摘要:
A semiconductor memory device for minimizing the resistance attendant on reaching as far as each sense amplifier connected to a memory cell. A first plurality of power supply lines are alternatively disposed between column select lines which is formed over a plurality of lines of semiconductor memory device in a column direction. The first plurality of power supply lines the first plurality of ground lines are connected to a second plurality of power supply lines and a second plurality of ground lines which are disposed under the column select lines in a row direction, to thereby provide a netlike power supply structure. Consequently, the operating speed of a chip is improved by minimizing the resistance attendant on reaching as far as the sense amplifiers connected to each memory cell and the efficiency of the semiconductor memory device is greatly promoted by suppressing a coupling phenomenon caused between the column select lines.
摘要:
A semiconductor memory device has adjacent memory arrays and isolation transistors disposed between a common bit sense amplifier and the memory arrays. An isolation control circuit according the present invention generates the power supply voltage Vcc (not the boost voltage Vpp) during the burn-in mode of operation, so that the gate oxide layer of the isolation transistors is prevented from being destroyed or deteriorated.
摘要:
A novel parallel bit test circuit is provided to test a semiconductor memory device which comprises a number of memory cell arrays each having a plurality of memory cells, a word line provided in each memory cell array to commonly connect with the plurality of memory cells, and a plurality of I/O (input/output) lines respectively connected with the plurality of memory cells of each memory cell array. The parallel bit test circuit for testing the plurality of memory cells in parallel bits comprises a comparator for comparing the data of the memory cells with an externally input data to produce a test signal applied to a data I/O terminal.
摘要:
A column redundancy circuit for a semiconductor memory device, e.g., a DRAM, which includes a normal memory array comprised of a plurality of memory blocks each comprised of a matrix of rows and columns of memory cells, with at least two of the memory blocks sharing common columns, and with at least one of the columns being defective, in the sense of being connected to at least one memory cell which has been determined to be defective. The column redundancy circuit includes a plurality of redundant columns, block selection control circuit which is programmed to generate a first output signal in response to receipt of a memory block address signal corresponding to one or more of the memory blocks which contain the defective column, a column address decoder which is programmed to generate a second output signal in response to receipt of both the first output signal and a column address signal corresponding to the defective column, and, a redundant column driver circuit which is responsive to the second output signal for activating a predetermined one of the redundant columns, to thereby repair the defective column. In a preferred embodiment, the block selection control circuit and the column address decoder each include a plurality of fuses and are each programmed by means of a selected one or more of their fuses being blown, e.g., by use of a laser.
摘要:
An arrangement of a word line driver stage for semiconductor memory device is disclosed. The present invention is characterized in that a word line driver stages are into several sub-stages WD11-WD51 within a memory cell array, and each word line extending from a first one or a second one of the sub-stages is alternatively coupled to the sub-stage adjacent thereto. Thus this arrangement is capable of reducing the signal transmission delay and eliminating the adverse factor in the current critical design rule and layout.
摘要:
There is disclosed a redundant device for a semiconductor memory device comprising a plurality of normal cell arrays each having sense amplifier comprising an isolation gate for isolating or connecting the bit lines between adjacent ones of the normal cell arrays in response to isolation signal, a redundant cell array connected only with one of the adjacent redundant cell arrays, a control signal generating device for generating the isolation signal and a sensing signal to control the sense amplifiers respectively corresponding with the normal cell array connected with the redundant cell array and the normal cell array not connected with the redundant cell array, and device for generating a redundant control signal in response to a defect of an externally inputted address signal and a signal to select a word line of the redundant cell array.
摘要:
A test control circuit and method of testing a memory cell in a semiconductor memory device. The test control circuit includes a memory cell array having a plurality of normal memory cells to store data on a semiconductor substrate and a plurality of redundancy memory cells to substitute for defective normal memory cells. Row and column redundancy fuse boxes include fuse elements to be electrically fused to enable row and column redundancy decoders for selecting rows and columns of the redundancy memory cells. A redundancy cell test signal generator generates, in response to a test signal applied to an extra line in the address bus, a master clock for testing the redundancy memory cell under the same mode as a test mode of the normal memory cell. A test controller provides an enable signal for selecting the redundancy memory cells of a memory array in response to logic levels of the master clock and an address signal applied during the redundancy memory cell test.
摘要:
An active power supply voltage boosting circuit for a semiconductor memory device according to the present invention causes operation of the active cycle boosted voltage generating circuit to elevate the level of the boosted power supply voltage V.sub.PP when the detected level of the boosted power supply voltage V.sub.PP is lower than a target voltage level. Thus, the boosted power supply voltage V.sub.PP can be stably maintained to the target voltage level. When the boosted power supply voltage V.sub.PP becomes higher than the target voltage level, generation of the boosted power supply voltage V.sub.PP is stopped, and as a result, unwanted consumption of the electrical current and also the damage to the semiconductor memory device by high voltage can be prevented.
摘要:
A semiconductor memory device using a low level supply voltage has separation gates for isolating adjacent bit lines. The device may be constructed with a circuit for receiving a high voltage supplied by a high voltage generator resident upon the chip so as to provide the separation gates with a voltage increased at least by the amount of the threshold voltage of the separation gates over the supply voltage.
摘要:
A defective cell repairing circuit for repairing a defective cell in a packaged semiconductor memory device enables repair mode operations for mapping an address of a detected defective cell to a redundant cell. The address of the defective cell is programmed by selectively cutting fuses corresponding to each bit of the defective cell address. The defective cell address programming operation uses input terminals on the packaged semiconductor memory device which are used for address signals in a normal operation mode, so that no additional pins are required. Repair mode operations are prevented after the repair mode is completed. Thereafter, an external address supplied to the semiconductor memory device is compared with the programmed defective cell address determined by the state of the fuses, and a redundant cell is selected if the two addresses correspond.