-
公开(公告)号：US11676933B2
公开(公告)日：2023-06-13
申请号：US16806844
申请日：2020-03-02
Applicant: Infineon Technologies AG
Inventor： Steffen Hartmann , Roland Speckels
IPC: H01L23/00
CPC classification number: H01L24/75 , H01L24/83 , H01L24/32 , H01L2224/32225 , H01L2224/7555 , H01L2224/7565 , H01L2224/75252 , H01L2224/75301 , H01L2224/75821 , H01L2224/83053 , H01L2224/8384 , H01L2224/83203
Abstract: An arrangement for joining two joining members includes a first part having a support surface, a first carrier element configured to carry at least one foil, a transportation unit configured to arrange the first carrier element such that the foil is arranged above the support surface in a vertical direction, and a second part configured to exert pressure to a joining stack, when the joining stack is arranged on the support surface. The joining stack includes a first joining member arranged on the support surface, a second joining member, and an electrically conductive connection layer arranged between the joining members. When pressure is exerted on the joining stack, the foil is arranged between the second part and the joining stack and is pressed onto the joining stack and the joining stack is pressed onto the first part, compressing the connection layer and forming a bond between the joining members.
-
Patent Agency Ranking
公开(公告)号：US11081464B2
公开(公告)日：2021-08-03
申请号：US15166855
申请日：2016-05-27
Applicant: Infineon Technologies AG
Inventor： Nicolas Heuck , Marco Marchitto , Roland Speckels
Abstract: A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.
-
3.发明申请Method for Producing a Connecting Medium on an Assembly Partner, Method for Producing a Material-Fit Connection Between an Assembly Partner and a Metal Layer, and a System for Carrying out the Methods 审中-公开在组装伙伴上生产连接介质的方法，在组装合作伙伴和金属层之间生产材料适配连接的方法以及执行方法的系统公开(公告)号：US20160225735A1
公开(公告)日：2016-08-04
申请号：US15010727
申请日：2016-01-29
Applicant: Infineon Technologies AG
Inventor： Nicolas Heuck , Marco Marchitto , Roland Speckels
CPC classification number: H01L24/27 , B23K1/0016 , B23K1/018 , B23K35/0244 , B23K35/025 , B23K35/3006 , H01L23/3735 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/83 , H01L2224/27332 , H01L2224/27442 , H01L2224/27831 , H01L2224/27848 , H01L2224/29294 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/29373 , H01L2224/32225 , H01L2224/32245 , H01L2224/743 , H01L2224/75252 , H01L2224/75315 , H01L2224/75343 , H01L2224/75745 , H01L2224/83191 , H01L2224/83207 , H01L2224/8384 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A method for producing a layer including a connecting medium on an assembly partner is provided. The method incudes providing a carrier on which the connecting medium is applied. The connecting medium contains a metal in the form of a multiplicity of metal particles. The assembly partner is placed on the connecting medium located on the carrier and pressed onto the connecting medium located on the carrier, so that a layer of the connecting medium adheres to the assembly partner. The assembly partner together with the layer adhering thereto is removed from the carrier. By means of a gas flow, edges of the layer, at which the latter extends laterally beyond the assembly partner, are removed so that a layer residue of the layer remains adhering to the assembly partner.
Abstract translation: 提供了一种在组装伙伴上制造包括连接介质的层的方法。 该方法包括提供其上施加有连接介质的载体。 连接介质包含多种金属颗粒形式的金属。 组装伙伴放置在位于载体上的连接介质上，并被压在位于载体上的连接介质上，使得连接介质层粘附到组装伙伴上。 组装伙伴与粘附在其上的层一起从载体上去除。 通过气流，去除了侧壁延伸超过组件配合体的层的边缘，使得该层的层残余物保持粘附到组件配合体上。
-
4.发明申请公开(公告)号：US20240413046A1
公开(公告)日：2024-12-12
申请号：US18732818
申请日：2024-06-04
Applicant: Infineon Technologies AG
Inventor： Frank Sauerland , Roland Speckels , Markus Fink
IPC: H01L23/373 , H01L21/48 , H01L21/56 , H01L23/31
Abstract: A semiconductor module includes: a power electronic substrate having a first conductive layer, a second conductive layer, and an insulating layer separating the first and second conductive layers; at least one semiconductor die arranged over the first conductive layer; and a molded body having a first side and an opposite second side. The molded body encapsulates the semiconductor die and partially encapsulates the power electronic substrate such that the second conductive layer is at least partially exposed from the second side of the molded body. The insulating layer protrudes beyond a contour of the first conductive layer and/or beyond a contour of the second conductive layer at lateral sides of the power electronic substrate by a nonzero protrusion. A ratio of a thickness of the insulating layer to a length of the protrusion is 0.8 or more.
-
5.发明申请公开(公告)号：US20160351533A1
公开(公告)日：2016-12-01
申请号：US15166855
申请日：2016-05-27
Applicant: Infineon Technologies AG
Inventor： Nicolas Heuck , Marco Marchitto , Roland Speckels
Abstract: A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.
Abstract translation: 通过自动粉末载体进料提供施加含有金属粉末的粉末层的粉末载体。 将第一接合对象压在位于粉末载体上的粉末层上，以将粉末层部分粘合到第一接合配对体。 第一接合对象与粉末载体一起与粘合到第一接合配对体的粉末层部分一起升高，并且粘合到第一接合配对体的粉末层部分布置在第一和第二接合配合体之间。 通过将第一和第二接合构件相互压靠在第一和第二接合构件之间来制造烧结接头，使得粉末层部分与第一和第二接合构件接触。 当接合体彼此压紧时，粉末层部分被烧结。
-
公开(公告)号：US20200294956A1
公开(公告)日：2020-09-17
申请号：US16806844
申请日：2020-03-02
Applicant: Infineon Technologies AG
Inventor： Steffen Hartmann , Roland Speckels
IPC: H01L23/00
Abstract: An arrangement for joining two joining members includes a first part having a support surface, a first carrier element configured to carry at least one foil, a transportation unit configured to arrange the first carrier element such that the foil is arranged above the support surface in a vertical direction, and a second part configured to exert pressure to a joining stack, when the joining stack is arranged on the support surface. The joining stack includes a first joining member arranged on the support surface, a second joining member, and an electrically conductive connection layer arranged between the joining members. When pressure is exerted to the joining stack, the foil is arranged between the second part and the joining stack and is pressed onto the joining stack and the joining stack is pressed onto the first part, compressing the connection layer and forming a substance-to-substance bond between the joining members.
-
-
-
-
-
Search Results
6
records
(took 0.009 seconds)
