Abstract:
A fin field effect transistor having a substrate, a fin structure above the substrate, as well as a drain region and a source region outside the fin structure above the substrate. The fin structure serves as a channel between the source region and the drain region. The source and drain regions are formed once the gate has been produced.
Abstract:
Method for fabricating a semiconductor memory element arrangement. A layer system, including a floating gate and a tunnel barrier arrangement formed on the floating gate, is formed on an electrically insulating layer. A first trench structure is formed in the layer system, and the first trench structure has first parallel trenches extending as far as the insulating layer. A second trench structure is formed in the layer system, and has second parallel trenches arranged perpendicular to the first trenches and extending as far as the insulating layer. First and second gate electrodes are formed in the first and second trench structures. The first gate electrode is adjacent to the floating gate through which first gate electrode electrical charge can be fed or can be dissipated from. The second gate electrode is adjacent to the tunnel barrier arrangement, and can control an electrical charge transmission of the tunnel barrier arrangement.
Abstract:
A DRAM memory cell is provided with a selection transistor, which is arranged horizontally at a semiconductor substrate surface and has a first source/drain electrode, a second source/drain electrode, a channel layer arranged between the first and the second source/drain electrode in the semiconductor substrate, and a gate electrode, which is arranged along the channel layer and is electrically insulated from the channel layer, a storage capacitor, which has a first capacitor electrode and a second capacitor electrode, insulated from the first capacitor electrode, one of the capacitor electrodes of the storage capacitor being electrically conductively connected to one of the source/drain electrodes of the selection transistor, and a semiconductor substrate electrode on the rear side, the gate electrode enclosing the channel layer at at least two opposite sides.
Abstract:
The present invention relates to a biochip for capacitive stimulation and/or detection of biological tissue. The biochip includes a support structure, at least one stimulation and/or sensor device, which is arranged in or on the support structure, and at least one dielectric layer, one layer surface of which is arranged on the stimulation and/or sensor device and the opposite layer surface forms a stimulation and/or sensor surface for the capacitive stimulation and/or detection of biological tissue. The dielectric layer includes (Tix, Zr1-x)O2, with 0.99nullxnull0.5, or a TiO2 and ZrO2 layer arrangement.
Abstract:
Fluorescence biosensor chip having a substrate, at least one electromagnetic radiation detection device arranged in or on the substrate, an optical filter layer arranged on the substrate, and an immobilization layer, which is arranged on the optical filter layer and immobilizes capture molecules. The electromagnetic radiation detection device, the optical filter layer, and the immobilization layer are integrated in the fluorescence biosensor chip.
Abstract:
A method for detecting macromolecular biopolymers using a macromolecular biopolymer immobilizing unit integrated in or mounted on a substrate. The macromolecular biopolymer immobilizing unit is provided with capture molecules that bind macromolecular biopolymers. A sample is brought into contact with the macromolecular biopolymer immobilizing unit, and the sample contains the macromolecular biopolymers to be detected and bound to the capture molecules. Any capture molecules to which no macromolecular biopolymers have bound are removed, and then generation of a chemiluminescence signal is induced using a label located on the capture molecules. The chemiluminescence signal is detected using a detection unit, which is an integrated circuit in the substrate, resulting in the macromolecular biopolymers being detected.
Abstract:
A memory cell having a source region, a drain region, a source-end control gate, a drain-end control gate, an injection gate arranged between the source-end control gate and the drain-end control gate, a source-end storage element arranged in the source-end control gate, and a drain-end storage element arranged in the drain-end control gate. To program the memory cell, a low electrical voltage is applied to the injection gate, and a high electrical voltage is applied to the control gates.
Abstract:
A memory layer intended for trapping charge carriers over a source region and a drain region is interrupted over the channel so that a diffusion of the charge carriers, which are trapped over the source region and over the drain region, is prevented. The memory layer is limited to regions over the parts of the source region and of the drain region facing the channel and is embedded all around in oxide.