公开(公告)号：US09029984B2

公开(公告)日：2015-05-12

申请号：US13797366

申请日：2013-03-12

Applicant: Industrial Technology Research Institute

Inventor： Peng-Shu Chen ,  Min-Lin Lee ,  Shih-Hsien Wu ,  Shur-Fen Liu

IPC: H01L29/00 ,  H01L23/48 ,  H01L23/64 ,  H01L23/66 ,  H01L25/065 ,  H01L23/498 ,  H01L23/522 ,  H01L21/02

CPC classification number: H01L23/48 ,  H01L21/02107 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/5223 ,  H01L23/5228 ,  H01L23/64 ,  H01L23/66 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor substrate assembly is proposed. The semiconductor interposer comprises a substrate having a first surface and a second surface opposite to the first surface, a first conductive pad, a second conductive pad and a conductive pillar. The first conductive pad is formed at a predetermined location of the first surface of the substrate. The second conductive pad is formed at a predetermined location of the second surface of the substrate as compared with the position of the first conductive pad. The conductive pillar is formed in the substrate and contacts with one of the first conductive pad and the second conductive pad.

Abstract translation: 提出了一种半导体衬底组件。 半导体插入器包括具有第一表面和与第一表面相对的第二表面的衬底，第一导电焊盘，第二导电焊盘和导电柱。 第一导电焊盘形成在基板的第一表面的预定位置处。 与第一导电焊盘的位置相比，第二导电焊盘形成在基板的第二表面的预定位置处。 导电柱形成在基板中并与第一导电焊盘和第二导电焊盘之一接触。

公开(公告)号：US20140048908A1

公开(公告)日：2014-02-20

申请号：US13797366

申请日：2013-03-12

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Peng-Shu Chen ,  Min-Lin Lee ,  Shih-Hsien Wu ,  Shur-Fen Liu

IPC: H01L23/48

CPC classification number: H01L23/48 ,  H01L21/02107 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/5223 ,  H01L23/5228 ,  H01L23/64 ,  H01L23/66 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor substrate assembly is proposed. The semiconductor interposer comprises a substrate having a first surface and a second surface opposite to the first surface, a first conductive pad, a second conductive pad and a conductive pillar. The first conductive pad is formed at a predetermined location of the first surface of the substrate. The second conductive pad is formed at a predetermined location of the second surface of the substrate as compared with the position of the first conductive pad. The conductive pillar is formed in the substrate and contacts with one of the first conductive pad and the second conductive pad.

Abstract translation: 提出了一种半导体衬底组件。 半导体插入器包括具有第一表面和与第一表面相对的第二表面的衬底，第一导电焊盘，第二导电焊盘和导电柱。 第一导电焊盘形成在基板的第一表面的预定位置处。 与第一导电焊盘的位置相比，第二导电焊盘形成在基板的第二表面的预定位置处。 导电柱形成在基板中并与第一导电焊盘和第二导电焊盘之一接触。