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公开(公告)号：US12051651B2
公开(公告)日：2024-07-30
申请号：US18202136
申请日：2023-05-25
Applicant: Intel Corporation
Inventor： Mathew J. Manusharow , Jonathan Rosenfeld
IPC: H01L23/48 , H01L21/48 , H01L23/498 , H01L23/538 , H01L23/64 , H01L25/00 , H01L25/065 , H01L23/00
CPC classification number: H01L23/5383 , H01L21/4857 , H01L23/49822 , H01L23/642 , H01L23/647 , H01L25/065 , H01L25/0655 , H01L25/50 , H01L23/49816 , H01L23/5385 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15192
Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.
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公开(公告)号：US11715695B2
公开(公告)日：2023-08-01
申请号：US17555213
申请日：2021-12-17
Applicant: Intel Corporation
Inventor： Mathew J. Manusharow , Jonathan Rosenfeld
IPC: H01L23/00 , H01L23/538 , H01L25/065 , H01L21/48 , H01L23/498 , H01L23/64 , H01L25/00
CPC classification number: H01L23/5383 , H01L21/4857 , H01L23/49822 , H01L23/642 , H01L23/647 , H01L25/065 , H01L25/0655 , H01L25/50 , H01L23/49816 , H01L23/5385 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15192
Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.
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公开(公告)号：US20210043572A1
公开(公告)日：2021-02-11
申请号：US17083177
申请日：2020-10-28
Applicant: Intel Corporation
Inventor： Mathew J. Manusharow , Jonathan Rosenfeld
IPC: H01L23/538 , H01L25/065 , H01L21/48 , H01L23/498 , H01L23/64 , H01L25/00
Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.
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公开(公告)号：US09640318B2
公开(公告)日：2017-05-02
申请号：US14318304
申请日：2014-06-27
Applicant: Intel Corporation
Inventor： Jonathan Rosenfeld , Sreenivas Kasturi , Songnan Yang , Essam Elkhouly
CPC classification number: H01F38/14 , H01F5/00 , H01F27/006 , H01F27/2804 , H01F41/041 , Y10T29/49071
Abstract: Techniques of forming a transmitter coil are described herein. The techniques may include forming turns of the transmitter coil, wherein a non-uniform spacing between the turns of the transmitter coil is to reduce a magnetic field variation associated with the transmitter coil.
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公开(公告)号：US11961804B2
公开(公告)日：2024-04-16
申请号：US17083177
申请日：2020-10-28
Applicant: Intel Corporation
Inventor： Mathew J. Manusharow , Jonathan Rosenfeld
IPC: H01L23/48 , H01L21/48 , H01L23/498 , H01L23/538 , H01L23/64 , H01L25/00 , H01L25/065 , H01L23/00
CPC classification number: H01L23/5383 , H01L21/4857 , H01L23/49822 , H01L23/642 , H01L23/647 , H01L25/065 , H01L25/0655 , H01L25/50 , H01L23/49816 , H01L23/5385 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15192
Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.
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Patent Agency Ranking
公开(公告)号：US20170288445A1
公开(公告)日：2017-10-05
申请号：US15088277
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Jaejin Lee , Chung-Hao J. Chen , Zhen Yao , Songnan Yang , Jonathan Rosenfeld , Sreenivas Kasturi
Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a patch array disposed in parallel with the transmit coil to reduce the strength of the magnetic field at frequencies outside of the operating frequency during operation of the power transmitting unit.
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公开(公告)号：US09620985B2
公开(公告)日：2017-04-11
申请号：US14242448
申请日：2014-04-01
Applicant: Intel Corporation
Inventor： Jonathan Rosenfeld
CPC classification number: H02J7/025 , H01F38/14 , H01F41/041 , H02J7/0042 , H02J7/0052 , H02J50/10 , H02J50/40 , H02J50/70 , Y10T29/4902
Abstract: Techniques of forming a wireless power receiving unit are described herein. The techniques may include forming a first receiving coil of a device to be charged by inductive coupling to a first transmitting coil. The techniques may include forming a second receiving coil of a device to be charged by inductive coupling to a second transmitting coil. The second receiving coil is disposed at an angle to a plane of the first receiving coil, and the first receiving coil and the second receiving coil are formed to connected in parallel to a receiving circuit.
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8.发明申请公开(公告)号：US20160204656A1
公开(公告)日：2016-07-14
申请号：US14578422
申请日：2014-12-20
Applicant: Intel Corporation
Inventor： Songnan Yang , Janardhan Narayan , Jonathan Rosenfeld , Kerry Stevens , Patrick Chewning
CPC classification number: H02J50/10 , G06F1/1613 , G06F1/1616 , G06F1/1635 , G06F1/1656 , G06F1/1698 , G06F1/263 , H01F27/02 , H01F27/362 , H01F27/365 , H01F38/14 , H02J7/0042 , H02J7/025
Abstract: This disclosure pertains to wireless power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing device. The present disclosure includes a system which comprises a computing unit which includes a power receiving unit and a conductive surface. The conductive surface has an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The computing unit further includes a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base. The system also includes a power transmitting unit adjacent to the computing unit.
Abstract translation: 本公开涉及无线功率传输系统，并且特别地（但不排他地）涉及用于提高计算设备内的功率发射单元和功率接收单元之间的耦合效率的技术。 本公开包括一种包括计算单元的系统，该计算单元包括受电单元和导电表面。 导电表面具有与电力接收单元相邻的开口和从开口向导电表面的周边延伸的槽。 计算单元还包括耦合到电力接收单元的系统基座，其中电力接收单元向系统基础提供电力。 该系统还包括与计算单元相邻的功率发送单元。
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9.发明申请Chassis Design for Wireless-Charging Coil Integration for Computing Systems 审中-公开用于计算系统的无线充电线圈集成的机箱设计公开(公告)号：US20160179140A1
公开(公告)日：2016-06-23
申请号：US14672169
申请日：2015-03-28
Applicant: Intel Corporation
Inventor： Songnan Yang , Janardhan Narayan , Jonathan Rosenfeld , Kerry Stevens , Patrick Chewning
IPC: G06F1/16
CPC classification number: G06F1/1656 , G06F1/1635 , G06F1/26
Abstract: This disclosure pertains to wireless-power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing system. The present disclosure includes a system which comprises a computing unit and a power transmitting unit adjacent thereto. The computing unit includes a system base, a conductive surface, and a power receiving unit. The conductive surface may have an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The system base may be coupled to the power receiving unit. The power receiving unit provides power to the system base.
Abstract translation: 本公开涉及无线功率传输系统，特别是（但不排他地）涉及提高计算系统内的功率发射单元和功率接收单元之间的耦合效率的技术。 本公开包括一个包括计算单元和与其相邻的功率发送单元的系统。 计算单元包括系统基座，导电表面和电力接收单元。 导电表面可以具有与电力接收单元相邻的开口和从开口朝向导电表面的周边延伸的狭槽。 系统基座可以耦合到电力接收单元。 电力接收单元为系统基础提供电力。
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公开(公告)号：US10530174B2
公开(公告)日：2020-01-07
申请号：US15088277
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Jaejin Lee , Chung-Hao J. Chen , Zhen Yao , Songnan Yang , Jonathan Rosenfeld , Sreenivas Kasturi
Abstract: Techniques for focusing an energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver a current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a patch array disposed in parallel with the transmit coil to reduce a strength of the magnetic field at frequencies outside of the operating frequency during operation of the power transmitting unit.
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