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1.发明授权Dual input, dual output BAWR filtering apparatus including a ladder-bridge-ladder configuration 有权双输入双输出BAWR滤波装置，包括梯形梯形配置公开(公告)号：US08963654B2
公开(公告)日：2015-02-24
申请号：US12837630
申请日：2010-07-16
申请人： Yun Kwon Park , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin
发明人： Yun Kwon Park , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin
CPC分类号： H03H9/0095 , H03H9/0023 , H03H9/173 , H03H9/605
摘要： A Dual Input, Dual Output filtering apparatus using a Bulk Acoustic Wave Resonators (BAWR), and a resonator used as the BAWR may be provided. A Dual Input, Dual Output filtering apparatus may include a plurality of BAWRs connected in series and parallel.
摘要翻译： 可以提供使用体声波谐振器（BAWR）的双输入双输出滤波装置和用作BAWR的谐振器。 双输入双输出滤波装置可以包括串联和并联连接的多个BAWR。
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2.发明授权System for transmitting/receiving multi-band radio frequency signal using dual input, dual output filter 有权使用双输入，双输出滤波器发送/接收多频段射频信号的系统公开(公告)号：US08918063B2
公开(公告)日：2014-12-23
申请号：US12837557
申请日：2010-07-16
申请人： In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin
发明人： In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin
CPC分类号： H04B1/006 , H04B1/0053 , H04B1/52
摘要： A system for transmitting/receiving a multi-band Radio Frequency (RF) signal using a Dual Input, Dual Output filter is provided. The system may include a Single-Input Single-Output (SISO) filter and the Dual Input, Dual Output filter. The system for transmitting/receiving a multi-band Radio Frequency (RF) may be implemented in a Radio Frequency (RF) region, which includes an area from an end of an antenna to an end of a mixer in a mobile communication.
摘要翻译： 提供了一种使用双输入双输出滤波器发送/接收多频带射频（RF）信号的系统。 该系统可以包括单输入单输出（SISO）滤波器和双输入双输出滤波器。 用于发送/接收多频带射频（RF）的系统可以在射频（RF）区域中实现，射频（RF）区域包括在移动通信中从天线的末端到混合器的末端的区域。
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3.发明授权公开(公告)号：US08773220B2
公开(公告)日：2014-07-08
申请号：US12818249
申请日：2010-06-18
申请人： Chul Soo Kim , Jun Chul Kim , Dong Su Kim , In Sang Song , Duck Hwan Kim , Yun Kwon Park , Jea Shik Shin
发明人： Chul Soo Kim , Jun Chul Kim , Dong Su Kim , In Sang Song , Duck Hwan Kim , Yun Kwon Park , Jea Shik Shin
IPC分类号： H01P5/12
摘要： Disclosed are a radio frequency (RF) front end module and a multi-band communication module using the RF front end module. The RF front end module may use a plurality of bandpass filters and at least one diplexer being connected to at least one of front ends or rear ends of two bandpass filters of the plurality of bandpass filters.
摘要翻译： 公开了射频（RF）前端模块和使用RF前端模块的多频带通信模块。 RF前端模块可以使用多个带通滤波器，并且至少一个双工器连接到多个带通滤波器的两个带通滤波器的前端或后端中的至少一个。
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4.发明申请公开(公告)号：US20110279188A1
公开(公告)日：2011-11-17
申请号：US13105070
申请日：2011-05-11
申请人： Jea Shik Shin , Seong Chan Jun , Yun Kwon Park , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim
发明人： Jea Shik Shin , Seong Chan Jun , Yun Kwon Park , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim
CPC分类号： H03H9/2463 , B82Y30/00 , H03H2009/02322
摘要： A resonator and a method of manufacturing a resonator are provided. The resonator includes a sacrificial layer formed on a substrate, and a resonant structure formed on the sacrificial layer, the resonant structure comprising a carbon nano-substance layer and a silicon carbide layer.
摘要翻译： 提供了谐振器和制造谐振器的方法。 谐振器包括形成在衬底上的牺牲层和形成在牺牲层上的谐振结构，谐振结构包括碳纳米物质层和碳化硅层。
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公开(公告)号：US08660043B2
公开(公告)日：2014-02-25
申请号：US12903341
申请日：2010-10-13
申请人： Young Kim, II , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin , Yun Kwon Park
发明人： Young Kim, II , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin , Yun Kwon Park
IPC分类号： H04L5/00
CPC分类号： H04B1/0057
摘要： A communication apparatus to support multiband communication is provided. The communication apparatus may be applicable to, for example, a duplexer module for the multiband communication. The communication apparatus may be manufactured to be small and light by simplifying a circuit structure of the duplexer module.
摘要翻译： 提供了一种用于支持多频带通信的通信装置。 通信装置可以适用于例如用于多频带通信的双工器模块。 可以通过简化双工器模块的电路结构来将通信装置制造得小而轻。
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公开(公告)号：US08416037B2
公开(公告)日：2013-04-09
申请号：US12834130
申请日：2010-07-12
申请人： Jea Shik Shin , Dal Ahn , Duck Hwan Kim , In Sang Song , Chul Soo Kim , Yun Kwon Park , Hyung Rak Kim
发明人： Jea Shik Shin , Dal Ahn , Duck Hwan Kim , In Sang Song , Chul Soo Kim , Yun Kwon Park , Hyung Rak Kim
摘要： A phase shifter using a Bulk Acoustic Wave Resonators (BAWR) is provided. The phase shifter using a BAWR may use a property of a phase shift with respect to a frequency of the BAWR, and also use at least one capacitor, at least one inductor, and the like.
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7.发明授权公开(公告)号：US08378757B2
公开(公告)日：2013-02-19
申请号：US13105070
申请日：2011-05-11
申请人： Jea Shik Shin , Seong Chan Jun , Yun Kwon Park , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim
发明人： Jea Shik Shin , Seong Chan Jun , Yun Kwon Park , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim
CPC分类号： H03H9/2463 , B82Y30/00 , H03H2009/02322
摘要： A resonator and a method of manufacturing a resonator are provided. The resonator includes a sacrificial layer formed on a substrate, and a resonant structure formed on the sacrificial layer, the resonant structure comprising a carbon nano-substance layer and a silicon carbide layer.
摘要翻译： 提供了谐振器和制造谐振器的方法。 谐振器包括形成在衬底上的牺牲层和形成在牺牲层上的谐振结构，谐振结构包括碳纳米物质层和碳化硅层。
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8.发明申请RF LAYERED MODULE USING THREE DIMENSIONAL VERTICAL WIRING AND DISPOSING METHOD THEREOF 有权使用三维垂直接线的射频分层模块及其处理方法公开(公告)号：US20120063106A1
公开(公告)日：2012-03-15
申请号：US13217371
申请日：2011-08-25
申请人： Young Il KIM , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
发明人： Young Il KIM , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
CPC分类号： H01L23/66 , H01L23/13 , H01L23/5385 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6616 , H01L2224/16225 , H01L2224/48227 , H01L2225/0652 , H01L2225/06548 , H01L2225/06572 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , Y10T29/49165 , H01L2924/00
摘要： Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via- hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.
摘要翻译： 提供了一种使用三维（3D）垂直布线的射频（RF）分层模块的结构和布置方法。 具有3D垂直布线的RF分层模块中的第一晶片可以包括第一RF器件和至少一个第一通孔。 第二晶片可以包括第二RF器件和设置在对应于至少一个第一通孔的位置处的至少一个第二通孔。 垂直布线可以连接至少一个第一通孔和至少一个第二通孔。 垂直布线可以被配置为通过至少一个第一通孔的底表面或至少一个第二通孔的顶表面连接到外部装置。
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9.发明授权Balun comprising two conversion circuits each constituted by first to third FBARs 有权平衡/不平衡变换器包括由第一至第三FBAR构成的两个转换电路公开(公告)号：US08854157B2
公开(公告)日：2014-10-07
申请号：US12834099
申请日：2010-07-12
申请人： Duck Hwan Kim , Dal Ahn , Chul Soo Kim , In Sang Song , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim
发明人： Duck Hwan Kim , Dal Ahn , Chul Soo Kim , In Sang Song , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim
IPC分类号： H03H9/00
CPC分类号： H03H9/0095
摘要： Disclosed is a balun including a film bulk acoustic resonator (FBAR). The balun may be implemented using the FBAR to fabricate a small sized balun. Also, the balun may be implemented using the FBAR, thereby reducing a difference in two outputs.
摘要翻译： 公开了一种包括膜体声波谐振器（FBAR）的平衡 - 不平衡转换器。 平衡不平衡变压器可以使用FBAR来实现，以制造小尺寸的平衡 - 不平衡转换器。 此外，平衡 - 不平衡变换器可以使用FBAR实现，从而减少两个输出的差异。
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10.发明授权RF layered module using three dimensional vertical wiring and disposing method thereof 有权RF分层模块采用三维垂直布线及其布置方法公开(公告)号：US08824163B2
公开(公告)日：2014-09-02
申请号：US13217371
申请日：2011-08-25
申请人： Young Il Kim , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
发明人： Young Il Kim , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
IPC分类号： H05K1/18 , H01L25/065 , H01L25/16 , H01L23/66 , H01L23/13 , H01L23/538
CPC分类号： H01L23/66 , H01L23/13 , H01L23/5385 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6616 , H01L2224/16225 , H01L2224/48227 , H01L2225/0652 , H01L2225/06548 , H01L2225/06572 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , Y10T29/49165 , H01L2924/00
摘要： Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.
摘要翻译： 提供了一种使用三维（3D）垂直布线的射频（RF）分层模块的结构和布置方法。 具有3D垂直布线的RF分层模块中的第一晶片可以包括第一RF器件和至少一个第一通孔。 第二晶片可以包括第二RF器件和设置在对应于至少一个第一通孔的位置处的至少一个第二通孔。 垂直布线可以连接至少一个第一通孔和至少一个第二通孔。 垂直布线可以被配置为通过至少一个第一通孔的底表面或至少一个第二通孔的顶表面连接到外部装置。
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