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公开(公告)号：US08721391B2
公开(公告)日：2014-05-13
申请号：US13204571
申请日：2011-08-05
IPC分类号： B24B37/32
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
摘要翻译： 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。 内环具有被构造为周向地围绕位于基板安装表面上的基板的边缘的内表面，外表面和与抛光垫接触的下表面。 内环可相对于基板安装表面垂直移动。 外环具有围绕内环的内表面，外表面和与抛光垫接触的下表面。 外环可相对于基板安装表面和内圈而相对并且独立于其上下移动。 内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。
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公开(公告)号：US20130149942A1
公开(公告)日：2013-06-13
申请号：US13762963
申请日：2013-02-08
IPC分类号： B24B41/06
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad.
摘要翻译： 用于承载头的内圈具有内表面，该内表面被构造成周向地围绕位于基板安装表面上的基板的边缘，外表面和下表面以接触抛光垫。 用于承载头的外圈具有周向围绕内圈的外表面，外表面和与抛光垫接触的下表面。
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公开(公告)号：US20120034849A1
公开(公告)日：2012-02-09
申请号：US13204571
申请日：2011-08-05
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
摘要翻译： 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。 内环具有被构造为周向地围绕位于基板安装表面上的基板的边缘的内表面，外表面和与抛光垫接触的下表面。 内环可相对于基板安装表面垂直移动。 外环具有围绕内环的内表面，外表面和与抛光垫接触的下表面。 外环可相对于基板安装表面和内圈而相对并且独立于其上下移动。 内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。
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公开(公告)号：US20180021918A1
公开(公告)日：2018-01-25
申请号：US15658294
申请日：2017-07-24
申请人： Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
发明人： Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
IPC分类号： B24B37/32 , H01L21/67 , H01L21/687 , H01L21/306
CPC分类号： B24B37/32 , H01L21/30625 , H01L21/67063 , H01L21/67092 , H01L21/68735
摘要： A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.
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5.发明授权公开(公告)号：US06811470B2
公开(公告)日：2004-11-02
申请号：US10194560
申请日：2002-07-12
申请人： Benjamin A. Bonner , Anand N. Iyer , Deepak N. Kumar , Thomas H. Osterheld , Wei-Yung Hsu , Yong-Sik R. Kim , Christopher W. Smith , Huanbo Zhang
发明人： Benjamin A. Bonner , Anand N. Iyer , Deepak N. Kumar , Thomas H. Osterheld , Wei-Yung Hsu , Yong-Sik R. Kim , Christopher W. Smith , Huanbo Zhang
IPC分类号： B24B100
CPC分类号： H01L21/31053 , C09G1/02 , H01L21/76229
摘要： Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.
摘要翻译： 提供的方法和组合物用于在表面形貌中具有减少或最小缺陷的平面化基板表面。 在一个方面，提供一种用于处理衬底的方法，包括将包括至少第一介电材料的衬底和设置在其上的第二电介质材料定位在抛光设备中，用具有第一选择性的第一抛光组合物抛光衬底，以及抛光衬底 其具有比第一选择性更大的第二选择性的第二抛光组合物。
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公开(公告)号：US08774958B2
公开(公告)日：2014-07-08
申请号：US13098257
申请日：2011-04-29
申请人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
发明人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
CPC分类号： B24B37/005 , B24B37/042 , G05B19/182 , G05B2219/45232 , G05D16/20
摘要： Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
摘要翻译： 为化学机械抛光系统的多个可控参数选择值，其包括具有多个区域的载体头，以在基底上施加独立的可控压力。 存储数据存储在基板的前表面上的去除轮廓的变化，以改变可控参数，包括在基板的前表面上的多个位置处的去除的数据，存在比腔更多的位置数量。 为多个可控参数的每个参数确定一个值，以最小化目标去除曲线与根据数据相关的预期去除曲线之间的差异，该数据与基板的前表面上的去除曲线的变化相关，参数的变化。 存储多个可控参数的每个参数的值。
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公开(公告)号：US20120277897A1
公开(公告)日：2012-11-01
申请号：US13098257
申请日：2011-04-29
申请人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
发明人： Huanbo Zhang , Garrett Ho Yee Sin , King Yi Heung , Nathan Bohannon , Qing Zhang
IPC分类号： G06F19/00
CPC分类号： B24B37/005 , B24B37/042 , G05B19/182 , G05B2219/45232 , G05D16/20
摘要： Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
摘要翻译： 为化学机械抛光系统的多个可控参数选择值，其包括具有多个区域的载体头，以在基底上施加独立的可控压力。 存储数据存储在基板的前表面上的去除轮廓的变化，以改变可控参数，包括在基板的前表面上的多个位置处的去除的数据，存在比腔更多的位置数量。 为多个可控参数的每个参数确定一个值，以最小化目标去除曲线与根据数据相关的预期去除曲线之间的差异，该数据与基板的前表面上的去除曲线的变化相关，参数的变化。 存储多个可控参数的每个参数的值。
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