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公开(公告)号:US20190156655A1
公开(公告)日:2019-05-23
申请号:US15816799
申请日:2017-11-17
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Michael S. Gordon , Nigel Hinds , Maja Vukovic
CPC classification number: G08B25/016 , G06N20/00 , G08B25/001 , G08B25/006 , G08B25/10 , H04W4/12 , H04W4/90 , H04W40/24 , H04W64/00
Abstract: A mobile electronic device such as a smartphone is used in conjunction with a deep learning system to detect and respond to personal danger. The deep learning system monitors current information (such as location, audio, biometrics, etc.) from the smartphone and generates a risk score by comparing the information to a routine profile for the user. If the risk score exceeds a predetermined threshold, an alert is sent to the smartphone which presents an alert screen to the user. The alert screen allows the user to cancel the alert (and notify the deep learning system) or confirm the alert (and immediately transmit an emergency message). Multiple emergency contacts can be designated, e.g., one for a low-level risk, another for an intermediate-level risk, and another for a high-level risk, and the emergency message can be sent to a selected contact depending upon the severity of the risk score.
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公开(公告)号:US09872394B2
公开(公告)日:2018-01-16
申请号:US15090656
申请日:2016-04-05
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Bing Dang , Sung K. Kang , Yu Luo , Peter J. Sorce
CPC classification number: H05K3/0094 , C23C18/1603 , C23C18/1646 , C23C18/1653 , C23C18/1689 , C25D5/02 , C25D7/00 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/5384 , H05K3/388 , H05K3/424 , H05K2203/072 , H05K2203/0723 , H05K2203/308
Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.
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公开(公告)号:US20170235843A1
公开(公告)日:2017-08-17
申请号:US15585222
申请日:2017-05-03
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Debra C. Leach , Debra A. Loussedes , Patrick R. Varekamp
IPC: G06F17/30
CPC classification number: G06F17/30867 , G06F17/3051 , G06F17/30545 , H04L67/10
Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.
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4.
公开(公告)号:US09632251B2
公开(公告)日:2017-04-25
申请号:US14243436
申请日:2014-04-02
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Aydin Babakhani , Steven A. Cordes , Jean-Olivier Plouchart , Scott K. Reynolds , Peter J. Sorce , Robert E. Trzcinski
IPC: H01L31/0232 , H01S5/183 , H01S5/022 , H01L27/144 , G02B6/13 , H01L31/18 , H01S5/02
CPC classification number: G02B6/13 , G02B6/12004 , G02B6/124 , G02B6/30 , G02B6/42 , G02B2006/12121 , H01L27/1446 , H01L31/02327 , H01L31/18 , H01L2224/16225 , H01S5/021 , H01S5/02248 , H01S5/1071 , H01S5/183
Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.
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公开(公告)号:US09433101B2
公开(公告)日:2016-08-30
申请号:US14515567
申请日:2014-10-16
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Bing Dang , Sung K. Kang , Yu Luo , Peter J. Sorce
CPC classification number: H05K3/0094 , C23C18/1603 , C23C18/1646 , C23C18/1653 , C23C18/1689 , C25D5/02 , C25D7/00 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/5384 , H05K3/388 , H05K3/424 , H05K2203/072 , H05K2203/0723 , H05K2203/308
Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.
Abstract translation: 用金属填充过孔的方法包括接收具有通孔的基板,在基板的第一侧上的通孔的上方形成金属镀层,用第一金属填充第一金属,第一金属从第一侧的金属镀层开始 衬底并且前进到衬底的第二侧以提供填充的通孔。 金属镀层可以随后被图案化以提供选择的电路连接或化学机械抛光以完全去除金属镀层。 在过孔上形成金属镀层可以包括用牺牲填料填充通孔,以使得能够形成金属镀层,并随后通过蚀刻操作等去除牺牲填料。 在其他实施例中,在通孔之上形成金属镀层通过将金属层粘合到基板的第一侧上来实现。
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公开(公告)号:US20160113119A1
公开(公告)日:2016-04-21
申请号:US14515567
申请日:2014-10-16
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Bing Dang , Sung K. Kang , Yu Luo , Peter J. Sorce
CPC classification number: H05K3/0094 , C23C18/1603 , C23C18/1646 , C23C18/1653 , C23C18/1689 , C25D5/02 , C25D7/00 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/5384 , H05K3/388 , H05K3/424 , H05K2203/072 , H05K2203/0723 , H05K2203/308
Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.
Abstract translation: 用金属填充过孔的方法包括接收具有通孔的基板,在基板的第一侧上的通孔的上方形成金属镀层,用第一金属填充第一金属,第一金属从第一侧的金属镀层开始 衬底并且前进到衬底的第二侧以提供填充的通孔。 金属镀层可以随后被图案化以提供选择的电路连接或化学机械抛光以完全去除金属镀层。 在过孔上形成金属镀层可以包括用牺牲填料填充通孔,以使得能够形成金属镀层,并随后通过蚀刻操作等去除牺牲填料。 在其他实施例中,在通孔之上形成金属镀层通过将金属层粘合到基板的第一侧上来实现。
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公开(公告)号:US10424185B2
公开(公告)日:2019-09-24
申请号:US15816799
申请日:2017-11-17
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Michael S. Gordon , Nigel Hinds , Maja Vukovic
Abstract: A mobile electronic device such as a smartphone is used in conjunction with a deep learning system to detect and respond to personal danger. The deep learning system monitors current information (such as location, audio, biometrics, etc.) from the smartphone and generates a risk score by comparing the information to a routine profile for the user. If the risk score exceeds a predetermined threshold, an alert is sent to the smartphone which presents an alert screen to the user. The alert screen allows the user to cancel the alert (and notify the deep learning system) or confirm the alert (and immediately transmit an emergency message). Multiple emergency contacts can be designated, e.g., one for a low-level risk, another for an intermediate-level risk, and another for a high-level risk, and the emergency message can be sent to a selected contact depending upon the severity of the risk score.
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公开(公告)号:US10324994B2
公开(公告)日:2019-06-18
申请号:US15909389
申请日:2018-03-01
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Debra C. Leach , Debra A. Loussedes , Patrick R. Varekamp
IPC: G06F16/9535 , G06F16/2458 , G06F16/2455 , H04L29/08
Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.
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公开(公告)号:US20160219715A1
公开(公告)日:2016-07-28
申请号:US15090656
申请日:2016-04-05
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Bing Dang , Sung K. Kang , Yu Luo , Peter J. Sorce
IPC: H05K3/00
CPC classification number: H05K3/0094 , C23C18/1603 , C23C18/1646 , C23C18/1653 , C23C18/1689 , C25D5/02 , C25D7/00 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/5384 , H05K3/388 , H05K3/424 , H05K2203/072 , H05K2203/0723 , H05K2203/308
Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.
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公开(公告)号:US20160110430A1
公开(公告)日:2016-04-21
申请号:US14977771
申请日:2015-12-22
Applicant: International Business Machines Corporation
Inventor: Steven A. Cordes , Debra C. Leach , Debra A. Loussedes , Patrick R. Varekamp
IPC: G06F17/30
CPC classification number: G06F17/30867 , G06F17/3051 , G06F17/30545 , H04L67/10
Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.
Abstract translation: 解决从网络中的第一节点接收的查询包括由网络中的第二节点接受来自第一节点的查询的所有权,在第二节点处接收网络中的第三节点的标识,其中, 从第二节点的用户接收到识别,并且第二节点的用户认为第三节点的用户具有解析查询的至少一部分所需的信息,并且由第二节点转移至少一个 对第三节点的查询的一部分,其中接受,接收和传送动态地生成跟踪查询的传播的数据结构,并且数据结构可以由查询的原点访问。
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