公开(公告)号：US20180179424A1

公开(公告)日：2018-06-28

申请号：US15656652

申请日：2017-07-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long JENG ,  Jeng-Yu TSAI ,  Hsi-Yi CHIN ,  Wei-Ta YANG

IPC: C09J171/12 ,  C09J153/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  B32B7/12 ,  B32B15/08

CPC classification number: C09J171/12 ,  B32B7/12 ,  B32B15/08 ,  B32B2457/08 ,  C08F283/06 ,  C08F287/00 ,  C08F290/062 ,  C08G59/5073 ,  C09J151/085 ,  C09J153/00 ,  C09J153/005 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  C08L53/02 ,  C08L63/00 ,  C08F220/40

Abstract: An adhesive composition and a composite substrate employing the same are provided. The adhesive composition includes a compound having a structure represented by Formula (I) (Z—Y3X  Formula (I) , wherein X is R can be hydrogen, or C1-6 alkyl group; each Y can be independently a moiety polymerized by at least two different phenol-based compounds; and each Z can be independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group; a thermoplastic elastomer; an epoxy resin; and a bismaleimide.