate to be polished to a dummy substrate, and removing a portion of the backside of the first substrate to reduce the thickness of the first substrate. The first substrate and the dummy substrate are positioned in a carrier head assembly comprising an inflatable membrane and a support ring. The first substrate is placed in contact with a polishing pad to reduce the surface roughness of the backside of the first substrate. The support ring restricts lateral movement of the inflatable membrane to prevent the first substrate from contacting an interior surface of the carrier head assembly. The support ring is sized to allow vertical movement of the inflatable membrane within the carrier head assembly.
摘要翻译： 本发明的实施方案通常涉及用于化学机械抛光衬底的方法。 所述方法通常包括将要抛光的第一衬底耦合到虚设衬底，以及去除第一衬底的背面的一部分以减小第一衬底的厚度。 第一基板和虚设基板被定位在包括可充气膜和支撑环的载体头组件中。 将第一基板放置成与抛光垫接触以减小第一基板的背面的表面粗糙度。 支撑环限制可膨胀膜的横向移动，以防止第一基底接触载体头部组件的内表面。 支撑环的尺寸设置成允许可充气膜在承载头组件内的垂直运动。
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公开(公告)号：US20100291842A1
公开(公告)日：2010-11-18
申请号：US12720893
申请日：2010-03-10
摘要： A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.
摘要翻译： 提供了一种用于化学机械抛光的方法和装置，更具体地涉及一种用于化学机械抛光的载体的方法和装置。 在一个实施例中，承载头组件包括用于向衬底提供支撑的基座组件，安装在基座组件上的柔性膜，该柔性膜具有大致圆形中心部分，下表面提供衬底安装表面，以及多个可独立加压的腔室 形成在基部组件和柔性膜之间，包括环形外室和非圆形内腔。
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公开(公告)号：US20130149942A1
公开(公告)日：2013-06-13
申请号：US13762963
申请日：2013-02-08
IPC分类号： B24B41/06
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad.
摘要翻译： 用于承载头的内圈具有内表面，该内表面被构造成周向地围绕位于基板安装表面上的基板的边缘，外表面和下表面以接触抛光垫。 用于承载头的外圈具有周向围绕内圈的外表面，外表面和与抛光垫接触的下表面。
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公开(公告)号：US20140120803A1
公开(公告)日：2014-05-01
申请号：US13661603
申请日：2012-10-26
摘要： A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.
摘要翻译： 在化学机械抛光期间用于将基板保持在载体头下方的保持环包括环形下部和固定到下部的环形上部。 环形下部具有主体，其具有用于在抛光期间接触抛光垫的底表面，并且是第一材料。 上部的上表面构造成固定到承载头。 上部是比第一材料更刚性的第二材料。 选择下部的厚度和刚度用于特定的抛光环境以改善靠近基底边缘的抛光均匀性。
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公开(公告)号：US08721391B2
公开(公告)日：2014-05-13
申请号：US13204571
申请日：2011-08-05
IPC分类号： B24B37/32
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
摘要翻译： 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。 内环具有被构造为周向地围绕位于基板安装表面上的基板的边缘的内表面，外表面和与抛光垫接触的下表面。 内环可相对于基板安装表面垂直移动。 外环具有围绕内环的内表面，外表面和与抛光垫接触的下表面。 外环可相对于基板安装表面和内圈而相对并且独立于其上下移动。 内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。
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公开(公告)号：US20120034849A1
公开(公告)日：2012-02-09
申请号：US13204571
申请日：2011-08-05
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
摘要翻译： 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。 内环具有被构造为周向地围绕位于基板安装表面上的基板的边缘的内表面，外表面和与抛光垫接触的下表面。 内环可相对于基板安装表面垂直移动。 外环具有围绕内环的内表面，外表面和与抛光垫接触的下表面。 外环可相对于基板安装表面和内圈而相对并且独立于其上下移动。 内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。
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