公开(公告)号：US20190276704A1

公开(公告)日：2019-09-12

申请号：US16234073

申请日：2018-12-27

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Dong-Sen CHEN ,  Yu-Ju KUO ,  Chyi-Ming LEU

IPC: C09D179/08 ,  C08G73/10 ,  C08K3/36 ,  C08K9/06 ,  C09D7/40 ,  C09D7/62

Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.

公开(公告)号：US20150245470A1

公开(公告)日：2015-08-27

申请号：US14627913

申请日：2015-02-20

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chun-Wei SU ,  Chyi-Ming LEU ,  Yu-Ju KUO ,  Hong-Ching LIN ,  Chun-An LU ,  Chiung-Hsiung CHEN

IPC: H05K1/02 ,  H05K1/03 ,  B29C39/02 ,  H05K3/10 ,  B29C39/00 ,  H05K1/09 ,  H05K3/00

CPC classification number: B29C39/02 ,  B29C35/02 ,  B29C39/003 ,  B29K2027/16 ,  B29K2079/08 ,  B29K2505/00 ,  B29K2995/0005 ,  B29L2031/3425 ,  H05K3/207 ,  H05K2201/0154 ,  H05K2201/2072 ,  H05K2203/1131

Abstract: A flexible substrate embedded with wires is provided. The flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires is also provided.

Abstract translation: 提供了嵌入电线的柔性基板。 嵌入电线的柔性基板包括由聚合物材料构成的柔性基板和包含嵌入柔性基板中的多个孔的连续的线图案，其中聚合物材料填充孔。 还提供了一种制造嵌有电线的柔性基板的方法。

公开(公告)号：US20150099088A1

公开(公告)日：2015-04-09

申请号：US14264742

申请日：2014-04-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chih-Cheng LIN ,  Chyi-Ming LEU ,  Yu-Ju KUO

IPC: C08G73/10 ,  B32B43/00 ,  B32B37/16 ,  B32B38/00 ,  C09D179/08 ,  B32B37/02

CPC classification number: C08G73/1067 ,  B32B37/16 ,  B32B38/105 ,  B32B43/006 ,  B32B2379/08 ,  B32B2457/00 ,  B32B2457/14 ,  C09D179/08

Abstract: Disclosed is a substrate structure for manufacturing a flexible electronic device, including a supporting layer, a release layer covering the supporting layer with a first area, wherein the release layer is an aromatic polyimide, and a flexible layer covering the supporting layer and the release layer with a second area. The second area is greater than the first area. The adhesion force between the flexible layer and the supporting layer is stronger than the adhesion force between the release layer and the supporting layer.

Abstract translation: 公开了一种用于制造柔性电子器件的衬底结构，包括支撑层，覆盖支撑层的第一区域的剥离层，其中剥离层是芳族聚酰亚胺，以及覆盖支撑层和剥离层的柔性层 第二个区域。 第二个区域大于第一个区域。 柔性层和支撑层之间的粘附力比剥离层和支撑层之间的粘合力更强。

公开(公告)号：US20220204705A1

公开(公告)日：2022-06-30

申请号：US17139336

申请日：2020-12-31

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Dong-Sen CHEN ,  Yu-Ju KUO ,  Yung-Lung TSENG ,  Chun-Wei SU

IPC: C08G77/455 ,  C08G73/10 ,  C08G77/26 ,  C08G77/24 ,  C08G77/00 ,  C08K5/00 ,  C08G77/20 ,  C08G77/16 ,  C08G77/18 ,  C08L79/08 ,  C08G77/12

Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n≥1; m≥1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.

公开(公告)号：US20190202996A1

公开(公告)日：2019-07-04

申请号：US15858426

申请日：2017-12-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Dong-Sen CHEN ,  Yu-Ju KUO ,  Chyi-Ming LEU

IPC: C08G83/00 ,  C09D187/00 ,  C08G73/10 ,  C09D179/08

CPC classification number: C08G83/001 ,  C08G73/1028 ,  C08G73/1067 ,  C08G83/003 ,  C09D179/08 ,  C09D187/005

Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, 5-20 parts by weight of silica particles, 10-40 parts by weight of an alkoxysilane, and 60-80 parts by weight of a solvent.