PATTERNING PROCESS FOR OXIDE FILM
    2.
    发明申请
    PATTERNING PROCESS FOR OXIDE FILM 有权
    氧化膜的绘图工艺

    公开(公告)号:US20140034605A1

    公开(公告)日:2014-02-06

    申请号:US13942162

    申请日:2013-07-15

    CPC classification number: B44C1/227 C23C24/082 C23C24/085 H01L21/0272

    Abstract: The present disclosure provides a patterning process for an oxide film, including: covering a barrier layer composition on a substrate to form a patterned barrier layer, wherein the barrier layer composition includes an inorganic component and an organic binder with a weight ratio of 50-98:2-50; forming an oxide film on the patterned barrier layer and the substrate, wherein a thickness ratio (D1/D2) of the barrier layer (D1) to the oxide film (D2) is about 5-2000; and lifting off the barrier layer and the oxide film thereon, while leaving portions of the oxide film on the substrate.

    Abstract translation: 本公开提供了一种用于氧化物膜的图案化工艺,包括:在基板上覆盖阻挡层组合物以形成图案化阻挡层,其中阻挡层组合物包含无机组分和重量比为50-98的有机粘合剂 :2-50; 在图案化的阻挡层和基板上形成氧化膜,其中阻挡层(D1)与氧化膜(D2)的厚度比(D1 / D2)约为5〜2000; 并且在其上放置阻挡层和氧化膜,同时将氧化膜的一部分留在基板上。

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