公开(公告)号：US07344434B2

公开(公告)日：2008-03-18

申请号：US10988211

申请日：2004-11-12

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Stacy Meyer ,  Trung T. Doan ,  Daniel Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Stacy Meyer ,  Trung T. Doan ,  Daniel Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B5/00

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：US07927190B2

公开(公告)日：2011-04-19

申请号：US12049650

申请日：2008-03-17

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B5/00

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US20080196833A1

公开(公告)日：2008-08-21

申请号：US12049650

申请日：2008-03-17

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： H01L21/306 ,  B24B1/00

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：US08585468B2

公开(公告)日：2013-11-19

申请号：US13305589

申请日：2011-11-28

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B5/00

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US20120071067A1

公开(公告)日：2012-03-22

申请号：US13305589

申请日：2011-11-28

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B41/06

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：US08066551B2

公开(公告)日：2011-11-29

申请号：US13089174

申请日：2011-04-18

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B1/00

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：US20110195639A1

公开(公告)日：2011-08-11

申请号：US13089174

申请日：2011-04-18

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B1/00 ,  B23P19/00

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨过程中，可以允许环绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：US06913518B2

公开(公告)日：2005-07-05

申请号：US10430912

申请日：2003-05-06

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Thomas H. Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Thomas H. Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

IPC分类号： B24B37/16 ,  B24B41/047 ,  B24B7/22

CPC分类号： B24B37/16

摘要： A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.

公开(公告)号：US07115024B2

公开(公告)日：2006-10-03

申请号：US11029287

申请日：2005-01-05

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Thomas H. Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Thomas H. Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

IPC分类号： B24B7/22

CPC分类号： B24B37/16

摘要： A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.

摘要翻译： 用于基板的化学机械抛光的压板包括可以放置抛光垫的表面，支撑结构和控制器。 表面具有第一区域和第二区域，并且可操作以在抛光期间对抛光垫施加力。 支撑结构位于第二区域下方并且可操作以使第二区域施加比第一区域更多的力。 控制器可操作以调节由第二区域施加的力的量。

公开(公告)号：US20090318060A1

公开(公告)日：2009-12-24

申请号：US12489132

申请日：2009-06-22

申请人： Sivakumar Dhandapani ,  Stan D. Tsai ,  Daxin Mao ,  Sameer Deshpande ,  Shou-Sung Chang ,  Gregory E. Menk ,  Charles C. Garretson ,  Jason Garcheung Fung ,  Christopher D. Cocca ,  Hung Chih Chen

发明人： Sivakumar Dhandapani ,  Stan D. Tsai ,  Daxin Mao ,  Sameer Deshpande ,  Shou-Sung Chang ,  Gregory E. Menk ,  Charles C. Garretson ,  Jason Garcheung Fung ,  Christopher D. Cocca ,  Hung Chih Chen

IPC分类号： B24B51/00 ,  B24B53/02

CPC分类号： B24B49/18 ,  B24B37/005 ,  B24B37/042

摘要： A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

摘要翻译： 提供了一种用于调理抛光垫的方法和装置。 调节元件由可旋转地安装到枢轴点处的基座的调节臂保持。 执行器绕枢轴点枢转臂。 调理元件被推靠在抛光垫的表面上，并相对于抛光垫平移以从抛光垫移除材料并使其表面变粗糙。 研磨调理表面与抛光垫表面的相互作用产生摩擦力。 可以通过监视施加到枢转点的扭矩来监测摩擦力，并且由此控制材料移除。 调节垫的调节时间，下压力，平移速率或旋转可以基于测量的扭矩来调节。