公开(公告)号：US11387081B2

公开(公告)日：2022-07-12

申请号：US16798445

申请日：2020-02-24

Applicant: Infineon Technologies AG

Inventor： Rudolf Kogler ,  Juergen Steinbrenner ,  Wolfgang Dastel ,  Harald Huetter ,  Markus Kahn

IPC: H01J37/32 ,  H01L21/687 ,  C23C16/50 ,  C23C16/503 ,  C23C16/505 ,  H01L21/67 ,  C23C16/458

Abstract: According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.

公开(公告)号：US20180211821A1

公开(公告)日：2018-07-26

申请号：US15412131

申请日：2017-01-23

Applicant: Infineon Technologies AG

Inventor： Rudolf Kogler ,  Juergen Steinbrenner ,  Wolfgang Dastel ,  Harald Huetter ,  Markus Kahn

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/67 ,  C23C16/458 ,  C23C16/503 ,  C23C16/505

CPC classification number: H01J37/32715 ,  C23C16/4583 ,  C23C16/4585 ,  C23C16/4586 ,  C23C16/50 ,  C23C16/503 ,  C23C16/505 ,  H01J37/32027 ,  H01J37/32082 ,  H01J37/32697 ,  H01J2237/3321 ,  H01J2237/334 ,  H01J2237/335 ,  H01J2237/338 ,  H01L21/67034 ,  H01L21/67069 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785

Abstract: According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.