公开(公告)号：US20230335516A1

公开(公告)日：2023-10-19

申请号：US18125252

申请日：2023-03-23

Applicant: Infineon Technologies AG

Inventor： Chee Yang NG ,  Chew Yeek LAU ,  Swee Kah LEE ,  Joseph Victor SOOSAI PRAKASAM ,  Hui Khin TAN

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L24/03 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/11 ,  H01L21/56 ,  H01L23/49838 ,  H01L24/13 ,  H01L2924/141 ,  H01L2224/16225 ,  H01L2924/182

Abstract: A method of manufacturing a package is disclosed. In one example, the method comprises applying a metallic connection structure, which comprises a solder or sinter material, on a sacrificial carrier. An electronic component is mounted on the metallic connection structure. At least part of the electronic component and of the metallic connection structure is encapsulated. Thereafter, the sacrificial carrier is removed to thereby expose at least part of the metallic connection structure.

公开(公告)号：US20240274563A1

公开(公告)日：2024-08-15

申请号：US18415880

申请日：2024-01-18

Applicant: Infineon Technologies AG

Inventor： Hock Heng CHONG ,  Hui Khin TAN ,  Chee Yang NG ,  Swee Kah LEE

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L24/40 ,  H01L24/81 ,  H01L24/84 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13686 ,  H01L2224/16227 ,  H01L2224/40227 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/81815 ,  H01L2224/84815 ,  H01L2924/014 ,  H01L2924/0536 ,  H01L2924/0541 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108

Abstract: A solder structure and method is disclosed. In one example, the solder structure includes a solder material, and a coating which at least partially coats the solder material and is configured for protecting the solder material against solder spreading. The coating is at least partially disrupted when establishing a solder connection between the solder material and a solderable structure.