公开(公告)号：US10748823B2

公开(公告)日：2020-08-18

申请号：US16145143

申请日：2018-09-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Yann Mignot ,  Alan Thomas ,  Daniel Sanders ,  Dario Goldfarb ,  Nelson Felix ,  Chi-Chun Liu ,  John Arnold

IPC: H01L21/00 ,  H01L21/66 ,  H01L21/02 ,  H01L21/311

Abstract: An exemplary semiconductor wafer includes a lower sublayer of a first organic planarization layer (OPL) material; an upper sublayer of a second OPL material deposited onto the lower sublayer; and a detectable interface between the lower sublayer and the upper sublayer. The exemplary wafer is fabricated by depositing the lower sublayer; curing the lower sublayer; and after curing the lower sublayer, depositing the upper sublayer directly onto the lower sublayer.

公开(公告)号：US20200050108A1

公开(公告)日：2020-02-13

申请号：US16101411

申请日：2018-08-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Chi-Chun Liu ,  Indira Seshadri ,  Kristin Schmidt ,  Nelson Felix ,  Daniel Sanders ,  Jing Guo ,  Ekmini Anuja De Silva ,  Hoa Truong

IPC: G03F7/11 ,  G03F7/004 ,  G03F7/09

Abstract: A self-priming resist may be formed from a first random copolymer forming a resist and a polymer brush having the general formula poly(A-r-B)-C-D, wherein A is a first polymer unit, B is a second polymer unit, wherein A and B are the same or different polymer units, C is a cleavable unit, D is a grafting group and r indicates that poly(A-r-B) is a second random copolymer formed from the first and second polymer units. The first random copolymer may be the same or different from the second random polymer. The self-priming resist can create a one-step method for forming an adhesion layer and resist by using the resist/brush blend.

公开(公告)号：US11226561B2

公开(公告)日：2022-01-18

申请号：US16101411

申请日：2018-08-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Chi-Chun Liu ,  Indira Seshadri ,  Kristin Schmidt ,  Nelson Felix ,  Daniel Sanders ,  Jing Guo ,  Ekmini Anuja De Silva ,  Hoa Truong

IPC: G03F7/11 ,  G03F7/09 ,  G03F7/004

Abstract: A self-priming resist may be formed from a first random copolymer forming a resist and a polymer brush having the general formula poly(A-r-B)-C-D, wherein A is a first polymer unit, B is a second polymer unit, wherein A and B are the same or different polymer units, C is a cleavable unit, D is a grafting group and r indicates that poly(A-r-B) is a second random copolymer formed from the first and second polymer units. The first random copolymer may be the same or different from the second random polymer. The self-priming resist can create a one-step method for forming an adhesion layer and resist by using the resist/brush blend.

公开(公告)号：US20200105628A1

公开(公告)日：2020-04-02

申请号：US16145143

申请日：2018-09-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Yann Mignot ,  Alan Thomas ,  Daniel Sanders ,  Dario Goldfarb ,  Nelson Felix ,  Chi-Chun Liu ,  John Arnold

IPC: H01L21/66 ,  H01L21/02 ,  H01L21/311

Abstract: An exemplary semiconductor wafer includes a lower sublayer of a first organic planarization layer (OPL) material; an upper sublayer of a second OPL material deposited onto the lower sublayer; and a detectable interface between the lower sublayer and the upper sublayer. The exemplary wafer is fabricated by depositing the lower sublayer; curing the lower sublayer; and after curing the lower sublayer, depositing the upper sublayer directly onto the lower sublayer.

公开(公告)号：US10259907B2

公开(公告)日：2019-04-16

申请号：US14628002

申请日：2015-02-20

Applicant: International Business Machines Corporation ,  AZ Electronic Materials (Luxembourg) S.a.r.L.

Inventor： Ankit Vora ,  Eri Hirahara ,  Joy Cheng ,  Durairaj Baskaran ,  Orest Polishchuk ,  Melia Tjio ,  Margareta Paunescu ,  Daniel Sanders ,  Guanyang Lin

IPC: C08G63/08 ,  C08G64/02 ,  C08G63/64 ,  C08J7/04 ,  C09D167/04 ,  C09D169/00 ,  C08F293/00 ,  G03F7/00 ,  B82Y30/00

Abstract: The present invention relates to a novel block copolymer of structure 1, wherein, A- is a block polymer chain, B is a block polymer chain, wherein, A- and B- are chemically different, covalently connected polymer chains, which are phase separable and the moiety X(Y(Z)b)a is a junction group, which comprises a surface active pendant moiety Y(Z)b wherein: a is an integer from 1 to 4 denoting the number of surface active pendant moieties Y(Z)b on X, b is an integer from 1 to 5 denoting the number of Z moieties on the linking moiety Y, X is a linking group between the A polymer block, the B polymer block and the moiety Y, Y is a linking group or a direct valence bond between X and Z; and Z is a moiety independently selected from, a fluorine containing moiety, a Si1-Si8 siloxane containing moiety or a hydrocarbon moiety with at least 18 carbons, and further wherein the junction group X(Y(Z)b)a has a surface energy less than that that of the block A and less than that of the block B. The invention also relates to a composition comprising the novel copolymer and its use in direct self-assembly processes.