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公开(公告)号:US10348304B2
公开(公告)日:2019-07-09
申请号:US15714446
申请日:2017-09-25
Applicant: Infineon Technologies AG
Inventor: Igor Ullmann , Andreas Kalt , Franz Wachter
IPC: H03K19/003 , H03K19/0185 , H03K19/00 , H03K3/356 , H03K19/0175
Abstract: High-voltage level-shifter architectures that provide galvanic coupling between low/high-voltage domains while simultaneously enabling high speed operation, low static current consumption and high reliability under a myriad of environmental circumstances including electromagnetic interference as well as process, voltage and temperature variations.
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公开(公告)号:US20180210027A1
公开(公告)日:2018-07-26
申请号:US15867266
申请日:2018-01-10
Applicant: Infineon Technologies AG
Inventor: Andreas Kalt
CPC classification number: G01R31/2607 , G01R31/2601 , G01R31/2884 , G05F1/59 , H01L22/34
Abstract: Methods and devices are provided. A device may comprise a main current path (11) between a terminal (10) and a supply voltage rail (15). Furthermore, an auxiliary current path (12) coupled to associated measurement circuitry to output a test measurement result (res) is provided.
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公开(公告)号:US10079610B2
公开(公告)日:2018-09-18
申请号:US15742435
申请日:2016-07-05
Applicant: Infineon Technologies AG
Inventor: Peter Bogner , Andreas Kalt , Jaafar Mejri , Martin Pernull
CPC classification number: H03M1/1071 , H03M1/109 , H03M1/12 , H03M1/468 , H03M1/804
Abstract: Representative implementations of devices and techniques provide a built-in self-test (BIST) for an analog-to-digital converter (ADC). Stimuli needed to test an ADC are generated within the chip containing the ADC. Evaluation circuitry is also available on-chip. Generation and evaluation circuits and systems are based on existing circuits and/or components of the chip.
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公开(公告)号:US20170118012A1
公开(公告)日:2017-04-27
申请号:US15296940
申请日:2016-10-18
Applicant: Infineon Technologies AG
Inventor: Martin Pernull , Andreas Kalt , Gerhard Pichler , Franz Wachter , Bernhard Wotruba
IPC: H04L9/06
CPC classification number: H04L9/0662 , H04L2209/08
Abstract: Devices for sampling a plurality of input signals are provided, wherein a sampling device is controlled to sample the input signals in a random order with additional delays. Other embodiments relate to voltage monitoring systems and corresponding methods.
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公开(公告)号:US10411883B2
公开(公告)日:2019-09-10
申请号:US15296940
申请日:2016-10-18
Applicant: Infineon Technologies AG
Inventor: Martin Pernull , Andreas Kalt , Gerhard Pichler , Franz Wachter , Bernhard Wotruba
Abstract: Devices for sampling a plurality of input signals are provided, wherein a sampling device is controlled to sample the input signals in a random order with additional delays. Other embodiments relate to voltage monitoring systems and corresponding methods.
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公开(公告)号:US20190097633A1
公开(公告)日:2019-03-28
申请号:US15714446
申请日:2017-09-25
Applicant: Infineon Technologies AG
Inventor: Igor Ullmann , Andreas Kalt , Franz Wachter
IPC: H03K19/003 , H03K19/0185 , H03K3/356 , H03K19/00
CPC classification number: H03K19/00384 , H03K3/356104 , H03K3/35613 , H03K3/356182 , H03K19/0013 , H03K19/00315 , H03K19/0175 , H03K19/018521
Abstract: High-voltage level-shifter architectures that provide galvanic coupling between low/high-voltage domains while simultaneously enabling high speed operation, low static current consumption and high reliability under a myriad of environmental circumstances including electromagnetic interference as well as process, voltage and temperature variations.
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公开(公告)号:US20180198460A1
公开(公告)日:2018-07-12
申请号:US15742435
申请日:2016-07-05
Applicant: Infineon Technologies AG
Inventor: Peter Bogner , Andreas Kalt , Jaafar Mejri , Martin Pernull
IPC: H03M1/10
CPC classification number: H03M1/1071 , H03M1/109 , H03M1/12 , H03M1/468 , H03M1/804
Abstract: Representative implementations of devices and techniques provide a built-in self-test (BIST) for an analog-to-digital converter (ADC). Stimuli needed to test an ADC are generated within the chip containing the ADC. Evaluation circuitry is also available on-chip. Generation and evaluation circuits and systems are based on existing circuits and/or components of the chip.
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