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公开(公告)号:US20140149174A1
公开(公告)日:2014-05-29
申请号:US13685362
申请日:2012-11-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Geraldine L. Abbott , Sherif A. Goma , Allen D. Grussing , Richard D. Howard , Sinem Guven Kaya , Peter Lorenzen , Sergey Makogon , Satya Nitta , Anatoli Olkhovets , Natalia M. Ruderman , Shu Tao
IPC: G06Q10/06
CPC classification number: G06Q10/0635
Abstract: A method for predicting and quantifying risk in information technology (IT) service contracts includes comparing features of a new IT service contract with similar features from one or more previous IT service contracts selected from a plurality of previous IT service contracts to calculate a similarity value between each pair of the new IT service contract and one of the one or more previous IT service contracts, aggregating the similarity values, and using the aggregated similarity values with a prediction model to predict risk factors affecting the new IT service contract and to quantify an impact of each predicted risk factor on an expected gross profit margin.
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公开(公告)号:US20140141618A1
公开(公告)日:2014-05-22
申请号:US14097956
申请日:2013-12-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Guy M. Cohen , Steven A. Cordes , Sherif A. Goma , Joanna Rosner , Jeannine M. Trewhella
IPC: H01L21/3105
CPC classification number: H01L21/31051 , B81C1/00611 , B81C2201/0119 , H01L21/0272 , H01L21/0337 , H01L21/31053 , H01L21/31058 , H01L21/3212 , H01L21/76838
Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.
Abstract translation: 通过首先平面化半导体衬底中的空腔以便创建用于后续光刻处理的平坦表面来克服极端形貌的过程。 作为极端形貌的平面化处理的结果,可以进行随后的光刻处理,包括紧邻极端地形表面(例如,深空腔或通道)的特征沉积,并且包括在空腔内沉积特征。 在第一实施例中,用于平面化半导体衬底中的腔的方法包括施加具有高耐化学性的干膜抗蚀剂。 在第二实施例中,用于平坦化空腔的方法包括使用诸如聚合物,玻璃旋转和冶金的材料来填充空腔。
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公开(公告)号:US20210264790A1
公开(公告)日:2021-08-26
申请号:US16801844
申请日:2020-02-26
Applicant: International Business Machines Corporation
Inventor: Ambhighainath Ganesan , Sherif A. Goma , Chelsea Grindle , Dakota Fried , Kevin Chang , Raphael Ezry
Abstract: A collision avoidance and road safety system is applied to a road network comprised of a plurality of road segments for a location to produce real time or dynamic forecasting of collision risk and root causes of the potential collision.
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公开(公告)号:US20220138995A1
公开(公告)日:2022-05-05
申请号:US17089758
申请日:2020-11-05
Applicant: International Business Machines Corporation
Inventor: Aaron K. Baughman , Sai Krishna Reddy Gudimetla , Stephen C. Hammer , Jeffrey D. Amsterdam , Sherif A. Goma
Abstract: One or more computer processors create a user-event localization model for an identified remote audience member in a plurality of identified remote audience members for an event. The one or more computer processors generate a virtual audience member based the identified remote audience member utilizing a trained generated adversarial network and one or more user preferences. The one or more computer processors present the generated virtual audience member in a location associated with the event. The one or more computer processors dynamically adjust a presented virtual audience member responsive to one or more event occurrences utilizing the created user-event localization model.
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公开(公告)号:US09263292B2
公开(公告)日:2016-02-16
申请号:US14097956
申请日:2013-12-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Guy M. Cohen , Steven A. Cordes , Sherif A. Goma , Joanna Rosner , Jeannine M. Trewhella
IPC: H01L21/3105 , B81C1/00 , H01L21/027 , H01L21/033 , H01L21/321 , H01L21/768
CPC classification number: H01L21/31051 , B81C1/00611 , B81C2201/0119 , H01L21/0272 , H01L21/0337 , H01L21/31053 , H01L21/31058 , H01L21/3212 , H01L21/76838
Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.
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公开(公告)号:US11341689B1
公开(公告)日:2022-05-24
申请号:US17089758
申请日:2020-11-05
Applicant: International Business Machines Corporation
Inventor: Aaron K Baughman , Sai Krishna Reddy Gudimetla , Stephen C Hammer , Jeffrey D. Amsterdam , Sherif A. Goma
Abstract: One or more computer processors create a user-event localization model for an identified remote audience member in a plurality of identified remote audience members for an event. The one or more computer processors generate a virtual audience member based the identified remote audience member utilizing a trained generated adversarial network and one or more user preferences. The one or more computer processors present the generated virtual audience member in a location associated with the event. The one or more computer processors dynamically adjust a presented virtual audience member responsive to one or more event occurrences utilizing the created user-event localization model.
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公开(公告)号:US11170649B2
公开(公告)日:2021-11-09
申请号:US16801844
申请日:2020-02-26
Applicant: International Business Machines Corporation
Inventor: Ambhighainath Ganesan , Sherif A. Goma , Chelsea Grindle , Dakota Fried , Kevin Chang , Raphael Ezry
Abstract: A collision avoidance and road safety system is applied to a road network comprised of a plurality of road segments for a location to produce real time or dynamic forecasting of collision risk and root causes of the potential collision.
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