公开(公告)号：US20130178685A1

公开(公告)日：2013-07-11

申请号：US13821031

申请日：2010-09-27

申请人： Hyun-je Cho ,  Deuk-man Kim ,  Cheon-woo Kim ,  Jong-kil Park ,  Young-bu Choi

发明人： Hyun-je Cho ,  Deuk-man Kim ,  Cheon-woo Kim ,  Jong-kil Park ,  Young-bu Choi

IPC分类号： G21F9/30

CPC分类号： G21F9/30 ,  B30B11/201 ,  B30B11/228 ,  G21F9/28 ,  G21F9/301 ,  G21F9/305 ,  Y10S422/903 ,  Y10S588/90

摘要： An apparatus and method for the granulation of radioactive waste in which a preprocessing method for the vitrification of radioactive waste is simplified to conform to onsite conditions of a nuclear power plant, additives are improved, and pellets suitable for vitrification are manufactured. The apparatus for the granulation of radioactive waste includes: a body frame having an inlet and an outlet; a hopper supplying the radioactive waste to be transferred and fed through the inlet; a feeder transferring/supplying the radioactive waste supplied to a specific position and in a certain quantity; a stirrer pulverizing/mixing lumps of the radioactive waste supplied; an additive supply part supplying a lubricant to the radioactive waste fed into the stirrer; and a pellet press pressing the radioactive waste fed through the feeder into a pellet shape and discharging the pellet through the outlet.

摘要翻译： 用于放射性废物造粒的装置和方法，其中放射性废物玻璃化的预处理方法被简化以符合核电厂的现场条件，添加剂得到改进，并且制造适于玻璃化的颗粒。 用于造粒放射性废物的装置包括：具有入口和出口的主体框架; 供给放射性废物的料斗通过入口供给; 供应商将供应的放射性废物转移/供应给特定位置和一定量; 搅拌器粉碎/混合供应的放射性废物块; 添加剂供给部，向供给到搅拌器的放射性废物供给润滑剂; 以及将通过进料器进料的放射性废料压成颗粒形状并通过出口排出颗粒的颗粒压块。

公开(公告)号：US08946498B2

公开(公告)日：2015-02-03

申请号：US13821031

申请日：2010-09-27

申请人： Hyun-je Cho ,  Deuk-man Kim ,  Cheon-woo Kim ,  Jong-kil Park ,  Young-bu Choi

发明人： Hyun-je Cho ,  Deuk-man Kim ,  Cheon-woo Kim ,  Jong-kil Park ,  Young-bu Choi

IPC分类号： G21F9/28 ,  G21F9/30 ,  B30B11/20 ,  B30B11/22

CPC分类号： G21F9/30 ,  B30B11/201 ,  B30B11/228 ,  G21F9/28 ,  G21F9/301 ,  G21F9/305 ,  Y10S422/903 ,  Y10S588/90

摘要： An apparatus and method for the granulation of radioactive waste in which a preprocessing method for the vitrification of radioactive waste is simplified to conform to onsite conditions of a nuclear power plant, additives are improved, and pellets suitable for vitrification are manufactured. The apparatus for the granulation of radioactive waste includes: a body frame having an inlet and an outlet; a hopper supplying the radioactive waste to be transferred and fed through the inlet; a feeder transferring/supplying the radioactive waste supplied to a specific position and in a certain quantity; a stirrer pulverizing/mixing lumps of the radioactive waste supplied; an additive supply part supplying a lubricant to the radioactive waste fed into the stirrer; and a pellet press pressing the radioactive waste fed through the feeder into a pellet shape and discharging the pellet through the outlet.

摘要翻译： 用于放射性废物造粒的装置和方法，其中放射性废物玻璃化的预处理方法被简化以符合核电厂的现场条件，添加剂得到改进，并且制造适于玻璃化的颗粒。 用于造粒放射性废物的装置包括：具有入口和出口的主体框架; 供给放射性废物的料斗通过入口供给; 供应商将供应的放射性废物转移/供应给特定位置和一定量; 搅拌器粉碎/混合供应的放射性废物块; 添加剂供给部，向供给到搅拌器的放射性废物供给润滑剂; 以及将通过进料器进料的放射性废料压成颗粒形状并通过出口排出颗粒的颗粒压块。

公开(公告)号：US20120181559A1

公开(公告)日：2012-07-19

申请号：US13347163

申请日：2012-01-10

申请人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

发明人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

IPC分类号： H01L33/50 ,  H01L33/58

CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。

公开(公告)号：US08564005B2

公开(公告)日：2013-10-22

申请号：US13347163

申请日：2012-01-10

申请人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

发明人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

IPC分类号： H01L33/50

CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。

公开(公告)号：US08513680B2

公开(公告)日：2013-08-20

申请号：US13234971

申请日：2011-09-16

申请人： Daniel Kim ,  Jae-sung You ,  Jong-kil Park

发明人： Daniel Kim ,  Jae-sung You ,  Jong-kil Park

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.

公开(公告)号：US20120153327A1

公开(公告)日：2012-06-21

申请号：US13234971

申请日：2011-09-16

申请人： Daniel Kim ,  Jae-sung You ,  Jong-kil Park

发明人： Daniel Kim ,  Jae-sung You ,  Jong-kil Park

IPC分类号： H01L33/60 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.

摘要翻译： 一种发光器件封装，包括由金属形成的引线框架，其上安装有发光器件芯片; 以及通过注射成型联接到引线框架的模框。 引线框架包括：安装有发光器件芯片的安装部分; 以及第一和第二连接部分，其在第一方向上设置在安装部分的两侧，并且通过引线接合连接到发光器件芯片，其中第一连接部分相对于安装部分是阶梯状的，并且台阶 量小于引线框架的材料厚度。