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    Semiconductor nano-wire devices and methods of fabrication
    1.
    发明授权
    Semiconductor nano-wire devices and methods of fabrication 有权
    半导体纳米线器件及其制造方法

    公开(公告)号：US07452778B2

    公开(公告)日：2008-11-18

    申请号：US11104348

    申请日：2005-04-12

    申请人： Hung-Wei Chen ,  Yee-Chia Yeo ,  Di-Hong Lee ,  Fu-Liang Yang ,  Chenming Hu

    发明人： Hung-Wei Chen ,  Yee-Chia Yeo ,  Di-Hong Lee ,  Fu-Liang Yang ,  Chenming Hu

    IPC分类号： H01L21/336

    CPC分类号： H01L29/42384 ,  B82Y10/00 ,  H01L21/324 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66795 ,  H01L29/7854 ,  H01L29/78645 ,  H01L29/78696

    摘要： Nano-wires, preferably of less than 20 nm diameter, can be formed with minimized risk of narrowing and breaking that results from silicon atom migration during an annealing process step. This is accomplished by masking portion of the active layer where silicon atomer would otherwise agglomerate with a material such as silicon dioxide, silicon nitride, or other dielectric that eliminates or substantially reduces the silicon atom migration. Nano-wires, nanotubes, nano-rods, and other features can be formed and can optionally be incorporated into devices, such as by use as a channel region in a transistor device.

    摘要翻译： 可以形成直径小于20nm的纳米线，其最小化是在退火工艺步骤期间硅原子迁移导致的变窄和断裂的风险。 这是通过掩蔽有源层的一部分来实现的，其中硅一方面将以诸如二氧化硅，氮化硅或其它电介质的材料聚集，其消除或基本上减少硅原子迁移。 可以形成纳米线，纳米管，纳米棒和其它特征，并且可以可选地并入器件中，例如用作晶体管器件中的沟道区。

    Doping of semiconductor fin devices
    5.
    发明授权
    Doping of semiconductor fin devices 有权
    掺杂半导体鳍片器件

    公开(公告)号：US08790970B2

    公开(公告)日：2014-07-29

    申请号：US11446697

    申请日：2006-06-05

    申请人： Yee-Chia Yeo ,  Ping-Wei Wang ,  Hao-Yu Chen ,  Fu-Liang Yang ,  Chenming Hu

    发明人： Yee-Chia Yeo ,  Ping-Wei Wang ,  Hao-Yu Chen ,  Fu-Liang Yang ,  Chenming Hu

    IPC分类号： H01L21/84

    CPC分类号： H01L29/785 ,  H01L21/26586 ,  H01L29/66803

    摘要： A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface.

    摘要翻译： 半导体结构包括覆盖绝缘体层的多个半导体鳍片，覆盖所述半导体鳍片的一部分的栅极电介质和覆盖栅极电介质的栅电极。 每个半导体翅片具有顶表面，第一侧壁表面和第二侧壁表面。 掺杂离子相对于半导体鳍片的顶表面的法线以第一角度（例如，大于约7°）注入，以掺杂第一侧壁表面和顶表面。 相对于半导体鳍片的顶表面的法线注入另外的掺杂剂离子以掺杂第二侧壁表面和顶表面。

    Gate electrode for a semiconductor fin device
    7.
    发明申请
    Gate electrode for a semiconductor fin device 有权
    用于半导体鳍片器件的栅电极

    公开(公告)号：US20070111454A1

    公开(公告)日：2007-05-17

    申请号：US11649453

    申请日：2007-01-03

    申请人： Yee-Chia Yeo ,  Hao-Yu Chen ,  Fu-Liang Yang ,  Chenming Hu

    发明人： Yee-Chia Yeo ,  Hao-Yu Chen ,  Fu-Liang Yang ,  Chenming Hu

    IPC分类号： H01L21/336

    CPC分类号： H01L29/785 ,  H01L29/66795

    摘要： A method for forming a gate electrode for a multiple gate transistor provides a doped, planarized gate electrode material which may be patterned using conventional methods to produce a gate electrode that straddles the active area of the multiple gate transistor and has a constant transistor gate length. The method includes forming a layer of gate electrode material having a non-planar top surface, over a semiconductor fin. The method further includes planarizing and doping the gate electrode material, without doping the source/drain active areas, then patterning the gate electrode material. Planarization of the gate electrode material may take place prior to the introduction and activation of dopant impurities or it may follow the introduction arid activation of dopant impurities. After the gate electrode is patterned, dopant impurities are selectively introduced to the semiconductor fin to form source/drain regions.

    摘要翻译： 用于形成多栅极晶体管的栅电极的方法提供掺杂的平面化栅电极材料，其可以使用常规方法进行图案化以产生跨越多栅极晶体管的有源区并具有恒定晶体管栅极长度的栅电极。 该方法包括在半导体鳍上形成具有非平面顶表面的栅电极材料层。 该方法还包括对栅电极材料进行平面化和掺杂，而不掺杂源极/漏极有源区，然后对栅电极材料进行构图。 栅电极材料的平面化可以在引入和激活掺杂剂杂质之前进行，或者可以引入和掺杂杂质的激活。 在栅电极被图案化之后，掺杂剂杂质被选择性地引入半导体鳍片以形成源极/漏极区域。

    CMOS inverters configured using multiple-gate transistors
    8.
    发明授权
    CMOS inverters configured using multiple-gate transistors 有权
    使用多栅极晶体管配置的CMOS反相器

    公开(公告)号：US07214991B2

    公开(公告)日：2007-05-08

    申请号：US10313887

    申请日：2002-12-06

    申请人： Yee-Chia Yeo ,  Fu-Liang Yang ,  Chenming Hu

    发明人： Yee-Chia Yeo ,  Fu-Liang Yang ,  Chenming Hu

    IPC分类号： H01L29/76

    CPC分类号： H01L27/1211 ,  H01L21/823828 ,  H01L21/845 ,  H01L27/092 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/7854

    摘要： An inverter that includes a first multiple-gate transistor including a source connected to a power supply, a drain connected to an output terminal, and a gate electrode; a second multiple-gate transistor including a source connected to a ground, a drain connected to the output terminal, and a gate electrode; and an input terminal connected to the gate electrodes of the first and second multiple-gate transistors. Each of the first and second multiple-gate transistors may further include a semiconductor fin formed vertically on an insulating layer on top of a substrate, a gate dielectric layer overlying the semiconductor fin, and a gate electrode wrapping around the semiconductor fin separating the source and drain regions.

    摘要翻译： 一种逆变器，包括：第一多栅极晶体管，其包括连接到电源的源极，连接到输出端子的漏极和栅极电极; 第二多栅极晶体管，其包括连接到地的源极，连接到输出端子的漏极和栅极电极; 以及连接到第一和第二多栅极晶体管的栅电极的输入端子。 第一和第二多栅极晶体管中的每一个还可以包括在衬底顶部的绝缘层上垂直形成的半导体鳍片，覆盖在半导体鳍片上的栅极电介质层，以及围绕分离源极的半导体鳍状物包围的栅电极，以及 漏区。

    Doping of semiconductor fin devices
    9.
    发明申请
    Doping of semiconductor fin devices 有权

    公开(公告)号：US20060220133A1

    公开(公告)日：2006-10-05

    申请号：US11446890

    申请日：2006-06-05

    申请人： Yee-Chia Yeo ,  Ping-Wei Wang ,  Hao-Yu Chen ,  Fu-Liang Yang ,  Chenming Hu

    发明人： Yee-Chia Yeo ,  Ping-Wei Wang ,  Hao-Yu Chen ,  Fu-Liang Yang ,  Chenming Hu

    IPC分类号： H01L27/12

    CPC分类号： H01L29/785 ,  H01L21/26586 ,  H01L29/66803

    摘要： A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface.