CURABLE MATERIAL AND METHOD FOR MOLDING SAID THERMALLY CURABLE MATERIAL

    公开(公告)号:US20200157257A1

    公开(公告)日:2020-05-21

    申请号:US16626812

    申请日:2018-06-29

    Abstract: The present invention provides a thermosetting material, which contains the following components (A) to (C) and which, when measured with a rotational viscometer at a constant shear rate (JIS K7117-2:1999), exhibits a viscosity at 25° C. and 10 s1 of 5 Pa·s or more and 200 Pa·s or less and, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity at 25° C. and a shear rate of 100 s1 of 0.3 Pa·s or more and 50 Pa·s or less. (A): a (meth) acrylate compound in which a substituted or unsubstituted alicyclic hydrocarbon group having 6 or more carbon atoms is ester-bonded, and which, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity of 5 to 300 mPa·s as a viscosity measured at 25° C. and 10 to 100 s−1; (B): spherical silica; and (C): a black pigment.

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