公开(公告)号：US20150333034A1

公开(公告)日：2015-11-19

申请号：US14708964

申请日：2015-05-11

Applicant: Infineon Technologies AG

Inventor： Daniel Bolowski ,  Achim Froemelt ,  Christian Kersting ,  Christian Stahlhut

IPC: H01L23/00 ,  B23K1/20 ,  B23K1/00

CPC classification number: B22F1/0074 ,  B23K1/0016 ,  B23K1/203 ,  H01L21/00 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29026 ,  H01L2224/32225 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/83359 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method includes providing a subassembly having a circuit carrier with a first metallic surface portion, a first joining partner, which is integrally connected to the first metallic surface portion by means of a first connecting layer, and a second metallic surface portion. In a heat treatment, the second metallic surface portion is held uninterruptedly at temperatures which are higher than a minimum heat-treatment temperature of at least 300° C. Moreover, a second joining partner is provided. A fixed connection is produced between the second joining partner and the subassembly in that the second joining partner is integrally connected to the subassembly following completion of the heat treatment on the second surface portion.

Abstract translation: 一种方法包括提供具有第一金属表面部分的电路载体的子组件，通过第一连接层与第一金属表面部分一体地连接的第一接合配合体和第二金属表面部分。 在热处理中，第二金属表面部分在高于至少300℃的最小热处理温度的温度下不间断地保持。此外，提供第二接合对象。 在第二接合伙伴和子组件之间产生固定连接，因为在第二表面部分上的热处理完成之后，第二接合伙伴一体地连接到子组件。

公开(公告)号：US09925588B2

公开(公告)日：2018-03-27

申请号：US14708964

申请日：2015-05-11

Applicant: Infineon Technologies AG

Inventor： Daniel Bolowski ,  Achim Froemelt ,  Christian Kersting ,  Christian Stahlhut

IPC: B23K1/00 ,  B23K1/20 ,  H01L23/00 ,  B22F1/00 ,  H01L21/00

CPC classification number: B22F1/0074 ,  B23K1/0016 ,  B23K1/203 ,  H01L21/00 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29026 ,  H01L2224/32225 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/83359 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method includes providing a subassembly having a circuit carrier with a first metallic surface portion, a first joining partner, which is integrally connected to the first metallic surface portion by means of a first connecting layer, and a second metallic surface portion. In a heat treatment, the second metallic surface portion is held uninterruptedly at temperatures which are higher than a minimum heat-treatment temperature of at least 300° C. Moreover, a second joining partner is provided. A fixed connection is produced between the second joining partner and the subassembly in that the second joining partner is integrally connected to the subassembly following completion of the heat treatment on the second surface portion.