公开(公告)号：US20040251047A1

公开(公告)日：2004-12-16

申请号：US10460591

申请日：2003-06-12

Applicant: International Business Machines Corporation

Inventor： Gerald Keith Bartley ,  Paul Eric Dahlen ,  Philip Raymond Germann ,  Andrew B. Maki ,  Mark Owen Maxson

IPC: H05K007/06

CPC classification number: H05K3/429 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/027 ,  H05K3/04 ,  H05K3/061 ,  H05K3/403 ,  H05K2201/09645 ,  H05K2203/0195 ,  H05K2203/0557 ,  Y10T29/49165

Abstract: Methods and apparatus are disclosed for improved via utilization on printed wiring boards (PWB). A via in a PWB typically transfers a single electrical signal from one signal plane to another wiring plane on the PWB. The present invention provides for more than a single signal to be transferred through a single via having a conducting wall. The conducting wall of the via is divided into more than one conducting portion, each portion capable of conducting a signal from one signal plane to another signal plane.

Abstract translation: 公开了用于改善印刷电路板（PWB）上的通孔利用的方法和装置。 PWB中的通孔通常将单个电信号从一个信号平面传输到PWB上的另一个布线平面。 本发明提供不止一个信号通过具有导电壁的单个通孔传输。 通孔的导电壁被分成多于一个导电部分，每个部分能够将信号从一个信号平面传导到另一个信号面。

公开(公告)号：US20040189418A1

公开(公告)日：2004-09-30

申请号：US10401257

申请日：2003-03-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Gerald Keith Bartley ,  Paul Eric Dahlen ,  Philip Raymond Germann ,  Andrew B. Maki ,  Mark Owen Maxson

IPC: H05K007/02 ,  H01P003/02

CPC classification number: H05K1/0245 ,  H01P3/08 ,  H05K1/115 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09718

Abstract: A method and structure are provided for implementing enhanced differential signal trace routing in a printed circuit board. The structure includes a differential signal trace pair and a differential pair via arrangement including a pair of vias. The pair of vias is coupled to the differential signal trace pair for routing the differential signal trace pair between first and second layers of the PCB. The vias are laterally offset by a predefined spacing sharing overlapping clearance holes and are diagonally oriented to allow minimal separation of the differential signal trace pair and matched signal trace lengths of the differential signal trace pair.

Abstract translation: 提供了一种用于在印刷电路板中实现增强的差分信号迹线路由的方法和结构。 该结构包括差分信号迹线对和包括一对通孔的差分对通孔装置。 该对通孔耦合到差分信号迹线对，用于在PCB的第一和第二层之间路由差分信号迹线对。 通孔横向偏移共享重叠间隙孔的预定间隔，并且对角线定向以允许微分信号轨迹对和差分信号轨迹对的匹配信号迹线长度的最小间隔。