公开(公告)号：US20030017642A1

公开(公告)日：2003-01-23

申请号：US09910380

申请日：2001-07-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Richard A. Conti ,  Prakash Chimanlal Dev ,  David M. Dobuzinsky ,  Daniel C. Edelstein ,  Gill Y. Lee ,  Kia-Seng Low ,  Padraic C. Shafer ,  Alexander Simpson ,  Peter Wrschka

IPC: H01L035/24 ,  H01L051/00 ,  H01L051/40 ,  H01L023/58 ,  H01L021/302 ,  H01L021/461 ,  H01L021/31 ,  H01L021/469

CPC classification number: H01L21/28185 ,  H01L21/02126 ,  H01L21/02274 ,  H01L21/28194 ,  H01L21/31633 ,  H01L23/5329 ,  H01L23/53295 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure and method for an insulator layer having carbon-graded layers above a substrate is disclosed, wherein the concentration of carbon increases in each successive carbon-graded layer above the substrate. The insulator comprises a low-k dielectric having a dielectric constant less than 3.3. The carbon-graded layer increases adhesion between the substrate and the insulator and between the insulator and the conductor layer. The structure may also include stabilization interfaces between the carbon-graded layers. More specifically, the carbon-graded layers include a first layer adjacent the substrate having a carbon content between about 5% and 20%, a second layer above the first layer having a carbon content between about 10% and 30%, and a third layer above the second layer having a carbon content between about 20% and 40%.