公开(公告)号：US09591746B2

公开(公告)日：2017-03-07

申请号：US15199913

申请日：2016-06-30

Applicant: Industrial Technology Research Institute

Inventor： Wei-Yuan Cheng ,  Chen-Chu Tsai ,  Yuh-Zheng Lee

IPC: H05K1/00 ,  H05K3/00 ,  H05K1/02 ,  H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/028 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16 ,  H01L2924/181 ,  H05K1/0281 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/007 ,  H05K3/4038 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1178 ,  H01L2924/00012

Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Abstract translation: 根据本公开的实施例，电子设备封装可以包括导线层和刚性元件。 线层包括彼此相对的第一表面和第二表面，并且线层的第二表面具有至少一个粗糙结构。 具有粗糙结构的第二表面的一部分具有比第二表面的另一部分更大的粗糙度。 刚性元件设置在线层的第一表面上，其中刚性元件的刚度大于金属丝层的刚度，并且粗糙结构在金属丝层的第一表面上的投影区域与 刚性元素。

公开(公告)号：US09847509B2

公开(公告)日：2017-12-19

申请号：US15003803

申请日：2016-01-22

Applicant: Industrial Technology Research Institute

Inventor： Kun-Ming Chen ,  Chen-Chu Tsai ,  Yuh-Zheng Lee ,  Kuo-Lung Lo

IPC: H01L51/52

CPC classification number: H01L51/5256 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

公开(公告)号：US20160218320A1

公开(公告)日：2016-07-28

申请号：US15003803

申请日：2016-01-22

Applicant: Industrial Technology Research Institute

Inventor： Kun-Ming Chen ,  Chen-Chu Tsai ,  Yuh-Zheng Lee ,  Kuo-Lung Lo

IPC: H01L51/52

CPC classification number: H01L51/5256 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract translation: 提供一种灵活的环境敏感的电子器件封装，包括柔性电子器件，薄膜封装（TFE）和密封构件。 TFE覆盖柔性电子设备，密封构件覆盖TFE和柔性电子设备。 密封构件包括第一部分和第二部分，其中第一部分覆盖柔性电子装置和TFE，并且第二部分覆盖第一部分。 第二部分的杨氏模量在0MPa和100MPa之间。 第一部分的杨氏模量大于第二部分的杨氏模量。 第一部分的厚度小于第二部分的厚度。

公开(公告)号：US09655244B1

公开(公告)日：2017-05-16

申请号：US15356522

申请日：2016-11-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Chu Tsai ,  Cheng-Yi Wang ,  Yuh-Zheng Lee ,  Ko-Chin Yang ,  Shi-Chang Chen

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36 ,  H05K3/00

CPC classification number: H05K1/144 ,  G06F1/1643 ,  G06F1/1652 ,  H05K1/147 ,  H05K1/181 ,  H05K3/007 ,  H05K2201/058 ,  H05K2201/10128 ,  H05K2203/0228

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

公开(公告)号：US20160315044A1

公开(公告)日：2016-10-27

申请号：US15199913

申请日：2016-06-30

Applicant: Industrial Technology Research Institute

Inventor： Wei-Yuan Cheng ,  Chen-Chu Tsai ,  Yuh-Zheng Lee

IPC: H01L23/498 ,  H01L21/683 ,  H01L23/31

CPC classification number: H05K1/028 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16 ,  H01L2924/181 ,  H05K1/0281 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/007 ,  H05K3/4038 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1178 ,  H01L2924/00012

Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Abstract translation: 根据本公开的实施例，电子设备封装可以包括导线层和刚性元件。 线层包括彼此相对的第一表面和第二表面，并且线层的第二表面具有至少一个粗糙结构。 具有粗糙结构的第二表面的一部分具有比第二表面的另一部分更大的粗糙度。 刚性元件设置在线层的第一表面上，其中刚性元件的刚度大于金属丝层的刚度，并且粗糙结构在金属丝层的第一表面上的投影区域与 刚性元素。