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公开(公告)号:US20170144422A1
公开(公告)日:2017-05-25
申请号:US15135403
申请日:2016-04-21
Applicant: Industrial Technology Research Institute
Inventor: Chen-Chu Tsai , Cheng-Yi Wang , Shi-Chang Chen , Tzu-Chun Lin
CPC classification number: B32B37/1018 , B32B37/0046 , B32B43/006 , B32B2457/00
Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.
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公开(公告)号:US10384434B2
公开(公告)日:2019-08-20
申请号:US15956770
申请日:2018-04-19
Inventor: Chen-Tsai Yang , Ko-Chin Yang , Shi-Chang Chen , Cheng-Yi Wang , Yen-Ting Wu
Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.
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公开(公告)号:US20190061332A1
公开(公告)日:2019-02-28
申请号:US15956770
申请日:2018-04-19
Inventor: Chen-Tsai Yang , Ko-Chin Yang , Shi-Chang Chen , Cheng-Yi Wang , Yen-Ting Wu
CPC classification number: B32B43/006 , B32B38/10 , B32B2309/12 , H01L51/003 , Y10T156/1168 , Y10T156/1978
Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.
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公开(公告)号:US10173407B2
公开(公告)日:2019-01-08
申请号:US15135403
申请日:2016-04-21
Applicant: Industrial Technology Research Institute
Inventor: Chen-Chu Tsai , Cheng-Yi Wang , Shi-Chang Chen , Tzu-Chun Lin
Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.
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公开(公告)号:US09655244B1
公开(公告)日:2017-05-16
申请号:US15356522
申请日:2016-11-18
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Chen-Chu Tsai , Cheng-Yi Wang , Yuh-Zheng Lee , Ko-Chin Yang , Shi-Chang Chen
CPC classification number: H05K1/144 , G06F1/1643 , G06F1/1652 , H05K1/147 , H05K1/181 , H05K3/007 , H05K2201/058 , H05K2201/10128 , H05K2203/0228
Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.
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