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Patent Agency Ranking
公开(公告)号：US10753591B2
公开(公告)日：2020-08-25
申请号：US15857226
申请日：2017-12-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsiang-Cheng Kung , Hsien-Lin Hu , Hsin-Hwa Chen
Abstract: A lightning protection structure is provided, which includes an insulation bottom layer, a graphite layer on the insulation bottom layer, an insulation shell on the graphite layer, and an electrically conductive component. A part of the electrically conductive component is disposed on the insulation shell, and another part of the electrically conductive component is in contact with the graphite layer.
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公开(公告)号：US20150188016A1
公开(公告)日：2015-07-02
申请号：US14287205
申请日：2014-05-27
Applicant: Industrial Technology Research Institute
Inventor： Cheng-Chuan Wang , Cheng-Chou Wong , Chia-Ying Yen , Hsin-Hwa Chen
IPC: H01L33/64
CPC classification number: H01L33/641 , C23C28/00 , C23C28/30 , C23C28/32 , C23C28/321 , C23C28/322 , C23C28/324 , C23C28/34 , C23C30/00 , C23C30/005 , H01L23/00 , H01L33/62 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K3/185 , H05K3/188 , H05K2203/0709 , H05K2203/072 , H05K2203/0723 , Y10T428/12576 , Y10T428/12611 , Y10T428/12618 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/2495 , Y10T428/24959 , Y10T428/24967 , Y10T428/24975 , Y10T428/263 , Y10T428/264 , Y10T428/265 , H01L2924/00
Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.
Abstract translation: 导电散热基板包括陶瓷基板和种子层，以及依次形成在其上的缓冲材料层和铜电路层。 缓冲材料层具有陶瓷基板与铜电路层的热膨胀系数。 此外，缓冲材料层由合金材料和陶瓷材料组成或由金属材料和陶瓷材料组成。
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公开(公告)号：US20190170338A1
公开(公告)日：2019-06-06
申请号：US15857226
申请日：2017-12-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsiang-Cheng Kung , Hsien-Lin Hu , Hsin-Hwa Chen
Abstract: A lightning protection structure is provided, which includes an insulation bottom layer, a graphite layer on the insulation bottom layer, an insulation shell on the graphite layer, and an electrically conductive component. A part of the electrically conductive component is disposed on the insulation shell, and another part of the electrically conductive component is in contact with the graphite layer.
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公开(公告)号：US20170159196A1
公开(公告)日：2017-06-08
申请号：US15250945
申请日：2016-08-30
Applicant: Industrial Technology Research Institute
Inventor： Chun-Fu Lu , Ya-Ching Chou , Li-Wei Liu , Hsin-Hwa Chen
Abstract: An electrical deposition apparatus includes a brush plating head. The brush plating head includes a plurality of channels, and there are openings at the same surface of the brush plating head. Each of the channels extends from within the brush plating head to each of the openings.
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公开(公告)号：US09397279B2
公开(公告)日：2016-07-19
申请号：US14287205
申请日：2014-05-27
Applicant: Industrial Technology Research Institute
Inventor： Cheng-Chuan Wang , Cheng-Chou Wong , Chia-Ying Yen , Hsin-Hwa Chen
IPC: H01L33/64 , B32B15/04 , B32B18/00 , C23C28/00 , C23C30/00 , H01L23/00 , H05K1/02 , H05K1/03 , H05K3/18 , H01L33/62
CPC classification number: H01L33/641 , C23C28/00 , C23C28/30 , C23C28/32 , C23C28/321 , C23C28/322 , C23C28/324 , C23C28/34 , C23C30/00 , C23C30/005 , H01L23/00 , H01L33/62 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K3/185 , H05K3/188 , H05K2203/0709 , H05K2203/072 , H05K2203/0723 , Y10T428/12576 , Y10T428/12611 , Y10T428/12618 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/2495 , Y10T428/24959 , Y10T428/24967 , Y10T428/24975 , Y10T428/263 , Y10T428/264 , Y10T428/265 , H01L2924/00
Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.
Abstract translation: 导电散热基板包括陶瓷基板和种子层，以及依次形成在其上的缓冲材料层和铜电路层。 缓冲材料层具有陶瓷基板与铜电路层的热膨胀系数。 此外，缓冲材料层由合金材料和陶瓷材料组成或由金属材料和陶瓷材料组成。
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