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公开(公告)号：US09582977B2
公开(公告)日：2017-02-28
申请号：US14580727
申请日：2014-12-23
Applicant: Intel Corporation
Inventor： Nicholas P. Cowley , Ruchir Saraswat , Colin L. Perry , Matthew T. Aitken , Richard J. Goldman , Chi Man Kan
Abstract: A method monitors the consumption of materials, including determining the presence of materials in a smart receptacle using a sensor located in the smart receptacle. A server is alerted when an actionable item is detected.
Abstract translation: 一种方法监测材料的消耗，包括使用位于智能插座中的传感器确定智能插座中材料的存在。 当检测到可操作的项目时，将提醒服务器。
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公开(公告)号：US20160066724A1
公开(公告)日：2016-03-10
申请号：US14483023
申请日：2014-09-10
Applicant: Intel Corporation
Inventor： Nicholas P. Cowley , Ruchir Saraswat , Richard J. Goldman , Chi Man Kan , Matthew T. Aitken , Colin L. Perry
CPC classification number: G01K13/00 , A47G21/02 , A47G2021/008 , A47G2200/186 , G01C19/00 , G01K2207/08 , G06Q30/016 , G06Q50/12
Abstract: Embodiments described herein relate generally to monitoring a dining session using smart smallwares. A smart smallware may sense usage or non-usage associated with a dining session of a customer. Based on the sensed non-usage of the smart smallware, the smart smallware may detect a period of inactivity. In response to the detected period of inactivity, the smart smallware may transmit an indication of the detected period of inactivity. This transmitted indication may cause an external monitoring device to notify a waitperson that a customer associated with that smart smallware may require attention. Other embodiments may be described and/or claimed.
Abstract translation: 本文所描述的实施例一般涉及使用智能小物件监视餐饮会话。 智能小型餐具可以感知与客户的餐饮会话相关联的使用或不使用。 基于感知到的智能小型软件的不使用，智能小型软件可以检测不活动的时间段。 响应于检测到的不活动时段，智能小型餐具可以发送检测到的不活动时段的指示。 该发送的指示可能导致外部监视设备通知等待人员，与该智能小型餐具相关联的客户可能需要注意。 可以描述和/或要求保护其他实施例。
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Patent Agency Ranking
公开(公告)号：US20180270948A1
公开(公告)日：2018-09-20
申请号：US15675883
申请日：2017-08-14
Applicant: Intel Corporation
Inventor： William L. Barber , Keith Pinson , Andrew P. Collins , Boping Wu , Isaac Ali , Colin L. Perry
CPC classification number: H05K1/0231 , H01L23/50 , H01L2924/0002 , H02H9/04 , H05K1/025 , H05K2201/09672 , H01L2924/00
Abstract: In various embodiments, apparatuses and methods are disclosed that may be able to implement a multi-layer, three dimensional routing between a decoupling component and an input port for a SoC or MCM. A three dimensional (3D) structure may provide a defined current return path from the decoupling component to the input port. The current return path may be constrained by design to provide an equal and opposite electromagnetic flux to the input port thereby reducing series inductance between the input port and the decoupling component.
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公开(公告)号：US10015878B2
公开(公告)日：2018-07-03
申请号：US14945762
申请日：2015-11-19
Applicant: Intel Corporation
Inventor： William L. Barber , Keith Pinson , Andrew P. Collins , Boping Wu , Isaac Ali , Colin L. Perry
CPC classification number: H05K1/0231 , H01L23/50 , H01L2924/0002 , H02H9/04 , H05K1/025 , H05K2201/09672 , H01L2924/00
Abstract: In various embodiments, apparatuses and methods are disclosed that may be able to implement a multi-layer, three dimensional routing between a decoupling component and an input port for a SoC or MCM. A three dimensional (3D) structure may provide a defined current return path from the decoupling component to the input port. The current return path may be constrained by design to provide an equal and opposite electromagnetic flux to the input port thereby reducing series inductance between the input port and the decoupling component.
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公开(公告)号：US20160309580A1
公开(公告)日：2016-10-20
申请号：US14945762
申请日：2015-11-19
Applicant: Intel Corporation
Inventor： William L. Barber , Keith Pinson , Andrew P. Collins , Boping Wu , Isaac Ali , Colin L. Perry
CPC classification number: H05K1/0231 , H01L23/50 , H01L2924/0002 , H02H9/04 , H05K1/025 , H05K2201/09672 , H01L2924/00
Abstract: In various embodiments, apparatuses and methods are disclosed that may be able to implement a multi-layer, three dimensional routing between a decoupling component and an input port for a SoC or MCM. A three dimensional (3D) structure may provide a defined current return path from the decoupling component to the input port. The current return path may be constrained by design to provide an equal and opposite electromagnetic flux to the input port thereby reducing series inductance between the input port and the decoupling component.
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公开(公告)号：US20160180679A1
公开(公告)日：2016-06-23
申请号：US14580727
申请日：2014-12-23
Applicant: INTEL CORPORATION
Inventor： Nicholas P. Cowley , Ruchir Saraswat , Colin L. Perry , Matthew T. Aitken , Richard J. Goldman , Chi Man Kan
Abstract: A method monitors the consumption of materials, including determining the presence of materials in a smart receptacle using a sensor located in the smart receptacle. A server is alerted when an actionable item is detected.
Abstract translation: 一种方法监测材料的消耗，包括使用位于智能插座中的传感器确定智能插座中材料的存在。 当检测到可操作的项目时，将提醒服务器。
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公开(公告)号：US09225164B2
公开(公告)日：2015-12-29
申请号：US14534979
申请日：2014-11-06
Applicant: Intel Corporation
Inventor： William L. Barber , Keith Pinson , Andrew P. Collins , Boping Wu , Isaac Ali , Colin L. Perry
CPC classification number: H05K1/0231 , H01L23/50 , H01L2924/0002 , H02H9/04 , H05K1/025 , H05K2201/09672 , H01L2924/00
Abstract: In various embodiments, apparatuses and methods are disclosed that may be able to implement a multi-layer, three dimensional routing between a decoupling component and an input port for a SoC or MCM. A three dimensional (3D) structure may provide a defined current return path from the decoupling component to the input port. The current return path may be constrained by design to provide an equal and opposite electromagnetic flux to the input port thereby reducing series inductance between the input port and the decoupling component.
Abstract translation: 在各种实施例中，公开了可以在去耦组件和用于SoC或MCM的输入端口之间实现多层三维路由的装置和方法。 三维（3D）结构可以提供从去耦组件到输入端口的定义的当前返回路径。 电流返回路径可能被设计约束以向输入端口提供相等且相反的电磁通量，从而减小输入端口和去耦部件之间的串联电感。
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