公开(公告)号：US11565252B2

公开(公告)日：2023-01-31

申请号：US16706332

申请日：2019-12-06

Applicant: ILLUMINA, INC.

Inventor： Darren Segale ,  Hai Tran ,  Paul Crivelli

IPC: B01L3/00 ,  C12Q1/6837 ,  B01J19/00 ,  B01L9/00

Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).

公开(公告)号：US20250164399A1

公开(公告)日：2025-05-22

申请号：US19027132

申请日：2025-01-17

Applicant: Illumina, Inc.

Inventor： Tracy Helen Fung ,  Xiuyu Cai ,  Lisa Kwok ,  Hai Tran ,  Kevan Samiee ,  Liangliang Qiang ,  Boyan Boyanov

IPC: G01N21/64 ,  B01L3/00 ,  G01N15/1434 ,  G01N21/77

Abstract: An example sensor includes a flow cell, a detection device, and a controller. The flow cell includes a passivation layer having opposed surfaces and a reaction site at a first of the opposed surfaces. The flow cell also includes a lid operatively connected to the passivation layer to partially define a flow channel between the lid and the reaction site. The detection device is in contact with a second of the opposed surfaces of the passivation layer, and includes an embedded metal layer that is electrically isolated from other detection circuitry of the detection device. The controller is to ground the embedded metal layer.

公开(公告)号：US11680906B2

公开(公告)日：2023-06-20

申请号：US16607354

申请日：2018-04-19

Applicant: ILLUMINA, INC.

Inventor： Tracy Helen Fung ,  Xiuyu Cai ,  Lisa Kwok ,  Hai Tran ,  Kevan Samiee ,  Liangliang Qiang ,  Boyan Boyanov

IPC: G01N21/64 ,  G01N21/77 ,  B01L3/00 ,  G01N15/14

CPC classification number: G01N21/6454 ,  B01L3/502715 ,  G01N15/1436 ,  G01N21/6486 ,  G01N21/7703 ,  G01N2021/7763

Abstract: An example sensor includes a flow cell, a detection device, and a controller. The flow cell includes a passivation layer having opposed surfaces and a reaction site at a first of the opposed surfaces. The flow cell also includes a lid operatively connected to the passivation layer to partially define a flow channel between the lid and the reaction site. The detection device is in contact with a second of the opposed surfaces of the passivation layer, and includes an embedded metal layer that is electrically isolated from other detection circuitry of the detection device. The controller is to ground the embedded metal layer.

公开(公告)号：US20230146020A1

公开(公告)日：2023-05-11

申请号：US18051674

申请日：2022-11-01

Applicant: Illumina, Inc.

Inventor： Ravi Billa ,  Arvin Emadi ,  Hai Tran

IPC: B01L3/00

CPC classification number: B01L3/502761 ,  G01N2021/6439

Abstract: Examples herein include an apparatus having a substrate, a sensor over the substrate including an active surface and a sensor bond pad, a molding layer over the substrate and covering sides of the sensor, the molding layer having a lower portion with a first molding height relative to a top surface of the substrate and an upper portion with a second molding height relative to the top surface of the substrate, the first molding height and the second molding height each being greater than a height of the active surface, the second molding height being great than the first molding height; and a lidding layer over at least some of the lower portion of the molding layer and over the active surface. The lidding layer and the molding layer form a space over the active surface of the sensor that defines a flow channel.

公开(公告)号：US12151240B2

公开(公告)日：2024-11-26

申请号：US18154563

申请日：2023-01-13

Applicant: ILLUMINA, INC.

Inventor： Darren Segale ,  Hai Tran ,  Paul Crivelli

IPC: B01L3/00 ,  B01J19/00 ,  B01L9/00 ,  C12Q1/6837

Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).

公开(公告)号：US10518263B2

公开(公告)日：2019-12-31

申请号：US16264146

申请日：2019-01-31

Applicant: Illumina, Inc.

Inventor： Darren Segale ,  Hai Tran ,  Paul Crivelli

IPC: A61J1/06 ,  H01S4/00 ,  G01N35/00 ,  G01N15/06 ,  G01N33/00 ,  G01N33/48 ,  B01L3/00 ,  B01J19/00 ,  B01L9/00

Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).

公开(公告)号：US20190240660A1

公开(公告)日：2019-08-08

申请号：US16264146

申请日：2019-01-31

Applicant: Illumina, Inc.

Inventor： Darren Segale ,  Hai Tran ,  Paul Crivelli

IPC: B01L3/00

Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).

公开(公告)号：US20250164386A1

公开(公告)日：2025-05-22

申请号：US19028124

申请日：2025-01-17

Applicant: Illumina, Inc.

Inventor： Donglai Lu ,  Xiuyu Cai ,  Wenyi Feng ,  Hai Tran

IPC: G01N21/05 ,  B01L3/00 ,  H10F39/18

Abstract: Disclosed is an apparatus and method of forming, including a supporting structure, a sensor on the supporting structure, a pair of columns on the supporting structure at opposite sides of the sensor, the pair of columns having a column height relative to a top surface of the supporting structure, the column height being higher than a height of the active surface of the sensor relative to the top surface of the supporting structure, and a lidding layer on the pair of columns and over the active surface, the lidding layer being supported at opposite ends by the pair of columns. The active surface of the sensor, the lidding layer and the pair of columns form an opening above at least more than about half of the active surface of the sensor, and the supporting structure, the sensor, the lidding layer and the pair of columns together form a flow cell.

公开(公告)号：US12241835B2

公开(公告)日：2025-03-04

申请号：US18313015

申请日：2023-05-05

Applicant: ILLUMINA, INC.

Inventor： Tracy Helen Fung ,  Xiuyu Cai ,  Lisa Kwok ,  Hai Tran ,  Kevan Samiee ,  Liangliang Qiang ,  Boyan Boyanov

IPC: G01N21/64 ,  B01L3/00 ,  G01N15/1434 ,  G01N21/77

Abstract: An example sensor includes a flow cell, a detection device, and a controller. The flow cell includes a passivation layer having opposed surfaces and a reaction site at a first of the opposed surfaces. The flow cell also includes a lid operatively connected to the passivation layer to partially define a flow channel between the lid and the reaction site. The detection device is in contact with a second of the opposed surfaces of the passivation layer, and includes an embedded metal layer that is electrically isolated from other detection circuitry of the detection device. The controller is to ground the embedded metal layer.

公开(公告)号：US20250050334A1

公开(公告)日：2025-02-13

申请号：US18929140

申请日：2024-10-28

Applicant: ILLUMINA, INC.

Inventor： Darren Segale ,  Hai Tran ,  Paul Crivelli

IPC: B01L3/00 ,  B01J19/00 ,  B01L9/00 ,  C12Q1/6837

Abstract: A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).