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1.发明申请公开(公告)号：US20190162854A1
公开(公告)日：2019-05-30
申请号：US16204149
申请日：2018-11-29
发明人： Hannes Plank , Norbert Druml , Theresa Egger , Thomas Herndl , Christoph Steffan
摘要： An apparatus for localizing a first device includes a time of flight circuit configured to emit a first modulated light signal and receive a reflection of the first modulated light signal from the first device. The apparatus further includes a processing circuit configured to determine, based on the first modulated light signal and the reflection, a position of the first device in a first coordinate system associated with the apparatus. The processing circuit is further configured to determine, based on the position of the first device in the first coordinate system, a position of the apparatus in a second coordinate system and an orientation of the apparatus in the second coordinate system. The apparatus further includes a transmit circuit configured to emit a second modulated signal to the first device, wherein the second modulated signal includes data indicating the position of the first device in the second coordinate system.
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2.发明授权Chip arrangement, analysis apparatus, receiving container, and receiving container system 有权芯片布置，分析装置，接收容器和接收容器系统公开(公告)号：US09171245B2
公开(公告)日：2015-10-27
申请号：US14468372
申请日：2014-08-26
发明人： Gerald Holweg , Thomas Herndl , Guenter Hofer , Walther Pachler
IPC分类号： G06K19/06 , G06K19/077 , G01N33/00
CPC分类号： G06K19/07794 , G01N33/00 , G06K19/07775 , G06K19/07779
摘要： In various embodiments, a chip arrangement includes a first chip having a first antenna which is monolithically integrated in the first chip and is intended to communicate with at least one of an external reader or an external writer; a second chip having a second antenna which is monolithically integrated in the second chip and is intended to communicate with the at least one of the external reader or the external writer; and a booster antenna which is coupled to the first antenna in a first coupling area in order to increase a range of the first antenna and is coupled to the second antenna in a second coupling area in order to increase a range of the second antenna.
摘要翻译： 在各种实施例中，芯片布置包括具有第一天线的第一芯片，该第一天线单片集成在第一芯片中并且旨在与外部读取器或外部写入器中的至少一个通信; 具有第二天线的第二芯片，该第二天线单片地集成在第二芯片中并且旨在与外部读取器或外部写入器中的至少一个通信; 以及增强天线，其在第一耦合区域中耦合到第一天线，以便增加第一天线的范围，并且在第二耦合区域耦合到第二天线，以便增加第二天线的范围。
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公开(公告)号：US20160135684A1
公开(公告)日：2016-05-19
申请号：US14938416
申请日：2015-11-11
发明人： Robert Kappel , Thomas Herndl , Gerald Holweg , Walther Pachler
IPC分类号： A61B5/00 , H01L35/32 , A61B5/01 , A61B5/0205 , A61B5/021 , A61B5/0402 , A61B5/0476 , A61B5/145 , H01Q1/27 , A61B5/024
CPC分类号： A61B5/0015 , A61B5/02055 , A61B5/021 , A61B5/024 , A61B5/0476 , A61B5/14532 , A61B5/14546 , A61B2560/0214 , A61B2560/0219 , H01L35/32 , H01Q1/2208 , H01Q1/273 , H01Q7/00
摘要： A functional skin patch having a first surface and a second surface opposite the first surface is provided. The functional skin patch includes a functional unit having a thermo harvester and an antenna unit. The thermo harvester has a first terminal thermally connected to the first surface and a second terminal. The antenna unit has a first terminal thermally connected to the second terminal of the thermo harvester and a second terminal thermally connected to the second surface. The antenna unit has a stacked layer structure including, in this sequence, a metal layer thermally connected to the second terminal of the thermo harvester, a ferrite layer thermally connected to the metal layer, and an antenna layer thermally connected to the ferrite layer.
摘要翻译： 提供具有第一表面和与第一表面相对的第二表面的功能性皮肤贴剂。 功能性皮肤贴片包括具有热收获器和天线单元的功能单元。 热收获器具有热连接到第一表面的第一端子和第二端子。 天线单元具有热连接到热收集器的第二端子的第一端子和与第二表面热连接的第二端子。 天线单元具有堆叠层结构，其中依次包括与热收集器的第二端子热连接的金属层，与金属层热连接的铁氧体层，以及与该铁氧体层热连接的天线层。
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公开(公告)号：US20140339313A1
公开(公告)日：2014-11-20
申请号：US13896676
申请日：2013-05-17
IPC分类号： G06K19/07 , G06K19/073
CPC分类号： G06K19/07758 , G06K19/0704 , G06K19/0705 , G06K19/0717 , G06K19/0723 , G06K19/073
摘要： A semiconductor device includes a semiconductor substrate, a battery attached to the semiconductor substrate, and a sensor attached to the semiconductor substrate. The battery is electrically connected to the sensor and configured to supply the sensor with electrical power.
摘要翻译： 半导体器件包括半导体衬底，附接到半导体衬底的电池和附接到半导体衬底的传感器。 电池电连接到传感器并且被配置为向传感器提供电力。
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公开(公告)号：US11346947B2
公开(公告)日：2022-05-31
申请号：US16204149
申请日：2018-11-29
发明人： Hannes Plank , Norbert Druml , Theresa Egger , Thomas Herndl , Christoph Steffan
摘要： An apparatus for localizing a first device includes a time of flight circuit configured to emit a first modulated light signal and receive a reflection of the first modulated light signal from the first device. The apparatus further includes a processing circuit configured to determine, based on the first modulated light signal and the reflection, a position of the first device in a first coordinate system associated with the apparatus. The processing circuit is further configured to determine, based on the position of the first device in the first coordinate system, a position of the apparatus in a second coordinate system and an orientation of the apparatus in the second coordinate system. The apparatus further includes a transmit circuit configured to emit a second modulated signal to the first device, wherein the second modulated signal includes data indicating the position of the first device in the second coordinate system.
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公开(公告)号：US09943228B2
公开(公告)日：2018-04-17
申请号：US14938416
申请日：2015-11-11
发明人： Robert Kappel , Thomas Herndl , Gerald Holweg , Walther Pachler
IPC分类号： H01Q1/27 , A61B5/00 , H01L35/32 , A61B5/0205 , H01Q1/22 , H01Q7/00 , A61B5/01 , A61B5/024 , A61B5/021 , A61B5/0476 , A61B5/145
CPC分类号： A61B5/0015 , A61B5/02055 , A61B5/021 , A61B5/024 , A61B5/0476 , A61B5/14532 , A61B5/14546 , A61B2560/0214 , A61B2560/0219 , H01L35/32 , H01Q1/2208 , H01Q1/273 , H01Q7/00
摘要： A functional skin patch having a first surface and a second surface opposite the first surface is provided. The functional skin patch includes a functional unit having a thermo harvester and an antenna unit. The thermo harvester has a first terminal thermally connected to the first surface and a second terminal. The antenna unit has a first terminal thermally connected to the second terminal of the thermo harvester and a second terminal thermally connected to the second surface. The antenna unit has a stacked layer structure including, in this sequence, a metal layer thermally connected to the second terminal of the thermo harvester, a ferrite layer thermally connected to the metal layer, and an antenna layer thermally connected to the ferrite layer.
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公开(公告)号：US09838086B2
公开(公告)日：2017-12-05
申请号：US15287767
申请日：2016-10-07
发明人： Wolfgang Dettmann , Nicolas Falleau , Florian Grimminger , Thomas Herndl , Gerald Holweg , Rainer Matischek , Herbert Roedig
CPC分类号： H04B5/0037 , H04B1/3888 , H04B5/0025 , H04B5/0031 , H04L63/0428 , H04L63/0492 , H04L63/08 , H04L63/0876 , H04W4/70 , H04W4/80 , H04W12/06
摘要： A communication arrangement may include a communication device, which may include an application processor, a mobile radio circuit, and a near-field communication (NFC) circuit configured according to an NFC technology for transmission of data and energy for operating a circuit external to the communication device. The arrangement may include a flexible carrier mounted detachably on the communication device. The carrier may include a radio circuit, an NFC circuit configured according to an NFC technology, a circuit coupled to the NFC circuit and the radio circuit, which is configured to be operated with energy which is received by means of the NFC circuit according to the NFC technology, the circuit configured for converting data coded in accordance with the NFC technology into data coded in accordance with the radio technology, or for converting data coded in accordance with the radio technology into data coded in accordance with the NFC technology.
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公开(公告)号：US20170091610A1
公开(公告)日：2017-03-30
申请号：US15344191
申请日：2016-11-04
IPC分类号： G06K19/077 , G06K19/07 , G06K19/073
CPC分类号： G06K19/07758 , G06K19/0704 , G06K19/0705 , G06K19/0717 , G06K19/0723 , G06K19/073
摘要： A semiconductor device includes a semiconductor substrate having an upper first main face and first and second recess areas formed in the upper first main face, a battery arranged at the first recess area and one or more of a shock sensor and an acceleration sensor arranged at the second recess area. The shock sensor or the acceleration sensor includes a movable mass, a cantilever connected to the moveable mass, a piezoelectric layer applied to the cantilever, and a wiring connected to the piezoelectric layer. The wiring has first and second terminals. The moveable mass and part of the cantilever are arranged above the second recess area, so that the shock sensor or the acceleration sensor delivers a voltage between the first and second terminals, a strength of the voltage being dependent on a strength of a shock or acceleration exerted on the semiconductor device.
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公开(公告)号：US20220283306A1
公开(公告)日：2022-09-08
申请号：US17825245
申请日：2022-05-26
发明人： Hannes Plank , Norbert Druml , Theresa Egger , Thomas Herndl , Christoph Steffan
摘要： A localization apparatus includes: a time-of-flight circuit configured to emit a first modulated light signal and to receive reflections of the first modulated light signal from at least three devices; a processing circuit configured to determine, based on the first modulated light signal and the reflections, positions of the at least three devices in a first coordinate system associated with the apparatus; and a receive circuit configured to receive second modulated signals from the at least three devices, the second modulated signals including data indicating positions of the at least three devices in a second coordinate system. The processing circuit is further configured to determine a position and orientation of the apparatus in the second coordinate system based on the positions of the at least three devices in the first coordinate system and the data indicating the positions of the at least three devices in the second coordinate system.
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公开(公告)号：US09886660B2
公开(公告)日：2018-02-06
申请号：US15344191
申请日：2016-11-04
IPC分类号： G06K19/06 , G06K19/077 , G06K19/073 , G06K19/07
CPC分类号： G06K19/07758 , G06K19/0704 , G06K19/0705 , G06K19/0717 , G06K19/0723 , G06K19/073
摘要： A semiconductor device includes a semiconductor substrate having an upper first main face and first and second recess areas formed in the upper first main face, a battery arranged at the first recess area and one or more of a shock sensor and an acceleration sensor arranged at the second recess area. The shock sensor or the acceleration sensor includes a movable mass, a cantilever connected to the moveable mass, a piezoelectric layer applied to the cantilever, and a wiring connected to the piezoelectric layer. The wiring has first and second terminals. The moveable mass and part of the cantilever are arranged above the second recess area, so that the shock sensor or the acceleration sensor delivers a voltage between the first and second terminals, a strength of the voltage being dependent on a strength of a shock or acceleration exerted on the semiconductor device.
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