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    CHIP PACKAGE STRUCTURE
    1.
    发明申请
    CHIP PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20190057948A1

    公开(公告)日：2019-02-21

    申请号：US15911183

    申请日：2018-03-05

    Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

    Inventor： Chen-Tsai Yang ,  Ko-Chin Yang ,  Jui-Chang Chuang ,  Yen-Ting Wu ,  Chia-Hua Lu

    IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065

    Abstract: A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

    Separating device and separating method
    2.
    发明授权
    Separating device and separating method 有权

    公开(公告)号：US10384434B2

    公开(公告)日：2019-08-20

    申请号：US15956770

    申请日：2018-04-19

    Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

    Inventor： Chen-Tsai Yang ,  Ko-Chin Yang ,  Shi-Chang Chen ,  Cheng-Yi Wang ,  Yen-Ting Wu

    IPC: B32B43/00 ,  H01L51/00 ,  B32B38/10

    Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

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